Hybrid integrated circuit device

Abstract

A pedestal 11 is attached to a circuit substrate 1 having a component placement area 4 when clamping portions 12 and 12 of the pedestal 11 clamp both side portions 5 and 5 of the component placement area 4. It is possible to stand the hybrid integrated circuit device on a parent circuit substrate a by itself before the hybrid integrated circuit device is soldered to the parent circuit substrate a. Since the bottom surfaces of the clamping portions 12 and 12 are flat. The circuit substrates 1, 1, . . . do not overlap one another when the hybrid integrated circuit devices are accommodated in and arranged vertically in a stick since the thickness of the clamping portions 12 and 12 of the pedestal 11 is thicker than the circuit substrate 1. Accordingly, the hybrid integrated circuit device is liable to vertically stand on the parent circuit substrate a by itself and it is easily accommodated in and taken out from the stick.

What is claimed is: 
     
       1. A hybrid integrated circuit device comprising a circuit substrate on which a wiring pattern is formed, circuit components which are placed on a component area of the circuit substrate and lead terminals which protrude from one side of the circuit substrate, said hybrid integrated circuit device further comprising; a pedestal which is provided at the side where the lead terminals protrude from the circuit substrate, said pedestal comprising a pair of thick clamping portions for clamping both end portions of said substrate outside the component placement area of said circuit substrate, a pair of connecting portions for connecting the clamping portions and having through holes which are defined between the clamping portions and the connecting portions for inserting the lead terminals wherein the bottom surfaces of the clamping portions are fiat.   
     
     
       2. A hybrid integrated circuit device according to claim 1, wherein said clamping portions of the pedestal have protrusions at inner wall surfaces thereof and the side surface of the circuit substrate have positioning holes so that the protrusions engage into the positioning holes. 
     
     
       3. A hybrid integrated circuit device according to claim 1, wherein the pedestal has a reinforcing portion at the middle portion of the through holes, said reinforcing portion being integrated with the connecting portion so as to bridge over the connecting portions. 
     
     
       4. A hybrid integrated circuit device according to claim 1, wherein the bottom surfaces of the clamping portions of said pedestal are lower than the bottom surfaces of the connecting portions. 
     
     
       5. A hybrid integrated circuit device according to claim 4, wherein said clamping portions of the pedestal have protrusions at inner wall surfaces thereof and the side surface of the circuit substrate have positioning holes so that the protrusions engage into the positioning holes. 
     
     
       6. A hybrid integrated circuit device according to claim 4, wherein the pedestal has a reinforcing portion at the middle portion of the through holes, said reinforcing portion being integrated with the connecting portion so as to bridge over the connecting portions. 
     
     
       7. An apparatus, comprising: a circuit substrate having a wiring pattern thereon, having electrical components mounted thereon and electrically coupled to said wiring pattern, and having a plurality of elongate and electrically conductive lead terminals which are mounted on and project outwardly from said substrate and which are electrically coupled to said wiring pattern; and a pedestal which is physically separate from and detachably coupled to said substrate, said pedestal having on a first side thereof clamping means for gripping said substrate to detachably couple said pedestal to said substrate, having on a second side thereof opposite from said first side means defining a substantially flat surface, and having a through hole which extends therethrough from said first side to said second side, wherein when said substrate is detachably coupled to said pedestal by said clamping means, said terminals extend completely through said through hole and project beyond said flat surface. 
     
     
       8. An apparatus according to claim 7, wherein said terminals extend through said through hole free of contact with said pedestal. 
     
     
       9. An apparatus according to claim 7, wherein said pedestal is a single integral part made completely of an electrically non-conductive material. 
     
     
       10. An apparatus according to claim 7, wherein said substrate has spaced first and second portions which are free of said components, wherein said clamping means includes spaced first and second clamping sections which respectively grip said first and second portions of said substrate, wherein said means defining said surface includes spaced first and second surface portions which are substantially flat, and wherein said through hole is located between said first and second clamping sections and between said first and second surface portions. 
     
     
       11. An apparatus according to claim 10, wherein said circuit substrate has a plurality of elongate and electrically conductive further lead terminals which are mounted on and project outwardly from said substrate and which are electrically coupled to said wiring pattern, and wherein said pedestal has a further through hole which extends therethrough from said first side to said second side at a location between said first and second clamping sections and between said first and second surface portions, wherein when said substrate is detachably coupled to said pedestal, said further lead terminals extend completely through said further through hole and project beyond said first and second surface portions. 
     
     
       12. An apparatus according to claim 10, wherein said first and second portions of said substrate each have a positioning hole therein, and wherein said first and second clamping sections each include spaced clamping portions disposed on opposite sides of said substrate, one of said clamping portions of each said clamping section having thereon a protrusion which engages a respective said positioning hole. 
     
     
       13. An apparatus according to claim 10, wherein said first and second surface portions are substantially coplanar, and wherein said pedestal has on said second side thereof a further surface portion disposed between said first and second surface portions, said through hole opening through said further surface portion, and said further surface portion being closer to said substrate than each of said first and second surface portions. 
     
     
       14. An apparatus according to claim 13, wherein said further surface portion is substantially planar, and extends substantially parallel to said first and second surface portions. 
     
     
       15. An apparatus according to claim 13, including a further circuit substrate having a surface disposed against said first and second surface portions of said pedestal and having therein a plurality of holes which each receive therein an end portion of a respective said lead terminal. 
     
     
       16. An apparatus according to claim 7, including an elongate stick part having an opening extending therein to and having a first pair of spaced flanges which project toward each other from opposite sides of said opening and a second pair of spaced flanges which project toward each other from said opposite sides of said opening, said circuit substrate and said pedestal detachably coupled to said substrate being slidably received within said opening in said stick part, said lead terminals being disposed between said first pair of flanges and said first and second surface portions on said pedestal each being adjacent inner edge portions of said first pair of flanges, and an edge portion of said circuit substrate on a side thereof remote from said pedestal being disposed between inner ends of said second pair of flanges.