P
US5430102AExpiredUtilityPatentIndex 67

Modified high heat amorphous crystalline blends

Assignee: GEN ELECTRICPriority: Mar 8, 1993Filed: Mar 8, 1993Granted: Jul 4, 1995
Est. expiryMar 8, 2013(expired)· nominal 20-yr term from priority
Inventors:GLASER RAYMOND HNAZARETH DARRYLYANG JERRY J
C08L 81/04C08L 71/00C08L 79/08C08L 23/06C08L 23/00C08L 81/06C08L 81/02
67
PatentIndex Score
11
Cited by
20
References
25
Claims

Abstract

Disclosed are thermoplastic resin compositions having improved heat resistance, e.g., IR soldering and HDT; increased ductility and flowability; and reduced flash. In particular, the thermoplastic resin compositions have at least one high heat amorphous resin, at least one polysulfide; and, optionally, at least one reinforcing filler and/or at least one polyolefin. The high heat amorphous resin is preferably a polyetherimide and the polyolefin is preferably a high crystalline polyethylene. The compositions of the invention are particularly well suited for preparing no flash high heat electrical connectors.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A no flash thermoplastic resin composition having improved flow and good thermal and chemical resistance, comprising: (A) at least one high heat amorphous resin in an amount ranging from about 0.5 to about 43.5 weight percent of the overall composition, wherein said high heat amorphous resin comprises a polyetherimide polysulfone, polyarylsulfone or polyethersulfone;   (B) at least one polysulfide in an amount ranging from about 33.5 to abut 76.5 weight percent of the overall composition, wherein said polysulfide has the formula:   --(--R.sub.1 --S.sub.n --)--     wherein R 1  is a divalent aromatic radical and n is a number from 1-5;     (C) at least one polyolefin consisting essentially of a high crystalline polyolefin in an amount ranging from about 0.1 to about 5 weight percent of the overall composition and optionally   (D) at least one reinforcing filler in an amount ranging from about 20 to about 60 weight percent of the overall composition, where in the sum of said weight percents is 100 percent.   
     
     
       2. The thermoplastic resin composition according to claim 1, wherein the crystallinity of said polyolefin ranges from about 60 to about 90 percent. 
     
     
       3. The thermoplastic resin composition according to claim 2, wherein said polyolefin is comprised primarily of polyethylene, polypropylene, polybutylene, or mixtures thereof. 
     
     
       4. The thermoplastic resin composition according to claim 3, wherein said polyolefin is comprised primarily of polyethylene. 
     
     
       5. The thermoplastic resin composition according to claim 1, wherein the amounts of said high heat amorphous resin and said reinforcing filler are sufficient to provide a no-flash thermoplastic resin composition. 
     
     
       6. The thermoplastic resin composition according to claim 1, wherein said high heat amorphous resin comprises polyetherimide having the formula: ##STR13## where m represents a whole number in excess of 1, and the group --O--A< is selected from: ##STR14## R' being hydrogen, lower alkyl or lower alkoxy, Z is a member of the class consisting of (1 ): ##STR15## and (2) divalent organic radicals of the general formula: ##STR16## where X is a member selected from the class consisting of divalent radicals of the formulas: ##STR17## where q is 0 or 1, y is a whole number from 1 to 5, and R is a divalent organic radical selected from the class consisting of (1) aromatic hydrocarbon radicals having from 6 to 10 carbon atoms and halogenated derivatives thereof, (2) alkylene radicals and cycloalkylene radicals having from 2 to 20 carbon atoms, (3) C( 2-8 ) alkylene terminated polyorganosiloxane, and (4) divalent radicals included by the formula: ##STR18## where Q is a member selected from the class consisting of: ##STR19## where x is a whole number from 1 to 5, inclusive. 
     
     
       7. The thermoplastic resin composition according to claim 6, wherein the polyethereimide is of the formula: ##STR20## and the divalent bonds of the --O--Z--O-- radical are in the 3,3'; 3,4'; 4,3'; or the 4,4'position and m is a whloe number in excess of 1. 
     
     
       8. The thermoplastic resin composition according to claim 7, wherein Z is: ##STR21## and R is selected from: ##STR22## 
     
     
       9. The thermoplastic resin composition according to claim 8, wherein said polyetherimide is of the formula: ##STR23## wherein m is a whole number in excess of 1. 
     
     
       10. The thermoplastic resin composition according to claim 1, wherein R 1  of the polysulfide is aromatic and selected from phenylene, biphenylene, naphthylene, oxydiphenyl or lower alkyl, lower alkoxy or halogen substituted derivatives thereof, and n is one. 
     
     
       11. The thermoplastic resin composition according to claim 10, wherein said polysulfide comprises polyphenylene sulfide. 
     
     
       12. The thermoplastic resin composition according to claim 1; wherein said reinforcing filler comprises at least one inorganic filler selected from glass, asbestos, talc, quartz, calcium carbonate, calcium sulfate, barium sulfate, carbon fiber, silica, zinc oxide, zirconium oxide, zirconium silicate, strontium sulfate, alumina, anhydrous aluminum silicate, barium ferrite, mica, feldspar, clay, magnesium oxide, magnesium silicate, nepheline syenite, phenolic resins, wollastonite, and titanium dioxide. 
     
     
       13. The thermoplastic resin composition according to claim 12, wherein said reinforcing filler comprises glass, wollastonite, calcium carbonate, silica, or mixtures thereof. 
     
     
       14. The thermoplastic resin composition according to claim 12, wherein said reinforcing filler comprises from about 20 to about 60 percent by weight of the thermoplastic resin composition. 
     
     
       15. The thermoplastic resin composition according to claim 14, wherein said reinforcing filler comprises from about 25 to about 50 percent by weight of the thermoplastic resin composition. 
     
     
       16. The thermoplastic resin composition according to claim 15, wherein said reinforcing filler comprises from about 30 to about 40 percent by weight of the thermoplastic resin composition. 
     
     
       17. The thermoplastic resin composition according to claim 1, wherein the amount of said polyolefin is sufficient to enhance the release properties of the themoplastic resin composition. 
     
     
       18. The thermoplastic resin composition according to claim 1, wherein the amount of said polyolefin ranges from about 0.1 weight percent to about 1.0 weight percent of the thermoplastic resin composition. 
     
     
       19. The thermoplastic resin composition according to claim 1, wherein said polyolefin has a weight average molecular weight greater than about 300,000. 
     
     
       20. The thermoplastic resin composition according to claim 19, wherein said polyolefin has a weight average molecular weight from about 300,000 to about 500,000. 
     
     
       21. The thermoplastic resin composition according to claim 3, wherein said polyolefin has a molecular weight of from about 3 million to about 6 million. 
     
     
       22. The thermoplastic resin composition according to claim 1, wherein: (A) the amount of said at least one high heat amorphous resin ranges from about 15 to about 31 weight percent of the overall composition;   (B) the amount of said at least one polysulfide ranges from about 46 to about 62 weight percent of the overall composition;   (C) the amount of said at least one polyolefin ranges from about 0.1 to about 1.0 weight percent of the overall composition; and   (D) the amount of said at least one reinforcing filler ranges from about 25 to about 40 weight percent of the overall composition, wherein the sum of said weight percents is 100 percent.   
     
     
       23. The thermoplastic resin composition according to claim 1, wherein said high heat amorphous resin comprises polyetherimide, said polyolefin comprises polyethylene, and said filler comprises glass. 
     
     
       24. A no flash, high heat molded pan having improved thermal and chemical resistance comprising a molded part selected from electrical connectors, chip carders, motor caps, brush holders, ignition parts, alternator parts, and intake manifolds, wherein said molded part comprises the composition according to claim 1. 
     
     
       25. The no flash high heat molded part according to claim 24, wherein said molded part comprises an electrical connector.

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