Semiconductor device for DC/AC converter

Abstract

A semiconductor device for converting DC input power to AC output power includes a package having a rectangular shape with four side edges and containing a plurality of semiconductor chips therein. Two pairs of positive and negative terminals of DC input terminals are situated on the side edges to face to each other such that the same polar terminals in the positive and negative terminals face to each other. AC output terminals and control terminals are arranged on the side edges where the DC input terminals are not formed.

What is claimed is: 
     
       1. A semiconductor device for converting DC input power to AC output power, comprising: a package having a rectangular shape and an upper surface thereon, said package including four side edge portions on a periphery of the upper surface with the rectangular shape and containing a plurality of semiconductor chips therein, said four side edge portions being formed of a first pair of parallel side edge portions and a second pair of parallel side edge portions perpendicular to the first pair of the side edge portions,   DC input terminals formed of two pairs of positive and negative terminals, each pair formed of one positive terminal and one negative terminal being situated on each side edge portion of the first pair of the parallel side edge portions, respectively; such that the positive terminals on the respective side edge portions directly face to each other and the negative terminals on the respective side edge portions directly face to each other, and   AC output terminals and control terminals arranged on the side edge portions in said second pair of the parallel side edge portions.   
     
     
       2. A semiconductor device as claimed in claim 1, further comprising straight conductor bars situated on said upper surface of said package and externally connected between said positive terminals and between said negative terminals such that the conductor bars are arranged parallel to each other. 
     
     
       3. A semiconductor device as claimed in claim 2, wherein said upper surface includes a central area inside the four side edge portions, said DC input terminals being positioned in a plane higher than a plane where the central area of said upper surface is positioned. 
     
     
       4. A semiconductor device as claimed in claim 3, wherein said AC output terminals are located on one side edge portion in the second pair of the parallel side edge portions and said control terminals are located on the other side edge portion in the second pair of the parallel side edge portions so that the AC output terminals and the control terminals face to each other. 
     
     
       5. A semiconductor device as claimed in claim 4, wherein said each pair of the positive and negative electrodes is located in a middle portion of each side edge portion away from corners of the package. 
     
     
       6. A semiconductor device as claimed in claim 1, further comprising snubber capacitors, each being installed between the positive and negative terminals forming one pair. 
     
     
       7. A semiconductor device as claimed in claim 1, wherein said positive terminals of the DC input terminals are internally connected together, and the negative terminals of the DC input terminals are internally connected together.