Pre-treating solution for electroless plating

Abstract

A pretreating solution for electroless plating comprising sulfuric acid, a halide, an organic acid and water as a diluent functions as an adhesion accelerating agent without generating etching corrosion, has a long life and provides excellent adhesiveness of plated copper to both glass cloth and substrate resins.

What is claimed is: 
     
       1. A pre-treating solution for electroless plating comprising sulfuric acid, a halide, an organic acid which is an aromatic carboxylic acid and water as a diluent wherein the sulfuric acid is contained in an amount of 0.70 to 2.50 mole/l, the halide is contained in an amount of 0.01 to 6.0 mole/l and the organic acid is contained in an amount of 0.005 to 1.5 mole/l and the aromatic carboxylic acid is benzoic acid or phthalic acid. 
     
     
       2. A pre-treating solution according to claim 1, wherein the halide is a chloride or bromide.