US5580407AExpiredUtility

Method of bonding two objects, at least one of which comprises organic materials

71
Assignee: PHILIPS CORPPriority: Jul 13, 1993Filed: Jul 13, 1994Granted: Dec 3, 1996
Est. expiryJul 13, 2013(expired)· nominal 20-yr term from priority
Y10T156/10B29C 66/73774B29C 66/73776B29C 66/73161B29C 66/73B29C 66/73117B29C 65/02B29C 66/73921B29C 66/71B29K 2995/0072B29C 66/73112B29C 66/73772C08J 5/12
71
PatentIndex Score
28
Cited by
12
References
19
Claims

Abstract

A first object, which comprises organic material, is bonded to a second object by a method whereby both objects are provided with complementary optically smooth surfaces, subsequent to which these surfaces are brought into substantial contact with one another, consequent upon which spontaneous atomic bonds are formed between atoms of the two objects. The strength of the atomic bonds thus formed can be increased by subsequently heating the region of contact of the two surfaces.

Claims

exact text as granted — not AI-modified
We claim: 
     
       1. A method of bonding a first object having a surface consisting essentially of an organic material to a second object, said method comprising polishing said surface consisting essentially of an organic material and a surface of said second object so as to form optically smooth complementary surfaces of RMS roughness of less than 2nm and then bringing said surfaces into contact with each other thereby spontaneously forming atomic bonds between atoms of said surfaces and causing said surfaces to bond one to the other. 
     
     
       2. A method as claimed in claim 1, characterised in that the organic material comprises a polymer. 
     
     
       3. A method as claimed in claim 2, characterised in that the organic material is selected from the group consisting of polymethylmethacryiate, polyimide and polytetrafluoroethylene. 
     
     
       4. A method as claimed in claim 3, characterized in that the second object comprises an organic material. 
     
     
       5. A method as claimed in claim 3, characterized in that the second object comprises glass. 
     
     
       6. A method as claimed in claim 2, characterized in that the second object comprises an organic material. 
     
     
       7. A method as claimed in claim 2, characterized in that the second object comprises a semiconductor material. 
     
     
       8. A method as claimed in claim 2, characterized in that the second object comprises glass. 
     
     
       9. A method as claimed in claim 2, characterized in that the second object comprises an electrical conductor. 
     
     
       10. A method as claimed in claim 2, characterized in that the complementary optically smooth surfaces are provided by a procedure which comprises tribochemical polishing. 
     
     
       11. A method as claimed in claim 1, characterised in that the second object comprises an organic material. 
     
     
       12. A method as claimed in claim 1, characterised in that the second object comprises a semiconductor material. 
     
     
       13. A method as claimed in claim 1, characterised in that the second object comprises glass. 
     
     
       14. A method as claimed in claim 1, characterised in that the second object comprises an electrical conductor. 
     
     
       15. A method as claimed in claim 1, characterised in that the complementary optically smooth surfaces are provided by a procedure which comprises tribochemical polishing. 
     
     
       16. A method of claim 1 wherein the first object consists essentially of an organic material. 
     
     
       17. The method of claim 16 wherein the organic material is a polymer. 
     
     
       18. A method of claim 1 wherein, after formation of the atomic bonds, heat is applied to said surfaces at a region of contact between said surfaces. 
     
     
       19. A method as claimed in claim 18, characterized in that the organic material is selected from the group consisting of polymethylmethacrylate polyimide and polytetrafluoroethylene.

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