Semiconductor package

Abstract

In a semiconductor package comprising a heat spreader, a heat sink, a wiring board, and a connector, a heat spreader mounted on a remaining region of the upper surface of a substrate. The heat sink is thermally connected to a primary integrated circuit chip through the heat spreader and to a secondary integrated circuit chip. The heat sink has electrical conductivity. The heat sink comprises a base plate and at least one connecting member which perpendicularly extends from the base plate. A wiring board has a plurality of contact holes and a plurality of contact slits. A connector is mounted on the wiring board. The connector has a plurality of contacts. The contacts comprises a plurality of socket portions and a plurality of terminal portions. The contacts are connected to an input/output pins with the input/output pins inserted into the respective socket portions. The terminal portions are inserted into the respective contact holes. The connector has at least one ground contact. The ground contact comprises a ground socket portion and a ground terminal portion. The at least one ground contact is electrically connected to the at least one connecting member with the connecting member inserted into the ground socket portion. The ground terminal portions are inserted into the contact slits.

What is claimed is: 
     
       1. A multi-chip package for packaging a semiconductor device comprising a substrate having upper and lower surfaces, a primary integrated circuit chip mounted on the lower surface of said substrate, secondary integrated circuit chips mounted on a predetermined region of the upper surface of said substrate, said multi-chip package comprising: a heat sink having a convex section, said convex section being opposed to said primary integrated circuit chip, said heat sink being thermally connected to said primary integrated circuit chip through said convex section, said convex section having a hole at a center thereof;   a stud member, comprising a rod section and a board section, for fixing said heat sink to said substrate with the rod section inserted in the hole and with the board section inserted between said heat sink and said substrate, the rod section having a threaded end, said stud member being fixed to said substrate by an adhesive; and   a nut screwed to said threaded end, thereby fixing said heat sink to said substrate.   
     
     
       2. A multi-chip package as claimed in claim 1, wherein said primary integrated circuit chip has heat generation amount which is larger than that of said secondary integrated circuit chip. 
     
     
       3. A multi-chip package as claimed in claim 1, wherein said multi-chip package further comprises a heat transfer sheet between said heat sink and said heat spreader. 
     
     
       4. A shielding package for shielding a semiconductor device from electromagnetic interference, said semiconductor device comprising a substrate having lapper and lower surfaces and having a plurality of input/output pins, and an integrated circuit chip mounted on the lower surface of said substrate, said shielding package comprising: a heat spreader mounted on the upper surface of said substrate;   a heat sink thermally connected to said integrated circuit chip through said heat spreader, said heat sink having electrical conductivity, said heat sink comprising a base plate and at least one connecting member which perpendicularly extends from the base plate;   a wiring board having a plurality of contact holes and a plurality of contact slits; and   a connector mounted on said wiring board, said connector having a plurality of contacts which comprise a plurality of socket portions and a plurality of terminal portions, said contacts being connected to said input/output pins with said input/output pins inserted into the respective socket portions, the terminal portions being inserted into the respective contact holes, said connector having at least one ground contact which comprises a ground socket portion and a ground terminal portion, said at least one ground contact being electrically connected to said at least one connecting member with the connecting member inserted into the ground socket portion, the ground terminal portions being inserted into the contact slits.   
     
     
       5. A shielding package as claimed in claim 4, wherein said connecting members are plate. 
     
     
       6. A shielding package as claimed in claim 4, wherein said heat sink has at least one heat sink hole, said heat spreader being a thermal conductive mounting plate in which a threaded hole is threaded, said heat sink being fixed to said thermal conductive mounting plate by screwing a screw into said threaded hole. 
     
     
       7. A shielding package for shielding a semiconductor device from electromagnetic interference, said semiconductor device comprising a substrate having upper and lower surfaces and having a plurality of input/output pins, and an integrated circuit chip mounted on the lower surface of said substrate, said shielding package comprising: a heat sink having a convex section, said convex section being opposed to said integrated circuit chip, said heat sink, having electrical conductivity, being thermally connected to said integrated circuit chip through said convex section and comprising a base plate and at least one connecting member which perpendicularly extends from the base plate, said convex section having a hole at a center thereof;   a wiring board having a plurality of contact holes and a plurality of contact slits;   a stud member, comprising a rod section and a board section, for fixing said heat sink to said substrate with the rod section inserted in the hole and with the board section inserted between said heat sink and said substrate, the rod section having a threaded end, said stud member being fixed to said wiring board by an adhesive; and   a nut screwed to said threaded end, thereby fixing said heat sink to said substrate;   a connector mounted on said wiring board, said connector having a plurality of contacts which comprise a plurality of socket portions and a plurality of terminal portions, said contacts being connected to said input/output pins with said input/output pins inserted into the respective socket portions, the terminal portions being inserted into the respective contact holes, said connector having at least one ground contact which comprises a ground socket portion and a ground terminal portion, said at least one ground contact being electrically connected to said at least one connecting member with the connecting member inserted into the ground socket portion, the ground terminal portions being inserted into the contact slits.   
     
     
       8. A multi-chip shielding package for packaging a multi-chip module and for shielding said multi-chip module from electromagnetic interference, said multi-chip module comprising a substrate having upper and lower surfaces and having a plurality of input/output pins, a primary integrated circuit chip mounted on the lower surface of said substrate, and secondary integrated circuit chips mounted on a predetermined region of the upper surface of said substrate, said primary integrated circuit chip being mounted on the lower surface of said substrate, said multi-chip shielding package comprising: a heat spreader mounted on a remaining region of the upper surface of said substrate;   a heat sink thermally connected to said primary integrated circuit chip through said heat spreader and to said secondary integrated circuit chips, said heat sink having electrical conductivity, said heat sink comprising a base plate and at least one connecting member which perpendicularly extends from the base plate;   a wiring board having a plurality of contact holes and a plurality of contact slits; and   a connector mounted on said wiring board, said connector having a plurality of contacts which comprise a plurality of socket portions and a plurality of terminal portions, said contacts being connected to said input/output pins with said input/output pins inserted into the respective socket portions, the terminal portions being inserted into the respective contact holes, said connector having at least one ground contact which comprises a ground socket portion and a ground terminal portion, said at least one ground contact being electrically connected to said at least one connecting mender with the connecting member inserted into the ground socket portion, the ground terminal portions being inserted into the contact slits.   
     
     
       9. A multi-chip shielding package as claimed in claim 8, wherein said heat sink has at least one heat sink hole, said heat spreader being a thermal conductive mounting plate in which a threaded hole is threaded, said heat sink being fixed to said thermal conductive mounting plate by screwing a screw into said threaded hole. 
     
     
       10. A multi-chip shielding package as claimed in claim 8, wherein said multi-chip shielding package further comprises flexible thermal conductive members inserted between said secondary integrated circuit chips and said heat sink, whereby said heat sink thermally connected to said second integrated circuit chips through said flexible thermal conductive members. 
     
     
       11. A multi-chip shielding package as claimed in claim 8, wherein said flexible thermal conductive members consist essentially of a silicon resin. 
     
     
       12. A multi-chip shielding package as claimed in claim 8, wherein said multi-chip shielding package further comprises thermal conductive springs inserted between said secondary integrated circuit chips and said heat sink, whereby said heat sink is thermally connected to said secondary integrated circuit chips through said thermal conductive springs. 
     
     
       13. A multi-chip shielding package as claimed in claim 8, wherein said heat spreader is opposed to said primary integrated circuit chip. 
     
     
       14. A multi-chip shielding package as claimed in claim 8, wherein said substrate has a cavity section at the lower surface, said primary integrated circuit chip being held in the cavity section. 
     
     
       15. A multi-chip shielding package as claimed in claim 8, wherein said primary integrated circuit chip is bare chip. 
     
     
       16. A multi-chip shielding package as claimed in claim 8, wherein said integrated circuit chip is received within a surface mount type package. 
     
     
       17. A multi-chip shielding package as claimed in claim 8, wherein said primary integrated circuit chip has heat generation amount which is larger than that of said secondary integrated circuit chip. 
     
     
       18. A multi-chip shielding package as claimed in claim 8, wherein said multi-chip shielding package further comprises a heat transfer sheet between said heat sink and said heat spreader.