Wire diamond lattice structure for phased array side lobe suppression and fabrication method

Abstract

A diamond matrix metallic mesh suppresses RF energy, and particularly side lobe energy, in a phased array antenna, while passing main beam energy. The metal mesh emulates the structure of the bond segments joining the carbon atoms in a diamond structure. The wire diamond lattice structure is placed above an array of radiating elements to absorb side lobe energy. The wire lattice structure is fabricated through use of complementary forms which compress a wire into a required unit shape. Many unit shaped wires are placed in a form which hold the wires in the proper position. Other unit shaped wires are rotated 90 degrees and attached in place to the held wires. Additional unit shaped wires are added to form the basic interlocking cube structure of the diamond lattice.

What is claimed is: 
     
       1. A method for fabricating a wire mesh structure emulating a diamond lattice structure, comprising the following steps: fabricating a plurality of unit structure wire elements, each defining a zig-zag pattern of adjacent link portions, adjacent portions defining unit structure vertices;   interconnecting said elements in adjacent tiers of unit structures, each tier defined by a set of spaced aligned unit structures, and wherein the structures of one tier are disposed transversely to the structures of adjacent tiers, and structures of one tier are electrically and mechanically interconnected to structures of adjacent tiers at said unit structure vertices.   
     
     
       2. The method of claim 1 wherein said adjacent link portions of each unit structure define an included angle of 108.47 degrees. 
     
     
       3. The method of claim 1 wherein said step of fabricating said unit structure elements comprises: providing a set of first and second forms, said forms defining complementary zig-zag surfaces in the outline of said unit structure elements;   disposing said forms in an aligned, spaced relationship with said respective zig-zag surfaces facing each other;   disposing a straight section of conductive wire between said surfaces; and   forcing said forms toward each other to compress said wire between said zig-zag surfaces, bending said wire to assume the shape of said zig-zag surfaces.   
     
     
       4. The method of claim 1 wherein said interconnecting of structures of one tier to structures of adjacent tiers at said unit structure vertices is by soldering. 
     
     
       5. The method of claim 1 wherein said interconnecting of structures of one tier to structures of adjacent tiers at said unit structure vertices is by brazing. 
     
     
       6. The method of claim 1 wherein said interconnecting of structures of one tier to structures of adjacent tiers at said unit structure vertices is by laser welding.