US5690727AExpiredUtility

Thin films of ABO3 with excess B-site modifiers and method of fabricating integrated circuits with same

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Assignee: SYMETRIX CORPPriority: Dec 13, 1991Filed: Jan 27, 1997Granted: Nov 25, 1997
Est. expiryDec 13, 2011(expired)· nominal 20-yr term from priority
H10P 14/6506H10P 14/6342H10P 14/668H10P 14/69398C04B 2235/3203C04B 2235/3289C04B 2235/3234C04B 2235/3224C30B 29/68C04B 2235/3213H01C 7/1013C23C 18/1275C04B 35/4682C04B 2235/3241C23C 16/4412C04B 2235/3279C04B 2235/3201C23C 16/482C04B 2235/3262C04B 2235/3272C04B 2235/72C04B 2235/3268C23C 16/52C23C 16/4558C04B 35/47C04B 2235/3229C23C 16/448C04B 2235/79C23C 16/45561C04B 2235/3281C23C 16/46C30B 7/00C04B 2235/441C04B 2235/3243C04B 35/6264C04B 2235/3275C23C 18/1216C04B 2235/3206C04B 2235/3251C23C 16/4486C23C 18/1295C04B 2235/32C04B 2235/449C04B 2235/3217C04B 2235/3208C04B 2235/6585C04B 2235/3284C04B 2235/3227H10D 1/682H10D 1/692H10D 1/684H10B 53/00H10B 12/30
63
PatentIndex Score
21
Cited by
21
References
4
Claims

Abstract

A method for fabricating an integrated circuit capacitor having a dielectric layer comprising BST with excess B-site material, such as titanium, added. A polyoxyalkylated metal liquid precursor solution is prepared comprising a stock solution of BST of greater then 99.999% purity blended with excess B-site material such as titanium such that the titanium is in the range of 0-100 mol %. A xylene exchange is then performed to adjust the viscosity of the solution for spin-on application to a substrate. The precursor is spun on a first electrode, dried at 400 DEG C. for 2 minutes, then annealed at 650 DEG C. to 800 DEG C. for about an hour to form a layer of BST with excess titanium. A second electrode is deposited, patterned, and annealed at between 650 DEG C. to 800 DEG C. for about 30 minutes. The resultant capacitor exhibits an enlarged dielectric constant with only a small increase in leakage current.

Claims

exact text as granted — not AI-modified
We claim: 
     
       1. A non-stoichiometric metal oxide precursor solution for fabricating integrated circuit thin films, said precursor solution comprising: a stoichiometric portion including total A-site and total B-site metals in a 1:1 ratio capable of satisfying a formula; and   excess B-site material added to said stoichiometric portion including B-site material in an amount ranging from 0.01 mol % to 100 mol % of the amount of total amount of B-site material required to satisfy said formula.   
     
     
       2. The precursor of claim 1 wherein said stoichiometric portion comprises barium, strontium, and titanium in amounts corresponding to a formula (Ba x  Sr 1-x  TiO 3 ), wherein x is a number ranging from zero to one. 
     
     
       3. The precursor of claim 2 wherein said excess B-site material comprises titanium in an amount greater than 0.1 mol % and less than 20 mol %. 
     
     
       4. The precursor of claim 1 wherein said excess B-site material comprises titanium in an amount ranging from 1 mol % to 3 mol %.

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