US5700363AExpiredUtility
Porous nickel electrode substrate
Est. expiryFeb 15, 2016(expired)· nominal 20-yr term from priority
H01M 4/745H01M 4/806H01M 4/80H01M 4/667H01M 4/808H01M 4/668H01M 4/70H01M 2004/029Y10T29/49115Y10T29/49114Y02E60/10
33
PatentIndex Score
6
Cited by
22
References
4
Claims
Abstract
A porous nickel electrode substrate having a central high conductivity core sandwiched between two layers of porous conductive material such as nickel foam or nickel felt. The porous conductive material is plated with nickel and then sintered. By selectively controlling the plating of nickel on the porous material, variable conductivities may be designed into the substrate.
Claims
exact text as granted — not AI-modifiedThe embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows:
1. A process for varying the conductivity of an electrode substrate, the process comprising: 1) providing an electrically conductive core having opposing sides, 2) affixing at least one porous layer to each side of the core, the porous layer selected from the group consisting of foam and felt, 3) depositing nickel from the decomposition of nickel tetracarbonyl directly onto each porous layer, 4) causing the concentration of the nickel deposit from step 3) to vary along the substrate, and 5) sintering the nickel deposit.
2. The process according to claim 1 wherein nickel powder is added to the substrate prior to sintering.
3. The process according to claim 1 wherein a tab is formed from the core.
4. The process according to claim 1 wherein the core is selected from the group consisting of plate, foil, mesh and expanded metal.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.