Mechanically joined sputtering target and adapter therefor

Abstract

A target assembly in which the sputtering material is not soldered or otherwise metallurgically bonded to a backing plate. Rather, the target, which is homogeneously manufactured of sputtering material, is mechanically coupled (e.g., with bolts) to an adapter, which is itself permanently affixed to the chamber. As a result, the target can be easily uncoupled from the chamber and replaced, without also requiring removal and replacement of a backing plate.

What is claimed is: 
     
       1. A target assembly removably mountable in an opening in a wall of a vacuum chamber for processing a substrate by causing sputtering material to be ejected from the target assembly onto the substrate, comprising: an adapter having a supporting wall, an outer flange extending generally outward from said supporting wall and sized for mounting to said chamber, and an inner flange extending generally inward from said supporting wall;   a target of said sputtering material having a generally planar surface, an outer periphery of said target being sized and configured to fit within said supporting wall of said adapter, such that said generally planar surface of said target overlays said inner flange of said adapter; and   mechanical couplers mechanically joining said target to said inner flange of said adapter.   
     
     
       2. The target assembly of claim 1, wherein said supporting wall has a generally cylindrical shape and said target has a generally disk shape. 
     
     
       3. The target assembly of claim 1, wherein said inner flange of said adapter defines openings for receiving said mechanical couplers. 
     
     
       4. The target assembly of claim 3, wherein said target defines openings in said generally planar surface arranged in mating relation to said openings defined by said inner flange of said adapter. 
     
     
       5. The target assembly of claim 4 wherein said openings defined in said target are threaded, and said mechanical couplers comprise bolts inserted through the openings defined by said adapter and threaded into said openings defined by said target. 
     
     
       6. The target assembly of claim 1 wherein said sputtering material is a refractory metal. 
     
     
       7. The target assembly of claim 1 wherein said sputtering material is one of titanium, gold, and aluminum. 
     
     
       8. The target assembly of claim 1 wherein said sputtering material is aluminum or an oxide thereof. 
     
     
       9. Apparatus for processing a substrate by causing sputtering material to be ejected from a target onto said substrate, comprising: a vacuum chamber having an inner peripheral surface defining an aperture for receiving a target, said inner peripheral surface including a supporting structure and an inner flange extending generally inward from said supporting structure, and an anode for supporting the substrate in proximal face-to-face relation to said target;   a target of said sputtering material having a generally planar surface, an outer periphery of said target being sized and configured to fit within said supporting structure of said chamber, such that said generally planar surface of said target overlays said inner flange of said chamber; and   mechanical couplers mechanically joining said target to said inner flange of said chamber.   
     
     
       10. The apparatus of claim 9, wherein said supporting structure has a generally cylindrical shape and said target has a generally disk shape. 
     
     
       11. The apparatus of claim 9, wherein said inner flange of said chamber defines openings for receiving said mechanical couplers. 
     
     
       12. The apparatus assembly of claim 11, wherein said target defines openings in said generally planar surface arranged in mating relation to said openings defined by said inner flange of said chamber. 
     
     
       13. The apparatus of claim 12 wherein said openings defined in said target are threaded, and said mechanical couplers comprise bolts inserted through the openings defined by said chamber and threaded into said openings defined by said target. 
     
     
       14. The apparatus of claim 9 wherein said sputtering material is a refractory metal. 
     
     
       15. The apparatus of claim 9 wherein said sputtering material is one of titanium, gold, and aluminum. 
     
     
       16. The apparatus of claim 11 wherein said sputtering material is aluminum or an oxide thereof. 
     
     
       17. The apparatus of claim 9 wherein said chamber comprises an adapter mounted to said chamber, said adapter comprising said supporting structure and said inner flange.