Method of attaching a semiconductor microchip to a circuit board

Abstract

A method of attaching a microchip onto a circuit board is described. The method may include: forming a core portion of thermally conductive and electrically conductive material 50; forming a perimeter portion of thermally conductive and electrically nonconductive material 54; placing the core portion of thermally conductive and electrically conductive material 50 at a site on a circuit board 58 where the microchip 56 will be bonded; placing the perimeter portion of thermally conductive and electrically non-conductive material 54 around the core portion 50 on the circuit board; and attaching microchip component 56 to the core portion 50 and the perimeter portion 54. The method may also include applying a catalyst on the circuit board before attaching the core and perimeter portions. The method may also include curing the core portion and the perimeter portion at 90 degrees C. for 10 minutes and then applying a catalyst on the core portion and the perimeter portion. The materials may once again be cured at 90 degrees C. for 10 minutes. Other devices, systems and methods are also disclosed.

What is claimed is: 
     
       1. A method of attaching a semiconductor microchip to a circuit board, said method comprising: applying a catalyst on said circuit board;   placing a center core bond portion of thermally conductive and electrically conductive material on said circuit board where the catalyst has been applied thereon;   placing a perimeter bond portion of thermally conductive and electrically nonconductive material around said center core bond portion on said circuit board where the catalyst has been applied thereon;   at least partially curing the circuit board and the center core and perimeter bond portions;   placing said semiconductor microchip on said center core and perimeter bond portions; and   curing the semiconductor microchip, the center core bond portion and the perimeter bond portion.   
     
     
       2. The method of claim 1, wherein said method further includes forming said perimeter bond portion of thermally conductive and electrically nonconductive material from thermoplastic material, and forming said center core bond portion of thermally conductive and electrically conductive material from thermoplastic material. 
     
     
       3. The method of claim 1, wherein said method further includes forming said perimeter bond portion of thermally conductive and electrically nonconductive material from thermoset material, and forming said center core bond portion of thermally conductive and electrically conductive material from thermoset material. 
     
     
       4. The method of claim 1, wherein said method further comprises placing the center core bond portion on the circuit board by means of an automated machine or template. 
     
     
       5. A method of attaching a semiconductor microchip to a circuit board, said method comprising: applying a solvent agent on said circuit board;   placing a center core bond portion of thermally conductive and electrically conductive material on said circuit board where the solvent agent has been applied thereon;   placing a perimeter bond portion of thermally conductive and electrically nonconductive material around said center core bond portion on said circuit board where the solvent agent has been applied thereon;   at least partially curing the circuit board and the center core and perimeter bond portions;   placing said semiconductor microchip on said center core and perimeter bond portions; and   curing the semiconductor microchip, the center core bond portion and the perimeter bond portion.   
     
     
       6. A method of attaching a semiconductor microchip to a circuit board, said method comprising: placing a center core bond portion of thermally conductive and electrically conductive material on said circuit board;   placing a perimeter bond portion of thermally conductive and electrically nonconductive material around said center core bond portion on said circuit board;   curing said center core bond portion and said perimeter bond portion at 90 degrees C. for 10 minutes;   placing said semiconductor microchip on said center core and perimeter bond portions; and   curing the semiconductor microchip, the center core bond portion and the perimeter bond portion.   
     
     
       7. A method of attaching a semiconductor microchip to a circuit board, said method comprising: placing a center core bond portion of thermally conductive and electrically conductive material on said circuit board;   placing a perimeter bond portion of thermally conductive and electrically nonconductive material around said center core bond portion on said circuit board;   at least partially curing the circuit board and the center core and perimeter bond portions;   applying a catalyst on said center core bond portion and said perimeter bond portion;   placing said semiconductor microchip on said center core and perimeter bond portions, and   curing the semiconductor microchip, the center core bond portion and the perimeter bond portion.   
     
     
       8. A method of attaching a semiconductor microchip to a circuit boards said method comprising: placing a center core bond portion of thermally conductive and electrically conductive material on said circuit board;   placing a perimeter bond portion of thermally conductive and electrically nonconductive material around said center core bond portion on said circuit board;   at least partially curing the circuit board and the center core and perimeter bond portions;   applying a solvent agent on said center core bond portion and said perimeter bond portion;   placing said semiconductor microchip on said center core and perimeter bond portions; and   curing the semiconductor microchip, the center core bond portion and the perimeter bond portion.   
     
     
       9. A method of attaching a semiconductor microchip to a circuit board, said method comprising: placing a center core bond portion of thermally conductive and electrically conductive material on said circuit board;   placing a perimeter bond portion of thermally conductive and electrically nonconductive material around said center core bond portion on said circuit board;   at least partially curing the circuit board and the center core and perimeter bond portions;   placing said semiconductor microchip on said center core and perimeter bond portions; and   curing said semiconductor microchip, said center core bond portion and said perimeter bond portion at 90 degrees C. for 10 minutes.   
     
     
       10. A method of attaching a semiconductor microchip to a circuit board, said method comprising: applying a solvent agent on said circuit board;   placing a center core bond portion of thermally conductive and electrically conductive material on said circuit board, where the solvent agent has been applied thereon, using an automated machine or a template;   placing a perimeter bond portion of thermally conductive and electrically nonconductive material around said center core bond portion on said circuit board where the solvent agent has been applied thereon;   at least partially curing said circuit board and the center core and perimeter bond portions at 90 degrees C. for 10 minutes;   applying a solvent agent to a surface, onto which the microchip will be placed, of said center core and perimeter bond portions;   placing said semiconductor microchip to said center core and perimeter bond portions; and   curing said semiconductor microchip, said center core bond portion and said perimeter bond portion at 90 degrees C. for 10 minutes.   
     
     
       11. The method of claim 10, wherein said method further includes forming said perimeter bond portion of thermally conductive and electrically nonconductive material from thermoplastic material and forming said center core bond portion of thermally conductive and electrically conductive material from thermoplastic material. 
     
     
       12. The method of claim 10, wherein said method further includes forming said perimeter bond portion of thermally conductive and electrically nonconductive material from thermoset material and forming said center core bond portion of thermally conductive and electrically conductive material from thermoset material.