US5776540AExpiredUtilityPatentIndex 74
Process for manufacturing a praseodymium oxide- and manganese oxide-containing baseplate for use in field emission displays
Est. expiryMay 14, 2016(expired)· nominal 20-yr term from priority
H01J 2329/00H01J 3/022H01J 29/863H01J 31/15
74
PatentIndex Score
10
Cited by
12
References
23
Claims
Abstract
A process for manufacturing a conductive and light-absorbing baseplate for use in a field emission display is disclosed. A surface of the baseplate is coated with a praseodymium oxide- and manganese oxide-containing layer having a resistivity that does not exceed 1×10 5 Ω-cm. The coating may be placed on the baseplate by radiofrequency sputtering, laser ablation, plasma deposition or the like. Suitable praseodymium sources include praseodymium acetate, praseodymium oxalate and Pr(THd) 3 , while suitable manganese sources include MnO 2 and MnCO 3 .
Claims
exact text as granted — not AI-modifiedWe claim:
1. A process for manufacturing a conductive and light-absorbing baseplate for use in field emission display, comprising coating a surface of a baseplate with a layer comprising praseodymium oxide and manganese oxide, wherein the layer has a resistivity which does not exceed 1×10 5 Ω-cm.
2. The process of claim 1 wherein the layer has a resistivity which does not exceed 1×10 4 Ω-cm.
3. The process of claim 1 wherein the layer has a resistivity which does not exceed 1×10 3 Ω-cm.
4. The process of claim 1 wherein the layer has a thickness which ranges from 1,000 Å to 15,000 Å.
5. The process of claim 1 wherein the layer has a light absorption coefficient of at least 1×10 5 cm -1 at a wavelength of 500 nm.
6. The process of claim 1 wherein the layer is coated on the surface of the baseplate by a coating process selected from the group consisting of radiofrequency sputtering, laser ablation, plasma deposition, chemical vapor deposition or electron beam evaporation.
7. The process of claim 1 wherein the layer is coated on the surface of the baseplate by radiofrequency sputtering.
8. The process of claim 7 wherein Pr 6 O 11 and a manganese source selected from MnO 2 and MnCO 3 form a sputtering target for the radiofrequency sputtering.
9. The process of claim 1 wherein the layer is coated on the surface of the baseplate by chemical vapor deposition.
10. The process of claim 9 wherein a praseodymium source selected from the group consisting of praseodymium acetate, praseodymium oxalate and Pr(THd) 3 is used to form the layer.
11. The process of claim 9 wherein a manganese source selected from the group consisting of manganese acetate, manganese carbonyl, manganese methoxide and manganese oxalate is used to form the layer.
12. The process of claim 1 further comprising, after the coating step, the step of firing the layer under a reducing atmosphere to lower its resistivity such that it does not exceed 1×10 4 Ω-cm.
13. The process of claim 12 wherein the reducing atmosphere is formed of hydrogen, carbon monoxide or a mixture threreof.
14. The process of claim 1 wherein the layer further comprises a conductive ion.
15. The process of claim 1 wherein the layer further comprises a metal.
16. The process of claim 1 wherein the layer consists essentially of praseodymium oxide and manganese oxide.
17. The process of claim 1 wherein the layer is formed of particles with an average particle diameter of about 2 μm.
18. The process of claim 1 wherein the layer is in contact with a conducting gate.
19. The process of claim 1 wherein the layer is in contact with a insulative layer.
20. The process of claim 1 wherein the layer has a molar ratio of praseodymium to manganese ranging from 0.1:1 to 1:0.1.
21. The process of claim 20 where in the molar ratio ranges from 0.5:1 to 1:0.5.
22. The process of claim 1 wherein the layer further comprises PrMnO 3 .
23. The process of claim 1 further comprising the step of assembling a field emission display utilizing the conductive and light-absorbing baseplate.Cited by (0)
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