Tacky film frame for electronic device

Abstract

A device for storing and transporting electronic devices such as semiconductor chips, comprising: a frame having a top side, a bottom side, a periphery, and a window within the periphery, a thin film covering the window, the thin film having on its top surface an adhesive layer, the adhesive layer being adapted to hold a plurality of electronic devices, the electronic devices being attachable to the adhesive layer at any location on the thin film within the window, and the electronic devices being uncovered, a recess in the bottom side, and a raised flange around the window on the top side wherein the raised flange of one of the devices mates with the recess of another device, thereby allowing the devices to be stacked. The adhesive properties of the adhesive layer may be greatly reduced by exposure to electromagnetic radiation such as heat (infrared) or ultraviolet, thereby releasing the electronic device.

What is claimed: 
     
       1. A device for storing and transporting electronic devices such as semiconductor chips, comprising: a frame having a top side, a bottom side, a periphery, and a window within the periphery,   a device supporting member traversing the window,   the device supporting member having a tacky side, the tacky side being adapted to hold an electronic device, the electronic device being adherable to the tacky side within the window,   the top side having a first stacking structure, and the bottom side having a second stacking structure, one of said first and second stacking structures projecting outwardly from the frame, the other of said stacking structures configured to cooperatively engage and receive with the stacking structure projecting outwardly such that stacking of the devices is facilitated.   
     
     
       2. The device of claim 1, wherein the first stacking structure is a raised flange portion, and the second stacking structure defines a recess sized to cooperate with said first stacking structure. 
     
     
       3. The device of claim 2, wherein the device supporting member is a thin, flexible film. 
     
     
       4. The device of claim 3, wherein the film is attached to the recess around the edges of the window. 
     
     
       5. The device of claim 1, wherein the tacky side is washable. 
     
     
       6. The device of claim 3, wherein the film is comprised of plastic selected from the group consisting of polyesters, ethylene-vinyl acetate copolymers, polyvinyl chloride, and polyolefins. 
     
     
       7. The device of claim 3, wherein the thickness of the film is in the range of 70 microns to 150 microns. 
     
     
       8. The device of claim 1, wherein the device supporting member is a thin film with an adhesive layer forming the tacky side. 
     
     
       9. The device of claim 1, wherein the frame has a substantially square shape. 
     
     
       10. The device of claim 1, wherein the film and frame are both comprised of static dissipative material. 
     
     
       11. The device of claim 1, wherein the adhesive properties of the adhesive are greatly reduced by exposure to electromagnetic radiation, thereby releasing the electronic device from the adhesive. 
     
     
       12. The device of claim 1, wherein the electromagnetic radiation is heat. 
     
     
       13. The device of claim 1, wherein the electromagnetic radiation is ultraviolet. 
     
     
       14. A device for storing and transporting electronic devices such as semiconductor chips, comprising: a frame having a top side, a bottom side, a periphery, and a window within the periphery,   a thin, flexible film with two surfaces covering the window,   the thin, flexible film having on one surface an adhesive layer, the adhesive layer being adapted to hold a plurality of electronic devices, the electronic devices being attachable to the adhesive layer at a plurality of locations within the window,   a recess in the bottom side, and   a raised flange around the window on the top side   wherein the raised flange of one of the devices mates with the recess of another device, thereby allowing the devices to be stacked.   
     
     
       15. The device of claim 14, wherein the film is attached to the recess around the edges of the window. 
     
     
       16. The device of claim 14, wherein the adhesive layer is washable. 
     
     
       17. The device of claim 14, wherein the film is comprised of plastics selected from the group consisting of polyesters, ethylene-vinyl acetate copolymers, polyvinyl chloride, and polyolefins. 
     
     
       18. The device of claim 14, wherein the thickness of the film is in the range of 70 microns to 150 microns. 
     
     
       19. The device of claim 14, wherein the adhesive properties of the adhesive layer are greatly reduced by exposure to electromagnetic radiation, thereby releasing the electronic device from the adhesive. 
     
     
       20. The device of claim 19, wherein the electromagnetic radiation is heat. 
     
     
       21. The device of claim 19, wherein the electromagnetic radiation is ultraviolet. 
     
     
       22. A device for storing and transporting electronic devices such as semiconductor chips, comprising: a frame having a top side, a bottom side, a periphery, and a window within the periphery,   a thin, flexible film covering the window,   the thin, flexible film having on one surface a washable adhesive layer, the adhesive layer being adapted to hold a plurality of electronic devices, the electronic devices being attachable to the adhesive layer at any location on the thin film within the window, and the electronic devices being uncovered,   a recess in the bottom side, and   a raised flange around the window on the top side   wherein the thin film is attached to the recess around the edges of the window and wherein the raised flange of one of the devices mates with the recess of another device, thereby allowing the devices to be stacked.   
     
     
       23. The device of claim 22, wherein the film is comprised of plastics selected from the group consisting of polyesters, ethylene-vinyl acetate copolymers, polyvinyl chloride, and polyolefins. 
     
     
       24. The device of claim 22, wherein the thickness of the film is in the range of 70 microns to 150 microns. 
     
     
       25. The device of claim 22, wherein the adhesive properties of the adhesive are greatly reduced by exposure to electromagnetic radiation, thereby releasing the electronic device from the adhesive. 
     
     
       26. The device of claim 25, wherein the electromagnetic radiation is heat. 
     
     
       27. The device of claim 25, wherein the electromagnetic radiation is ultraviolet. 
     
     
       28. A device for storing and transporting electronic devices such as semiconductor chips, comprising: a frame having a top side, a bottom side, a periphery, and an open window within the periphery, one of said top side and bottom side having an outwardly extending flange, and the other of said top side and bottom side having a recess sized to said flange whereby a plurality of such devices may be stacked,   a membrane covering the open window,   the membrane having on its top surface an adhesive layer, the adhesive layer being adapted to hold a plurality of electronic devices, the electronic devices being attachable to the adhesive layer at any location on the membrane within the window, and the electronic devices being uncovered,   wherein the adhesive properties of the adhesive layer are greatly reduced by exposure to electromagnetic radiation, thereby releasing the electronic device.   
     
     
       29. The device of claim 28, wherein the electromagnetic radiation is heat. 
     
     
       30. The device of claim 28, wherein the electromagnetic radiation is ultraviolet.