Device assembly structure with reinforced outer leads

Abstract

A highly reliable assembly structure is provided by surely reducing a stress to be exerted on leads of a TCP device. Part of a soldered portion of outer leads that is located closer to a semiconductor chip of the TCP device is reinforced by a support ring formed on a side of the outer leads opposite from a circuit board, so that a stress to be exerted on the outer leads is dispersed to the leads, the support ring and solder to thereby prevent the possible occurrence of metal fatigue of the leads.

What is claimed is: 
     
       1. A device assembly structure in which outer leads of a tape carrier package device are soldered to electrodes of a circuit board, wherein a support ring is formed on a side of the outer leads opposite from the circuit board, and an outer peripheral portion of said support ring is superimposed on part of a soldered portion of each outer lead such that said part of the soldered portion is reinforced by the support ring, said part of the soldered portion being located closer to a semiconductor chip of the tape carrier package device than the other part of the soldered portion. 
     
     
       2. A device assembly structure as claimed in claim 1, wherein the outer leads extend substantially straight. 
     
     
       3. A device assembly structure in which outer leads of a tape carrier package device are soldered to electrodes of a circuit board, wherein a support ring is formed on a side of the outer leads opposite from the circuit board, and part of a soldered portion of each outer lead is reinforced by the support ring, said part of the soldered portion being located closer to a semiconductor chip of the tape carrier package device than the other part of the soldered portion, and wherein each outer lead has a cross-sectional area of 5.25×10 -3  mm 2  or less in a plane perpendicular to a direction in which the outer lead extends.