Aluminum and aluminum alloy radiator for semiconductor device and process for producing the same

Abstract

An aluminum or aluminum alloy radiator possessing high reliability and excellent heat dissipation is provided. A process for producing an aluminum alloy radiator is also provided which has improved adhesion between the radiator and the mold resin and can prevent cracking in a resin molded portion. The aluminum alloy radiator, for a plastic molded type semiconductor device, comprising an anodized aluminum-iron alloy having an iron content of 0.5 to 3.0% by weight or an anodized aluminum-silicon alloy having a silicon content of 0.5 to 3.5% by weight. The process for producing an aluminum alloy radiator for a plastic molded type semiconductor device, comprising the steps of: anodizing an aluminum alloy; and subjecting the anodized aluminum alloy to sealing, wherein the aluminum alloy radiator after the sealing is heat-treated at a temperature of 180 to 250 DEG C.

What is claimed is: 
     
       1. An aluminum alloy radiator for a plastic molded type semiconductor device, said radiator comprising an anodized aluminum alloy, wherein the aluminum alloy comprises 0.5 to 3.0% by weight of iron with the balance consisting of aluminum and unavoidable impurities. 
     
     
       2. An aluminum alloy radiator for a plastic molded type semiconductor device, said radiator comprising an anodized aluminum alloy, wherein the aluminum alloy comprises 0.5 to 3.0% by weight of iron and 0.2 to 0.8% by weight of manganese with the balance consisting of aluminum and unavoidable impurities. 
     
     
       3. An aluminum alloy radiator for a plastic molded type semiconductor device, said radiator comprising an anodized aluminum alloy, wherein the aluminum alloy comprises 0.5 to 3.0% by weight of iron and 0.2 to 0.8% by weight of nickel with the balance consisting of aluminum and unavoidable impurities. 
     
     
       4. An aluminum alloy radiator for a plastic molded type semiconductor device, said radiator comprising an anodized aluminum alloy, wherein the aluminum alloy comprises 0.5 to 3.5% by weight of silicon with the balance consisting of aluminum and unavoidable impurities.