Method of packaging electronic components

Abstract

The present invention provides a method of packaging an electronic component, which permits improvement of mounting accuracy of various components against non-uniform deformation of the printed circuit board, and simplification of the correcting operation. The method of the present invention comprises the steps of dividing the printed circuit board c to be placed on the packaging section m into a plurality of prescribed areas c1 . . . , determining a reference origin a1 . . . for mounting the electronic component for each of the plurality of areas, setting the resultant coordinates in the control means 1, measuring a reference origin for each of the plurality of areas by means of detecting means prior to packaging, calculating and setting a correction origin for each area through the control means 1 on the basis of this measurement, controlling the mounting head 2 individually for each area, and mounting the prescribed electronic component.

What is claimed is: 
     
       1. A method of packaging an electronic component, comprising receiving the electronic component from a supply section by means of a mounting head movable in the X and the Y directions in accordance with a prescribed program entered into control means and mounting said electronic components onto a packaging section, which comprises: a step of dividing a printed circuit board to be mounted in the packaging section into a plurality of prescribed areas, determining a reference origin for each area for mounting the electronic components, and setting the resultant coordinates previously in the control means;   a step of, prior to packaging the electronic components into the printed circuit board, measuring a reference origin for each of the areas with a detecting means;   a step of calculating and setting a corrected origin for each area by said control means on the basis of said measurement; and   a step of causing control of a mounting head for each area with reference to said corrected origin for each area to mount prescribed electronic components.   
     
     
       2. The method of packaging electronic components according to claim 1, wherein the calculation of the corrected origin in the step of calculating and setting the corrected origin is carried out through addition/subtraction of a detected value of the detecting means and the previously set reference value. 
     
     
       3. A method of packaging electronic components, comprising receiving electronic components from a supply section by means of a mounting head movable in the X and the Y directions in accordance with an entered program and mounting said electronic components sequentially onto a printed circuit board placed in a packaging section, which comprises the steps of: dividing said printed circuit board into a plurality of areas and determining a reference origin on the printed circuit board for each of the thus divided areas;   previously entering coordinates in the X and the Y directions of the mounting position of said electronic component based on the reference origin on said printed circuit board into said program;   when said printed circuit board is determined to have no deformation,   carrying out the following steps so that the coordinates of the reference origin for each of the divided areas on said printed circuit board agree with the coordinates based on the reference origin on said packaging section corresponding to the foregoing coordinates,   to said printed circuit board placed at a predetermined position on said packaging section:   detecting one of the reference origins on said printed circuit board for each of said divided areas by means of detecting means; comparing the coordinates based on the reference origin on said packaging section obtained from the detection with the coordinates based on the reference origin on said packaging section corresponding to the coordinates of the detected one of the reference origins on said printed circuit board; when values of the coordinates are different, correcting the coordinates in the X and the Y directions of the mounting position of said electronic component based on the reference origin on said printed circuit board within an area to which the reference origin on said printed circuit board in said program belongs in response to the different; and   controlling said mounting head on the basis of this correction, thereby placing said electronic component on said packaging section.   
     
     
       4. The method of packaging an electronic component according to claim 3, wherein: when comparing the coordinates (X', Y') based on the reference origin on the packaging section, resulting from detection, and the coordinates (X, Y) based on the reference origin on said packaging section corresponding to the coordinates of the one of the reference origins on the printed circuit board, and if the values of the coordinates (X'>X, Y'>Y) are different,   the coordinates in the X and the Y directions (X'-X, Y'-Y) of the mounting position of said electronic component based on the reference origin on said printed circuit board within an area to which the reference origin on said printed circuit board in the program belongs is corrected through addition in response to the difference.   
     
     
       5. The method of packaging an electronic component according to claim 3, wherein: when comparing the coordinates (X", Y") based on the reference origin on the packaging section, resulting from detection, and the coordinates (X, Y) based on the reference origin on said packaging section corresponding to the coordinates of the one of the reference origins on the printed circuit board, and if the values of the coordinates (X>X", Y>Y") are different,   the coordinates in the X and the Y directions (X-X", Y-Y") of the mounting position of said electronic component based on the reference origin on said printed circuit board within an area to which the reference origin on said printed circuit board in the program belongs is corrected through subtraction in response to the difference.