Surface mount power supply device

Abstract

The present invention relates to a method and apparatus for manufacturing a surface mount power supply device having effective thermal management. The surface mount power supply device comprises a printed circuit board mounted to a thermal plastic lead frame attach by means of vertically-extending aluminum pins embedded in the lead frame attach. A cylindrical member is centered within the lead frame attach by means of inwardly protruding arms transversely connected to the lead frame attach to allow for a pick-and-place operation.

What is claimed is: 
     
       1. A surface mount device, comprising: a printed circuit board comprising a metal base plate having a top surface and a bottom surface, wherein the top surface of the printed circuit board comprises a copper foil circuitry attached to the metal base plate by a thermally conductive bonding agent, the top surface further having at least one electronic component disposed thereon; and   a lead frame having a plurality of vertically-extending pins connected to a plurality of holes corresponding to each of the pins, the holes being located on the top surface of the printed circuit board;   wherein the pins of the lead frame further extend beyond the lead frame in a direction opposite to that of the printed circuit board for forming an electrical connection with a second printed circuit board.   
     
     
       2. The surface mount device of claim 1, wherein the copper foil circuitry is comprised of electrodeposited copper having high ductility, and the metal base plate is comprised of copper. 
     
     
       3. The surface mount device of claim 1, wherein the lead frame is comprised of thermal plastic. 
     
     
       4. The surface mount device of claim 1, wherein the lead frame comprises a rectangular frame having a cylindrical member positioned therebetween. 
     
     
       5. The surface mount device of claim 1, wherein the surface mount device is a five- to thirty-watt dc-to-dc converter power supply. 
     
     
       6. The surface mount device of claim 1, wherein the surface mount device has a weight no greater than the maximum allowable for being picked up and placed by a surface mount pick-and-place machine. 
     
     
       7. The surface mount device of claim 1, wherein each pin comprises a first end and a second end, the first end being connected with one of the holes and the second end having an arm extending transversely therefrom. 
     
     
       8. The surface mount device of claim 7, wherein the arm further comprises a member having a rectangular top surface vertically extending therefrom for contacting and forming the electrical connection with a corresponding solder pad of the second printed circuit board. 
     
     
       9. The surface mount device of claim 1, wherein the metal base plate is comprised of a material selected from the group consisting of aluminum, copper and copper-molybdenum-copper. 
     
     
       10. The surface mount device of claim 1, wherein the bonding agent is comprised of a material having a high dielectric strength and a low capacitance.