Ceramic-polymer composite material and its use in microelectronics packaging

Abstract

A ceramic-polymer composite material such as part of a microelectronics package is formed of a ceramic mixture of aluminum nitride and boron nitride, and a low-loss polymeric material. The amount of aluminum nitride is preferably from about 50 to about 90 weight percent of the ceramic mixture, but the relative amounts of the two ceramics may be adjusted to achieve thermal expansion and thermal conductivity properties required for a particular application. A mixture of the ceramics and uncured thermosetting polymeric resin is formed, pressed into the shape of the microelectronics base and/or lid, and heated (either concurrently or subsequently) to compress the mixture and cure the polymer.

What is claimed is: 
     
       1. A material comprising a mixture of a ceramic component comprising aluminum nitride powder, and   boron nitride powder; and     a cured polymeric binder component binding the aluminum nitride powder and the boron nitride powder together.   
     
     
       2. The material of claim 1, wherein the ceramic component comprises from about 50 to about 90 weight percent aluminum nitride powder, and   from about 50 to about 10 weight percent boron nitride powder.   
     
     
       3. The material of claim 1, wherein the ceramic component is present in the mixture in an amount of from about 90 to about 95 percent by weight of the total of the ceramic component and the polymeric binder component. 
     
     
       4. The material of claim 1, wherein the polymeric binder component comprises a polymeric material having an electrical loss of less than about 0.015. 
     
     
       5. The material of claim 1, wherein the polymeric binder component is selected from the group consisting of an epoxy and a cyanate ester and combinations thereof. 
     
     
       6. The material of claim 1, wherein the polymeric binder component comprises a cyanate ester. 
     
     
       7. The material of claim 1, wherein the aluminum nitride powder is coated with silicon. 
     
     
       8. The material of claim 1, wherein the weight ratio of the ceramic component to the cured polymeric binder component is about 92.5 to about 7.5. 
     
     
       9. A material comprising a mixture of a ceramic component comprising from about 50 to about 90 parts by weight of aluminum nitride powder, and   from about 50 to about 10 parts by weight of boron nitride powder; and     a cured polymeric binder component binding the aluminum nitride powder and the boron nitride powder together, wherein the polymeric binder component is selected from the group consisting of an epoxy and a cyanate ester and combinations thereof.   
     
     
       10. The material of claim 9, wherein the ceramic component is present in the mixture in an amount of from about 90 to about 95 percent by weight of the total of the ceramic component and the polymeric binder component. 
     
     
       11. The material of claim 1, wherein the ceramic component comprises from about 50 to about 90 weight percent aluminum nitride powder, and   from about 50 to about 10 weight percent boron nitride powder.   
     
     
       12. The material of claim 1, wherein the ceramic component is present in the mixture in an amount of from about 90 to about 95 percent by weight of the total of the ceramic component and the polymeric binder component. 
     
     
       13. The material of claim 9, wherein the polymeric binder component is selected from the group consisting of an epoxy and a cyanate ester and combinations thereof.