US5999407AExpiredUtility
Electronic module with conductively heat-sunk components
Est. expiryOct 22, 2018(expired)· nominal 20-yr term from priority
H10W 40/774H05K 7/20545
72
PatentIndex Score
56
Cited by
6
References
9
Claims
Abstract
A heat transfer arrangement for one or more heat-generating components (18a) on a printed-circuit board (16) includes a heat transfer plate (316) defining an aperture (416) registered with the components. A "vertically" movable heatsink adapter (410) is adjusted to juxtapose its "lower" surface with the "upper" surface of the components to be heat-sunk. A heat-transfer pad (318) may be used between the heatsink adapter (410) and the component (18a). In various embodiments, the heatsink adapter takes the form of circular (410) or rectangular (410R) plugs, a draw-tube (808) arrangement, or a bellows (1010).
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. An electronic assembly, comprising: a thermally conductive frame defining an open, generally flat interior volume; a planar printed wiring board located within said interior volume, said printed wiring board defining first and second surfaces, said printed wiring board being loaded with components adjacent at least said first surface, at least one of said components requiring conductive heat sinking: a heat transfer plate mechanically and thermally coupled to said frame, said heat transfer plate extending generally parallel with the plane of said printed wiring board, and spaced away from said first surface of said printed wiring board in a manner which leaves a gap between that surface of said heat transfer plate which is nearest said printed wiring board and that one of said components requiring conductive heat sinking, said heat transfer plate defining an aperture registered with said one of said components; and a heatsink adapter thermally coupled to the edges of said aperture, and mechanically mounted at least partially within said aperture, for motion in a direction toward and away from said first surface of said printed wiring board, said heatsink adapter being positioned within said aperture in a manner selected for making thermal contact with said one of said components, whereby a conductive heat path extends from said one of said components, through said heatsink adapter, through the edges of said aperture into said heat transfer plate, and through said heat transfer plate to said frame.
2. An assembly according to claim 1, wherein: said aperture is circular; and said heatsink adapter is a thermally conductive, plug in the form of a right circular cylinder having a diameter no greater than the diameter of said circular aperture.
3. An assembly according to claim 2, wherein: said circular aperture is internally threaded; and said heatsink adapter is externally threaded to match the threads of said circular aperture, whereby said heatsink adapter can be moved by relative rotation.
4. An assembly according to claim 1, wherein said aperture is rectangular; and said heatsink adapter is a thermally conductive rectangular plug with a set of dimensions no larger than the dimensions of said aperture, so that said plug is slideably movable within said aperture.
5. An assembly according to claim 4, further comprising: fusion bonding pads located on at least two sides of said heatsink adapter, for facilitating fusion bonding to said edges of said aperture and to said one of said components.
6. An assembly according to claim 1, wherein said heatsink adapter comprises: a drawtube arrangement.
7. An assembly according to claim 6, wherein at least one tube of said drawtube arrangement is spring-loaded to provide pressure tending to hold heat-transfer surfaces in intimate contact.
8. An assembly according to claim 1, wherein said heatsink adapter comprises a bellows, the peripheral portions of which are at least thermally coupled to said edges of said aperture, and a central portion of which is thermally coupled to said one of said components.
9. An assembly according to claim 8, wherein one of said peripheral and central portions of said bellows is permanently mechanically coupled to said edges of said aperture and said one of said components, respectively.Cited by (0)
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References (0)
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