Semiconductor device having resin encapsulated package structure

Abstract

A semiconductor device includes a substrate having a first surface, a second surface and at least one conductor part which are exposed at both the first and second surfaces of the substrate, a semiconductor chip provided on the first surface of the substrate and having a plurality of electrode pads, a plurality of leads, a plurality of bonding-wires electrically connecting the leads and the conductor parts to corresponding ones of the electrode pads of the semiconductor chip, and a resin package encapsulating the semiconductor chip, a part of the leads, and the substrate so that the conductor parts are exposed at the second surface of the substrate.

What is claimed is: 
     
       1. A semiconductor device comprising: a substrate having a first surface, a second surface opposite the first surface, a plurality of conductor parts and insulator parts isolating each of the plurality of conductor parts, each of the plurality of conductor parts being electrode members extending from the first surface to the second surface, wherein a middle one of said plurality of conductor parts is larger than the other ones of said plurality of conductor parts;   a semiconductor chip mounted on the first surface of said substrate and having a plurality of electrode pads;   an external circuit substrate having a mounting surface and a plurality of conductor patterns formed on the mounting surface;   a plurality of leads having respective first ends connected to the mounting surface of said external circuit substrate and having respective second ends, each of said plurality of leads spaced apart from the first surface of said substrate;   first connecting wires electrically connecting the respective second ends of said plurality of leads to corresponding ones of the plurality of electrode pads;   second connecting wires electrically connecting the conductor parts to corresponding ones of the plurality of electrode pads; and   a resin package encapsulating said semiconductor chip, the first ends of said plurality of leads and said substrate, wherein at least a portion of the plurality of conductor parts is exposed at the second surface of said substrate.   
     
     
       2. A semiconductor device comprising: a substrate having a first surface, a second surface opposite the first surface, a plurality of conductor parts and insulator parts isolating each of the plurality of conductor parts, each of the plurality of conductor parts being electrode members extending from the first surface to the second surface, wherein the conductor parts are larger in volume than the adjacent insulator parts;   a semiconductor chip mounted on the first surface of said substrate and having a plurality of electrode pads;   an external circuit substrate having a mounting surface and a plurality of conductor patterns formed on the mounting surface;   a plurality of leads having respective first ends connected to the mounting surface of said external circuit substrate and having respective second ends, each of said plurality of leads spaced apart from the first surface of said substrate;   first connecting wires electrically connecting the respective second ends of said plurality of leads to corresponding ones of the plurality of electrode pads;   second connecting wires electrically connecting the conductor parts to corresponding ones of the plurality of electrode pads; and   a resin package encapsulating said semiconductor chip, the first ends of said plurality of leads and said substrate, wherein at least a portion of each of the plurality of conductor parts is exposed at the second surface of said substrate.   
     
     
       3. A semiconductor device comprising: a substrate having a first surface, a second surface opposite the first surface, a plurality of conductor parts and insulator parts isolating each of the plurality of conductor parts, each of the plurality of conductor parts being electrode members extending from the first surface to the second surface, wherein the total volume of the conductor parts is larger than the total volume of the insulator parts;   a semiconductor chip mounted on the first surface of said substrate and having a plurality of electrode pads;   an external circuit substrate having a mounting surface and a plurality of conductor patterns formed on the mounting surface;   a plurality of leads having respective first ends connected to the mounting surface of said external circuit substrate and having respective second ends, each of said plurality of leads spaced apart from the first surface of said substrate;   first connecting wires electrically connecting the respective second ends of said plurality of leads to corresponding ones of the plurality of electrode pads;   second connecting wires electrically connecting the conductor parts to corresponding ones of the plurality of electrode pads; and   a resin package encapsulating said semiconductor chip, the first ends of said plurality of leads and said substrate, wherein at least a portion of each of the plurality of conductor parts is exposed at the second surface of said substrate.   
     
     
       4. A semiconductor device comprising: a substrate having a first surface, a second surface opposite the first surface, a plurality of conductor parts and insulator parts isolating each of the plurality of conductor parts, each of the plurality of conductor parts being electrode members extending from the first surface to the second surface;   a semiconductor chip mounted on the first surface of said substrate and having a plurality of electrode pads;   an external circuit substrate having a mounting surface and a plurality of conductor patterns formed on the mounting surface;   a plurality of leads having respective first ends connected to the mounting surface of said external circuit substrate and having respective second ends, each of said plurality of leads spaced apart from the first surface of said substrate;   first connecting wires electrically connecting the respective second ends of said plurality of leads to corresponding ones of the plurality of electrode pads;   second connecting wires electrically connecting the conductor parts to corresponding ones of the plurality of electrode pads; and   a resin package encapsulating said semiconductor chip, the first ends of said plurality of leads and said substrate, wherein at least a portion of the plurality of conductor parts is exposed at the second surface of said substrate.