Semiconductor device substrate and method of manufacturing the same

Abstract

A semiconductor device is provided that includes a substrate having a first side, a second side, and a through-hole. An external connection terminal is located on the first side of the substrate, and a chip connection terminal is located on the second side of the substrate. The chip connection terminal is electrically connected to the external connection terminal via the through-hole. In one preferred embodiment, the external connection terminal, the inner portion of the through hole, and a first portion of the chip connection terminal have a hard gold plating, and a second portion of the chip connection terminal has a soft gold plating. In another preferred embodiment, the chip connection terminal, the inner portion of the through hole, and a first portion of the external connection terminal have a soft plating, and a second portion of the external connection terminal has a hard gold plating. Thus, in the present invention, there is no plating boundary located within the through-hole, so the reliability of the interconnection that passes through the through-hole is improved. The present invention also provides a method of manufacturing such a device.

What is claimed is: 
     
       1. A semiconductor device comprising: a substrate having a first side, a second side, and a through-hole formed so as to penetrate the first side and the second side;   an external connection terminal on the first side of the substrate; and   a chip connection terminal on the second side of the substrate, the chip connection terminal being electrically connected to the external connection terminal via the through-hole,   wherein the external connection terminal, an inner portion of the through-hole, and a first portion of the chip connection terminal have a hard gold plating, a second portion of the chip connection terminal has a soft gold plating, and the second portion is continuous with the first portion without overlap.   
     
     
       2. The semiconductor device as defined in claim 1, wherein the external connection terminal has a flat portion. 
     
     
       3. The semiconductor device as defined in claim 1, wherein the chip connection terminal has a flat portion. 
     
     
       4. The semiconductor device as defined in claim 1, wherein the chip connection terminal is located on the periphery of the substrate. 
     
     
       5. A semiconductor device comprising: a substrate having a first side, a second side, and a through-hole formed so as to penetrate the first side and the second side;   an external connection terminal on the first side of the substrate; and   a chip connection terminal on the second side of the substrate, the chip connection terminal being electrically connected to the external connection terminal via the through-hole,   wherein the chip connection terminal, an inner portion of the through-hole, and a first portion of the external connection terminal have a soft plating, a second portion of the external connection terminal has a hard gold plating, and the second portion is continuous with the first portion without overlap.   
     
     
       6. The semiconductor device as defined in claim 5, wherein the external connection terminal has a flat portion. 
     
     
       7. The semiconductor device as defined in claim 5, wherein the chip connection terminal has a flat portion. 
     
     
       8. The semiconductor device as defined in claim 5, wherein the chip connection terminal is located on the periphery of the substrate. 
     
     
       9. A semiconductor device comprising: a substrate having a first side, a second side, and a through-hole formed so as to penetrate the first side and the second side;   an external connection terminal on the first side of the substrate;   a chip connection terminal on the second side of the substrate, the chip connection terminal being electrically connected to the external connection terminal via the through-hole;   a semiconductor chip attached to the second side of the substrate and electrically connected to the chip connection terminal; and   a resin molding over at least a portion of the second side of the substrate,   wherein the external connection terminal, an inner portion of the through-hole, and a first portion of the chip connection terminal have a hard hold plating, a second portion of the chip connection terminal has a soft gold plating, and the second portion is continuous with the first portion without overlap.   
     
     
       10. The semiconductor device as defined in claim 9, wherein the chip connection terminal and the semiconductor chip are connected using a wire. 
     
     
       11. The semiconductor device as defined in claim 9, wherein the chip connection terminal and the semiconductor chip are connected using a flip-chip connection. 
     
     
       12. A semiconductor device substrate comprising: a substrate having a first side, a second side, and a through-hole formed so as to penetrate the first side and the second side;   an external connection terminal on the first side of the substrate;   a chip connection terminal on the second side of the substrate, the chip connection terminal being electrically connected to the external connection terminal via the through-hole;   a semiconductor chip attached to the second side of the substrate and electrically connected to the chip connection terminal; and   a resin molding over at least a portion of the second side of the substrate,   wherein the chip connection terminal, an inner portion of the through-hole, and a first portion of the external connection terminal have a soft gold plating, a second portion of the external connection terminal has a hard gold plating, and the second portion is continuous with the first portion without overlap.   
     
     
       13. The semiconductor device as defined in claim 12, wherein the chip connection terminal and the semiconductor chip are connected using a wire. 
     
     
       14. The semiconductor device as defined in claim 12, wherein the chip connection terminal and the semiconductor chip are connected using a flip-chip connection. 
     
     
       15. A card-type module that includes a semiconductor device, the card-type module comprising: a card-type supporter having a recess;   a substrate having a first side, a second side, and a through-hole formed so as to penetrate the first side and the second side;   an external connection terminal on the first side of the substrate;   a chip connection terminal on the second side of the substrate, the chip connection terminal being electrically connected to the external connection terminal via the through-hole;   a semiconductor chip attached to the second side of the substrate and electrically connected to the chip connection terminal; and   a resin molding over the at least a portion of the second side of the substrate,   wherein the external connection terminal, an inner portion of the through-hole, and a first portion of the chip connection terminal have a hard gold plating, a second portion of the chip connection terminal has a soft gold plating, the second portion is continuous with the first portion without overlap, and the substrate is bonded to the recess of the card-type supporter by burying the resin-molded side of the substrate.   
     
     
       16. A card-type module that includes a semi-conductor device, the card-type module comprising: a card-type supporter having a recess;   a substrate having a first side, a second side, and a through-hole formed so as to penetrate the first side and the second side;   an external connection terminal on the first side of the substrate;   a chip connection terminal on the first side of the substrate, the chip connection terminal being electrically connected to the external connection terminal via the through-hole;   a semiconductor chip attached to the second side of the substrate and electrically connected to the chip connection terminal; and   a resin molding over the at least a portion of the second side of the substrate,   wherein the chip connection terminal, an inner portion of the through-hole, and a first portion of the external connection terminal have a soft gold plating, a second portion of the external connection terminal has a hard gold plating, the second portion is continuous with the first portion without overlap, and the substrate is bonded to the recess of the card-type supporter by burying the resin-molded side of the substrate.   
     
     
       17. A memory device comprising: a card type module including: a card-type supporter having a recess;   a substrate having a first side, a second side, and a through-hole formed so as to penetrate the first side and the second side;   an external connection terminal on the first side of the substrate;   a chip connection terminal on the second side of the substrate, the chip connection terminal being electrically connected to the external connection terminal via the through-hole;   a semiconductor chip attached to the second side of the substrate and electrically connected to the chip connection terminal; and   a resin molding over the at least a portion of the second side of the substrate; and   a main body including: a first connector connected to the external connection terminal of the card-type module;   a second connector connected to an apparatus; and   an interface control circuit connected to the first and second connectors,   wherein the external connection terminal, an inner portion of the through-hole, and a first portion of the chip connection terminal have a hard gold plating, a second portion of the chip connection terminal has a soft gold plating, the second portion is continuous with the first portion without overlap, and the substrate is bonded to the recess of the card-type supported by burying the resin-molded side of the substrate.       
     
     
       18. A memory device comprising: a card-type module including: a card-type supporter having a recess;   a substrate having a first side, a second side, and a through-hole formed so as to penetrate the first side and the second side;   an external connection terminal on the first side of the substrate;   a chip connection terminal on the second side of the substrate, the chip connection terminal being electrically connected to the external connection terminal via the through-hole;   a semiconductor chip attached to the second side of the substrate and electrically connected to the chip connection terminal; and   a resin molding over the at least a portion of the   second side of the substrate; and   a main body including: a first connector connected to the external connection terminal of the card-type module;   a second connector connected to an apparatus; and   an interface control circuit connected to the first and second connectors,   wherein the chip connection terminal, an inner portion of the through-hole, and a first portion of the external connection terminal have a soft gold plating, a second portion of the external connection terminal has a hard gold plating, the second portion is continuous with the first portion without overlap, and the substrate is bonded to the recess of the card-type supporter by burying the resin-molded side of the substrate.