Heat-dissipating structure of an electronic part

Abstract

A heat-dissipating structure in which a cylindrical projecting portion is formed in a shield case so as to project inwardly of the shield case and contact an electronic part encased in the shield case. This heat-dissipating structure has high heat conductivity and can reduce the amount of interfering signals being emitted from or rushing into the case.

What is claimed is: 
     
       1. A heat-dissipating structure of a heat generating electronic part, comprising: a shield case encasing said electronic part, said shield case having a cylindrical projecting portion formed so as to project inwardly of said shield case, wherein said cylindrical projecting portion comprises a bottom having a hole, said bottom being in contact with said electronic part, wherein said cylindrical projecting portion further comprises a thermally-conductive, adhesive-like substance filled therein, said thermally-conductive, adhesive-like substance projecting through said hole and contacting said electronic part.   
     
     
       2. A heat-dissipating structure of a heat generating electronic part, comprising: a shield case encasing said electronic part, said shield case having a cylindrical projecting portion formed so as to project inwardly of said shield case, wherein said cylindrical projecting portion comprises a bottom in contact with said electronic part, said bottom comprising a plurality of radially spaced resilient tongue pieces, said tongue pieces resiliently contacting said electronic part, wherein said cylindrical projecting portion further comprises a thermally-conductive, adhesive-like substance filled therein, said thermally-conductive, adhesive-like substance projecting through said bottom and contacting said electronic part.