Polishing apparatus for optical fibers having a pressure transducer and a magnetically attached leveling device

Abstract

A polishing apparatus for polishing optical fibers includes a polishing pad and a polishing arm arranged above the polishing pad and which is selectively brought into contact with the polishing pad. A leveling device is magnetically attached to a lower end of the polishing arm. The leveling device has a plurality of optical fiber ends extending downwardly from a lower surface thereof to contact the polishing pad. The polishing arm also contains a pressure transducer for measuring a pressure applied by the polishing arm when the polishing arm contacts the polishing pad. The magnetic attachment between the polishing arm and leveling device may be carried out using a permanent magnet or electromagnet.

Having thus described our invention, what we claim as new and desire to secure by Letters Patent is as follows: 
     
       1. A polishing apparatus for polishing optical fibers, comprising: a polishing pad;   a polishing arm vertically arranged above said polishing pad;   a leveling device magnetically attached to a lower end of said polishing arm, and which is selectively brought into contact with said polishing pad, said leveling device having a plurality of optical fiber ends extending downwardly from a lower surface thereof for contacting said polishing pad, said lower end of said polishing arm comprising a magnet contacting said leveling device;   said leveling device further comprising: a base for aligning and securing said plurality of optical fibers,   a housing centrally arranged on said base and said housing having a central recess, and   a magnetic ball disposed in said recess,   wherein an upper surface of said magnetic ball contacts a lower surface of said magnet of said polishing arm to provide said magnetic attachment between said leveling device and said polishing arm; and     a pressure transducer in said polishing arm for measuring a pressure applied by said polishing arm when said leveling device of said polishing arm contacts said polishing pad.   
     
     
       2. The polishing apparatus of claim 1, wherein said recess contacts an area not greater than one-half of an outer spherical surface area of said magnetic ball. 
     
     
       3. The polishing apparatus of claim 2, said leveling device further comprising a housing plate having a central opening disposed on an upper surface of said housing for securing said magnetic ball in said housing, and wherein said magnetic ball extends above a horizontal plane defined by an upper surface of said housing plate. 
     
     
       4. The polishing apparatus of claim 3, wherein said magnet is a permanent magnet. 
     
     
       5. The polishing apparatus of claim 3, wherein said magnet is an electromagnet. 
     
     
       6. The polishing apparatus of claim 3, said polishing arm comprising an upper plate and a plurality of balancing devices, each attached at one end to a peripheral part of said upper plate and at another end to a peripheral part of said housing plate. 
     
     
       7. The polishing apparatus of claim 3, wherein said magnetic attachment is of sufficient strength to prevent said housing from spinning when said polishing pad rotates during a polishing operation, while still allowing said leveling device to tilt in a horizontal plane defined by a polishing surface of said polishing pad. 
     
     
       8. The polishing apparatus of claim 1, wherein said recess contacts an area greater than one-half of an outer spherical surface area of said magnetic ball. 
     
     
       9. The polishing apparatus of claim 8, wherein an upper surface of said magnetic ball extends above a horizontal plane defined by an upper surface of said leveling device, and contacts a lower surface of said magnet of said polishing arm. 
     
     
       10. The polishing apparatus of claim 9, wherein said magnetic attachment is of sufficient strength to prevent said housing from spinning when said polishing pad rotates during a polishing operation, while still allowing said leveling device to tilt in a horizontal plane defined by a polishing surface of said polishing pad. 
     
     
       11. The polishing apparatus of claim 6, wherein said plurality of balancing devices are spaced at equal intervals between the peripheral part of said upper plate and the peripheral part of said housing plate. 
     
     
       12. The polishing apparatus of claim 11, wherein said plurality of balancing devices comprise three springs. 
     
     
       13. The polishing apparatus of claim 11, wherein said plurality of balancing devices comprise three pressure transducers.