US6113467AExpiredUtility

Polishing machine and polishing method

60
Assignee: TOSHIBA KKPriority: Apr 10, 1998Filed: Feb 19, 1999Granted: Sep 5, 2000
Est. expiryApr 10, 2018(expired)· nominal 20-yr term from priority
Inventors:Eijiro Koike
B24B 1/005B24B 37/08
60
PatentIndex Score
25
Cited by
8
References
6
Claims

Abstract

A method of polishing which includes rotatably supporting a workpiece, positioning polishing plates in such a manner that flat surfaces of the polishing plates oppose one another and are in contact with a surface of the workpiece, and polishing the workpiece by rotating the workpiece around a central axis thereof by use of a workpiece rotator. The method also includes reciprocating the polishing plates on the surface of the workpiece in a radial direction of the workpiece while pressing the workpiece between the flat surfaces of the polishing plates.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A method of polishing, comprising the steps of: rotatably supporting a workpiece;   positioning a plurality of polishing plates in such a manner that flat surfaces of the polishing plates oppose one another and are in contact with a surface of the workpiece;   polishing the workpiece by rotating the workpiece around a central axis thereof by use of a workpiece rotator; and   reciprocating the polishing plates on the surface of the workpiece in a radial direction of the workpiece while pressing the workpiece between the flat surfaces of the polishing plates.   
     
     
       2. A method of polishing according to claim 1, further comprising the step of: providing a polishing cloth on each of the flat surfaces of the polishing plates.   
     
     
       3. A method of polishing according to claim 1, wherein the polishing plates are reciprocated while pressure is exerted thereon via a flexible joint. 
     
     
       4. A method of polishing according to claim 1, wherein the polishing plates are rotated while being reciprocated. 
     
     
       5. A method of polishing according to claim 1, wherein at the step of polishing, a magnetic force is exerted onto the surface of the workpiece, and a polishing liquid containing a magnetic fluid is supplied onto the surface of the workpiece. 
     
     
       6. A method of polishing according to claim 1, wherein the workpiece is a semiconductor wafer.

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References (0)

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