Electronic component having a tin alloy plating film

Abstract

An electronic component has a body; a metal film formed on the body; and a tin alloy plating film formed on the metal film. The tin alloy plating film contains Sn and at least one additive metal selected from the group consisting of Bi, Ni, Ag, Zn and Co.

What is claimed is:  
     
       1. An electronic component comprising: 
       a body;  
       a metal film on the body; and  
       a tin alloy plating film on the metal film, the tin alloy plating film comprising Sn and at least one additive metal selected from the group consisting of Bi, Ni, Ag, Zn and Co.  
     
     
       2. The electronic component according to claim  1 , wherein the metal film comprises Ag or Cu or both and wherein there is no Ni containing layer disposed between the metal film and tin alloy plating film. 
     
     
       3. The electronic component according to claim  2 , wherein the content ratio of the additive metal is within the range of about 0.5 to 20 wt %. 
     
     
       4. The electronic component according to claim  3 , wherein the additive metal is Bi, and the content ratio of Bi is within the range of about 1 to 20 wt %. 
     
     
       5. The electronic component according to claim  4 , wherein the content ratio of Bi is within the range of about 5 to 20 wt %. 
     
     
       6. The electronic component according to claim  3 , wherein the additive metal is Ni, and the content ratio of Ni is within the range of about 0.5 to 10 wt %. 
     
     
       7. The electronic component according to claim  6 , wherein the content ratio of Ni is within the range of about 1 to 2 wt %. 
     
     
       8. The electronic component according to claim  3 , wherein the additive metal is Ag, and the content ratio of Ag is within the range of about 1 to 20 wt %. 
     
     
       9. The electronic component according to claim  8 , wherein the content ratio of Ag is within the range of 5 to 10 wt %. 
     
     
       10. The electronic component according to claim  3 , wherein the additive metal is Zn and the content ratio of Zn is within the range of about 1 to 20 wt %. 
     
     
       11. The electronic component according to claim  10 , wherein the content ratio of Zn is within the range of about 5 to 8 wt %. 
     
     
       12. The electronic component according to claim  3 , wherein the additive metal is Co and the content ratio of Co is within the range of about 0.5 to 10 wt %. 
     
     
       13. The electronic component according to claim  12 , wherein the content ratio of Co is within the range of about 1 to 2 wt %. 
     
     
       14. The electronic component according to claim  1 , wherein the body is selected from the group consisting of dielectric ceramic, piezoelectric ceramic, semiconductor ceramic, magnetic ceramic and insulating ceramic. 
     
     
       15. The electronic component according to claim  14 , wherein the body comprises a plurality of ceramic layers and a plurality of internal electrodes each of which is disposed between adjacent ceramic layers and the metal film is electrically connected to at least two of the internal electrodes. 
     
     
       16. The electronic component according to claim  15  having a second said metal film and a second said tin alloy plating film on the second said metal film. 
     
     
       17. The electronic component according to claim  16  wherein the second metal film is electrically connected to at least two internal electrodes to which the first metal film is not electrically connected. 
     
     
       18. The electronic component according to claim  17  wherein at least one internal electrode electrically connected to one of the first and second metal films is disposed between two internal electrodes electrically connected to the other of the first and second metal films. 
     
     
       19. The electronic component according to claim  1  having a second said metal film and a second said tin alloy plating film on the second said metal film.