Heatsink with high thermal conductivity dielectric

Abstract

The present invention provides a heatsink for use with a heat-generating electrical component. The heatsink comprises a spine having opposing sides, cooling fins extending from the spine, and a dielectric layer adhered to at least one of the opposing sides. The dielectric layer has a thermal conductivity of at least about 1 W/m° C. The heatsink may further comprise a metal layer adhered to the dielectric layer. The metal layer provides a surface to which an electric component can be adhered. The heatsink can further include a heat-generating component adhered to the metal layer. In another aspect, the heat-generating component is a surface-mount electrical component adhered to the metal layer with solder.

What is claimed is:  
     
       1. For use with a heat-generating electrical component, a heatsink, comprising: 
       a spine having opposing sides;  
       cooling fins extending from said spine;  
       a dielectric layer adhered to at least one of said opposing sides; and  
       a metal layer adhered to said dielectric layer, said metal layer including concentric patterns on said dielectric layer to provide mounting locations for electrical components having mounting footprints of different sizes.  
     
     
       2. The heatsink as recited in claim  1  further comprising a heat-generating component adhered to said metal layer. 
     
     
       3. The heatsink as recited in claim  3  wherein said heat-generating component is a surface-mount electrical component adhered to said metal layer with solder. 
     
     
       4. The heatsink as recited in claim  1  wherein said metal layer forms at least two concentric patterns. 
     
     
       5. The heatsink as recited in claim  1  wherein each of said concentric patterns provides a self-aligning pattern for adhering a surface-mountable electrical component thereon during a soldering process. 
     
     
       6. The heatsink as recited in claim  5  wherein said electrical component has electrical leads extending therefrom with each of said electrical leads configured to be received in a corresponding contact opening within a printed wiring board, said self-aligning pattern aligning each of said electrical leads with one of said corresponding contact openings, respectively. 
     
     
       7. The heatsink as recited in claim  1  further comprising a heat-generating component adhered to said dielectric layer. 
     
     
       8. The heatsink as recited in claim  1  wherein a thermal conductivity of said dielectric layer ranges from about 1 W/m° C. to about 15 W/m° C. 
     
     
       9. The heatsink as recited in claim  1  further comprising dielectric layers adhered to each of said opposing sides and a metal layer adhered to each of said dielectric layers. 
     
     
       10. The heatsink as recited in claim  9  further comprising an electrical component adhered to each of said metal layers. 
     
     
       11. A printed wiring board, comprising: 
       electrical components mounted on and electrically connected to said printed wiring board; and  
       a heatsink mounted on said printed wiring board and including:  
       a spine having opposing sides;  
       cooling fins extending from said spine;  
       a dielectric layer adhered to at least one of said opposing sides;  
       a metal layer adhered to said dielectric layer, said metal layer including concentric patterns on said dielectric layer to provide self-aligning mounting locations for electrical components having mounting footprints of different sizes; and  
       a heat generating electrical component adhered to said metal layer, said electrical component having electrical leads extending therefrom by which said electrical component can be electrically connected to said printed wiring board.  
     
     
       12. The printed wiring board as recited in claim  11  wherein said printed wiring board includes contact openings formed therein and each of said electrical leads is configured to be received in a corresponding one of said contact openings, said self-aligning pattern aligning each of said electrical leads with said one of said corresponding contact openings, respectively. 
     
     
       13. The printed wiring board as recited in claim  11  wherein said heat-generating component is a surface-mount electrical component adhered to said metal layer with solder. 
     
     
       14. The printed wiring board as recited in claim  11  wherein said metal layer forms at least two concentric patterns. 
     
     
       15. The printed wiring board as recited in claim  11  wherein each of said concentric patterns provides a self-aligning pattern for aligning said electrical leads to an electrical contact point on said printed wiring board. 
     
     
       16. The printed wiring board as recited in claim  11  wherein a thermal conductivity of said dielectric layer ranges from about 1 W/m° C. to about 15 W/m° C.