Charge coupled device with nonreflective coating

Abstract

A CCD assembly comprising: a semiconductor chip having a first face surface; an active light sensitive region located on the first face surface; an inactive region located on the first face surface next adjacent the active region; and a nonreflective coating applied over at least a portion of the inactive region.

What is claimed is:  
     
       1. A CCD assembly comprising: 
       a semiconductor chip having a first face surface;  
       an active light sensitive region located on said first face surface;  
       an inactive region located on said first face surface next adjacent said active region;  
       a nonreflective coating applied over at least a portion of said inactive region.  
     
     
       2. The CCD assembly of claim  1 , wherein said nonreflective coating comprises plastic. 
     
     
       3. The CCD assembly of claim  2 , wherein said coating further comprises pigment. 
     
     
       4. The CCD assembly of claim  1 , wherein said nonreflective coating comprises a dye. 
     
     
       5. The CCD assembly of claim  1 , wherein said nonreflective coating has a thickness of between about 1 and 10 micromillimeters. 
     
     
       6. The CCD assembly of claim  1 , wherein said nonreflective coating has a thickness of between about 3 and 5 micromillimeters. 
     
     
       7. The CCD assembly of claim  3 , wherein said nonreflective coating has a thickness of between about 1 and 10 micromillimeters. 
     
     
       8. The CCD assembly of claim  3 , wherein said nonreflective coating has a thickness of between about 3 and 5 micromillimeters. 
     
     
       9. The CCD assembly of claim  4 , wherein said nonreflective coating has a thickness of between about 1 and 10 micromillimeters. 
     
     
       10. The CCD assembly of claim  4 , wherein said nonreflective coating has a thickness of between about 3 and 5 micromillimeters. 
     
     
       11. An optical scanner comprising: 
       an imaging assembly and  
       a CCD assembly comprising:  
       a semiconductor chip having a first face surface;  
       at least one active light sensitive region located on said first face surface;  
       an inactive region located on said first face surface next adjacent said active region;  
       a nonreflective coating applied over at least a portion of said inactive region.  
     
     
       12. The Optical scanner of claim  11  wherein said at least one active region comprises three linear photosensor arrays and wherein a nonreflective coating is applied to at least a portion of an inactive region surrounding each of said linear arrays.