Power amplifier and loudspeaker frame integration

Abstract

An integrated amplifier and speaker system includes a speaker having a motor assembly and a frame. A power stage of the amplifier is mounted in thermal communication with the motor assembly and/or the frame. Heat generated by the power stage is thereby sunk to the motor assembly and frame.

What is claimed is:  
     
       1. An integrated amplifier and speaker apparatus comprising a speaker having a diaphragm, a motor assembly and a frame, the frame at least partly supporting the diaphragm for movement in the frame, the motor assembly including a front plate, a back plate, and a generally annular permanent magnet positioned between the front plate and the back plate, an amplifier having a power stage and a mounting for the power stage, the power stage mounting being attached in heat conducting connection to the power stage and to at least one of the front plate and frame so that heat generated by the power stage is conducted through the heat conducting connection to the at least one of the front plate and frame. 
     
     
       2. The apparatus of claim  1  wherein the power stage mounting comprises a thermally conductive material positioned between the at least one of the front plate and frame and the power stage. 
     
     
       3. The apparatus of claim  1  wherein the power stage mounting comprises a thermally conductive bracket, the bracket attached in heat conducting connection to the at least one of the front plate and frame, and the power stage attached in heat conducting connection to the bracket. 
     
     
       4. The apparatus of claim  3  further comprising a first thermally conductive material positioned between at least one of: the bracket and the at least one of the front plate and frame; and, the bracket and power stage. 
     
     
       5. The apparatus of claim  4  further comprising a second thermally conductive material positioned between the other of: the bracket and the at least one of the front plate and frame; and, the bracket and power stage. 
     
     
       6. The apparatus of claim  3  further comprising a printed circuit board, the power stage mounted in electrical communication with an electrical circuit provided on the printed circuit board. 
     
     
       7. The apparatus of claim  6  wherein the printed circuit board is mounted on the bracket. 
     
     
       8. The apparatus of claim  7  further comprising a thermally conductive electrical insulator positioned between the bracket and the power stage.