Micro-flex technology in semiconductor packages

Abstract

Thin-film microflex twisted-wire pair and other connectors are disclosed. Semiconductor packages include microflex technology that electrically connects at least one chip to another level of packaging. Microflex connectors, such as thin-film twisted-wire pair connectors according to the present invention provide superior electrical performance, which includes reduced line inductance, incorporation of integrated passive components, and attachment of discrete passive and active components to the microflex. All of these features enable operation of a chip at increased frequencies.

What is claimed is:  
     
       1. An apparatus comprising: 
       a thin-film microflex twisted-wire pair connector for electrically connecting at least one chip to another device; wherein said thin-film microflex connector comprises:  
       a first thin-film metal wire defined on a first thin-film layer;  
       a thin-film interconnection layer; and  
       a second thin-film metal wire defined on a second thin-film metal layer;  
       wherein the first thin-film metal wire crosses over the second thin-film metal wire and an end portion of the first thin-film metal wire is connected to an end of the second thin-film metal wire through said thin-film interconnection layer.  
     
     
       2. The apparatus of claim  1 , wherein said thin-film microflex connector further comprises a capacitor in parallel with a power source. 
     
     
       3. The apparatus of claim  1 , wherein said thin-film microflex connector further comprises an integrated resistor. 
     
     
       4. The apparatus of claim  1 , wherein said thin-film microflex connector connects to discrete devices through a second connection on said microflex connector. 
     
     
       5. The apparatus of claim  1 , further comprising: 
       a leadframe, wherein said thin-film microflex connector is electrically connected to a lead of said leadframe and to said at least one chip.  
     
     
       6. The apparatus of claim  5 , wherein said thin-film microflex connector is electrically connected to a metal substrate. 
     
     
       7. The apparatus of claim  5 , wherein a metal substrate is etched away from said thin-film microflex connector. 
     
     
       8. The apparatus of claim  5 , wherein said at least one chip comprises: 
       connections for electrically connecting said at least one chip to said thin-film microflex connector and said leadframe.  
     
     
       9. The apparatus of claim  5 , wherein said at least one chip comprises: 
       a first chip electrically and mechanically connected to the thin-film microflex connector; and  
       a second chip electrically connected to said first chip.  
     
     
       10. The apparatus of claim  1 , wherein said at least one chip comprises: 
       a first chip electrically and mechanically connected to the thin-film microflex connector; and  
       a second chip electrically connected to said first chip.  
     
     
       11. The apparatus of claim  1 , wherein said at least one chip comprises: 
       a first chip electrically and mechanically connected to the thin-film microflex connector; and  
       a second chip electrically connected to said first chip and electrically and mechanically connected to said thin-film microflex connector.  
     
     
       12. The apparatus of claim  10 , wherein said thin-film microflex connector is mechanically connected to a top and a bottom portion of said first chip. 
     
     
       13. The apparatus of claim  1 , wherein said thin-film microflex connector further comprises a microflex top portion and a microflex bottom portion, wherein said microflex top portion is mechanically connected to a chip top portion of said at least one chip and said microflex bottom portion is mechanically connected to a chip bottom portion of said at least one chip. 
     
     
       14. The apparatus of claim  13 , wherein said thin-film microflex connector further comprises: electrical connections at said bottom portion of said thin-film microflex connector for electrically connecting said chip top portion to said other device. 
     
     
       15. A chip package comprising: 
       at least one chip;  
       a thin-film microflex connector connected to said at least one chip for electrically connecting said at least one chip to an outside device, the thin-film microflex connector including a first thin-film metal wire defined on a first thin-film layer, a thin-film interconnection layer, and a second thin-film metal wire defined on a second thin-film metal layer, wherein the first thin-film metal wire crosses over the second thin-film metal wire and an end portion of the first thin-film metal wire is connected to an end of the second thin-film metal wire through said thin-film interconnection layer; and  
       an encapsulation connected to said at least one chip and said microflex connector for protecting said at least one chip and said microflex connector.  
     
     
       16. The chip package of claim  15 , wherein said thin-film microflex connector is a twisted-wire pair connector. 
     
     
       17. The chip package of claim  15 , further comprising: 
       a leadframe, wherein said microflex connector is electrically connected to an outer lead of said leadframe and to said at least one chip.  
     
     
       18. The chip package of claim  15 , wherein said at least one chip comprises: 
       a first chip electrically and mechanically connected to thin-film microflex connector; and  
       a second chip electrically connected to said first chip.  
     
     
       19. The apparatus of claim  1 , wherein said first chip is mounted on said second chip, and wherein thin film microflex is mechamcally connected to a top surface of said second chip and thin film microflex is mechanically connected to a bottom surface of said second chip. 
     
     
       20. A chip stack, comprising 
       a first integrated circuit chip and a second integrated circuit chip, said first chip stacked on said second chip, said first chip having a first major surface having first contacts, said first contacts defining a first contact plane, said second chip having a second major surface facing away from said first chip, said second chip having an edge;  
       second contacts defining a second contact plane, said second contact plane extending under said second major surface; and  
       a flexible insulator having at least one layer of metal thereon extending across said edge for connecting contacts in said first contact plane and contacts in said second contact plane.  
     
     
       21. The apparatus of claim  20 , wherein said flexible insulator is adhesively connected to said second chip. 
     
     
       22. The apparatus of claim  20 , wherein flexible insulator is mechanically connected to at least two surfaces of said second chip. 
     
     
       23. The apparatus of claim  20 , wherein said second contacts are for external connection. 
     
     
       24. The apparatus of claim  20 , wherein said flexible insulator having at least one layer of metal thereon comprises a twisted pair. 
     
     
       25. The apparatus of claim  20 , wherein said flexible insulator having at least one layer of metal thereon comprises a capacitor. 
     
     
       26. The apparatus of claim  20 , wherein said flexible insulator having at least one layer of metal thereon comprises a resistor. 
     
     
       27. An apparatus, comprising: 
       a first chip electrically and mechanically connected to a thin-film microflex connector;  
       a second chip electrically connected to said first chip, said thin-film microflex connector mechanically connected to a top and a bottom portion of said first chip;  
       said thin-film microflex connector comprising a first thin-film metal wire defined on a first thin-film layer, a thin-film interconnection layer, and a second thin-film metal wire defined on a second thin-film metal layer, wherein the first thin-film metal wire crosses over the second thin-film metal wire and an end portion of the first thin-film metal where is connected to an end of the second thin-film metal wire through said thin-film interconnection layer.  
     
     
       28. An apparatus comprising: 
       a thin-film microflex connector for electrically connecting at least one chip to another device, said thin-film microflex connector comprising a first thin-film metal wire defined on a first thin-film layer, a thin-film interconnection layer, and a second thin-film metal wire defined on a second thin-film metal layer, wherein the first thin-film metal wire crosses over the second thin-film metal wire and an end portion of the first thin-film metal wire is connected to an end of the second thin-film metal wire through said thin-film interconnection layer;  
       said thin-film microflex connector further comprising a microflex top portion and a microflex bottom portion, wherein said microflex top portion is mechanically connected to a chip top portion of said at least one chip and said microflex bottom portion is mechanically connected to a chip bottom portion of said at least one chip.  
     
     
       29. A chip package comprising: 
       a thin-film microflex connector;  
       a stack of chips electrically connected to the thin-film microflex connector on at least two faces of the stack; and  
       an encapsulation connected to the stack and the microflex connector for protecting the stack and the microflex connector.  
     
     
       30. An apparatus comprising: 
       a chip stack comprising a first chip and a second chip;  
       a microflex connector for electrically connecting said first chip for external connection;  
       said thin-film microflex connector comprising a first thin-film metal wire defined on a first thin-film layer, a thin-film interconnection layer, and a second thin-film metal wire defined on a second thin-film metal layer, wherein the first thin-film metal wire crosses over the second thin-film metal wire and an end portion of the first thin-film metal wire is connected to an end of the second thin-film metal wire through said thin-film interconnection layer.  
     
     
       31. An apparatus comprising: 
       a first chip and a second chip, said first chip electrically and mechanically connected to a thin-film microflex connector, said first chip and said microflex connector mounted on said second chip;  
       the thin-film microflex connector comprising a first thin-film metal wire defined on a first thin-film layer, a thin-film interconnection layer, and a second thin-film metal wire defined on a second thin-film metal layer, wherein the first thin-film metal wire crosses over the second thin-film metal wire and an end portion of the first thin-film metal wire is connected to an end of the second thin-film metal wire through said thin-film interconnection layer.  
     
     
       32. A chip package comprising: 
       a thin-film microflex connector including a first thin-film metal wire defined on a first thin-film layer, a thin-film interconnection layer, and a second thin-film metal wire defined on a second thin-film metal layer, wherein the first thin-film metal wire crosses over the second thin-film metal wire and an end portion of the first thin-film metal wire is connected to an end of the second thin-film metal wire through said thin-film interconnection layer;  
       a stack of chips electrically connected to the thin-film microflex connector on at least two faces of the stack; and  
       an encapsulation connected to the stack and the microflex connector for protecting the stack and the microflex connector.