Brush alignment method

Abstract

A brush alignment apparatus and method of using the same for aligning a hollow cylindrical brush on a cylindrical roller member comprising first and second ends and an outer surface defining a internal cavity, provided with a plurality of orifices extending from the outer surface to the internal cavity, a first receptacle having a channel running therethrough in fluid communication with the first end of the roller member, a second receptacle, a spine member, a first support arm supporting the first end of the roller member and a second arm supporting the second end of the roller member. In operation, the brush is applied onto the surface of the roller such that the inner surface of the brush and the outer surface of the roller are in frictional communication with one another, a layer of fluid is generated between the surfaces of the roller and the brush sufficient to substantially dissipate any frictional contact between the brush and the roller, the layer is maintained between the surfaces of the roller and the brush for sufficient time and at sufficient strength to allow the brush to attain a position of static alignment, at which time the layer is allowed to dissipate thereby returning the brush to a position of frictional communication with the surface of the roller, while substantially retaining it in a state of static alignment.

What is claimed is:  
     
       1. A method of aligning a brush on a roller comprising: 
       mounting the brush onto the roller such that an inner surface of the brush and an outer surface of the roller are in frictional contact with one another;  
       creating a layer of fluid between the surfaces of the roller and the brush to substantially dissipate said frictional contact between the brush and the roller;  
       maintaining the layer of fluid between the surfaces of the roller and the brush to allow the brush to attain a position of static alignment with the outer surface of the roller; and  
       eliminating the layer of fluid to return the brush to a position of frictional contact with the outer surface of the roller, while substantially retaining the position of static alignment.  
     
     
       2. The method of claim  1 , wherein the brush is formed of a resilient material. 
     
     
       3. The method of claim  2 , wherein the inner surface of the brush has a cross-sectional diameter generally equal to or smaller than a cross-sectional diameter of the outer surface of the roller. 
     
     
       4. A method of aligning a brush on a roller comprising: 
       mounting the brush onto the roller such that an inner surface of the brush and an outer surface of the roller are in frictional contact with one another;  
       employing a pressurized fluid source to create a layer of fluid between the surfaces of the roller and the brush to substantially dissipate said frictional contact between the brush and the roller;  
       maintaining the layer of fluid between the surfaces of the roller and the brush to allow the brush to attain a position of static alignment with the outer surface of the roller; and  
       eliminating the layer of fluid to return the brush to a position of frictional contact with the outer surface of the roller, while substantially retaining the position of static alignment.  
     
     
       5. The method of claim  4 , wherein the pressurized fluid source is in fluid communication with the roller. 
     
     
       6. The method of claim  4 , wherein the roller defines an internal cavity having a plurality of orifices which extend through the outer surface of the roller to the internal cavity thereof. 
     
     
       7. The method of claim  6 , wherein the fluid passes through the plurality of orifices to create the layer of fluid between the surfaces of the roller and the brush and wherein said orifices permit the layer of fluid between the surfaces of the roller and the brush to be eliminated. 
     
     
       8. A method of cleaning a semiconductor wafer comprising: 
       mounting a brush onto a roller such that an inner surface of the brush and an outer surface of the roller are in frictional contact with one another;  
       creating a layer of fluid between the surfaces of the roller and the brush to substantially dissipate said frictional contact between the brush and the roller;  
       maintaining the layer of fluid between the surfaces of the roller and the brush to allow the brush to attain a position of static alignment with the outer surface of the roller;  
       eliminating the layer of fluid to return the brush to a position of frictional contact with the outer surface of the roller, while substantially retaining a state of static alignment with the outer surface of the roller; and  
       rotating the brush about its axis while holding a wafer in frictional contact with the brush to clean a surface of the wafer.  
     
     
       9. The method of claim.  8 , further comprising: 
       applying a cleaning fluid onto the surface of the wafer to be cleaned.  
     
     
       10. The method of claim  8 , further comprising: 
       moving the brush laterally across the surface of the wafer until the surface of the wafer has been contacted by the brush.  
     
     
       11. The method of claim  8 , wherein the brush is formed of a resilient material. 
     
     
       12. The method of claim  8 , wherein the inner surface of the brush has a cross-sectional diameter generally equal to or smaller than a cross-sectional diameter of the outer surface of the roller. 
     
     
       13. A method of cleaning a semiconductor wafer comprising: 
       mounting a brush onto a roller such that an inner surface of the brush and an outer surface of the roller are in frictional contact with one another;  
       creating a layer of fluid between the surfaces of the roller and the brush to substantially dissipate said frictional contact between the brush and the roller;  
       maintaining the layer of fluid between the surfaces of the roller and the brush to allow the brush to attain a position of static alignment with the outer surface of the roller;  
       eliminating the layer of fluid to return the brush to a position of frictional contact with the outer surface of the roller, while substantially retaining the position of static alignment;  
       bringing a surface of a semiconductor wafer into frictional contact with the brush to clean the surface of the semiconductor wafer; and  
       rotating the semiconductor wafer about its center.  
     
     
       14. The method of claim  13 , further comprising applying a cleaning fluid onto the surface of the semiconductor wafer to be cleaned. 
     
     
       15. A method cleaning a semiconductor wafer comprising: 
       mounting a brush onto a roller such that an inner surface of the brush and an outer surface of the roller are in frictional contact with one another;  
       employing a pressurized fluid source to create a layer of fluid between the surfaces of the roller and the brush to substantially dissipate any frictional contact between the brush and the roller;  
       maintaining the layer of fluid between the surfaces of the roller and the brush to allow the brush to attain a position of static alignment with the outer surface of the roller;  
       eliminating the layer of fluid thereby returning the brush to a position of frictional contact with the outer surface of the roller, while substantially retaining the position of static alignment; and  
       rotating the brush about its axis while holding a wafer in frictional contact with the brush to clean a surface of the wafer.  
     
     
       16. The method of claim  15 , wherein the pressurized fluid source is in fluid communication with the roller. 
     
     
       17. The method of claim  16 , wherein the roller defines an internal cavity having a plurality of orifices which extend through the outer surface of the roller to the internal cavity thereof. 
     
     
       18. The method of claim  17 , wherein the fluid passes through the plurality of orifices to create the layer of fluid between the surfaces of the roller and the brush and wherein said orifices permit the layer of fluid between the surfaces of the roller and the brush to be eliminated. 
     
     
       19. A method of cleaning a semiconductor wafer comprising: 
       mounting a brush onto a roller such that an inner surface of the brush and an outer surface of the roller are in frictional contact with one another;  
       employing a pressurized fluid source to create a layer of fluid between the surfaces of the roller and the brush to substantially dissipate said frictional contact between the brush and the roller;  
       maintaining the layer of fluid between the surfaces of the roller and the brush to allow the brush to attain a position of static alignment with the outer surface of the roller;  
       eliminating the layer of fluid thereby returning the brush to a position of frictional contact with the outer surface of the roller, while substantially retaining the position of static alignment;  
       bringing a surface of a semiconductor wafer into frictional contact with the brush to clean the surface of the semiconductor wafer; and  
       rotating the semiconductor wafer about its center.