US6350651B1ExpiredUtility
Method for making flash memory with UV opaque passivation layer
Est. expiryJun 10, 2019(expired)· nominal 20-yr term from priority
H10W 42/20H10D 64/035
38
PatentIndex Score
10
Cited by
2
References
4
Claims
Abstract
A method for making a flash memory having a passivation layer that is not transparent to ultraviolet light. The method comprises forming a semiconductor substrate that includes a flash memory cell having a floating gate, then forming a conductive layer on the substrate. Process induced charge that has accumulated on the flash cell floating gate is then neutralized and a passivation layer, which is not transparent to ultraviolet light, is formed on the conductive layer.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A method for making a flash memory comprising:
forming a semiconductor substrate that includes a flash memory cell that has a floating gate;
forming a conductive layer on the substrate; then
neutralizing process induced charge that has accumulated on the flash memory cell's floating gate by exposing the substrate to ultraviolet light; and then
forming on the conductive layer a passivation layer that comprises a barrier layer that comprises a silicon nitride layer and a stress reduction layer that comprises a polyimide layer.
2. The method of claim 1 wherein the flash memory cell's floating gate has a gate length that is less than about 0.5 microns.
3. The method of claim 2 wherein the flash memory includes a final metal interconnect and wherein the conductive layer forms the final metal interconnect for the flash memory, upon which is formed the passivation layer.
4. A method for making a flash memory that includes a final metal interconnect comprising:
forming a semiconductor substrate that includes a flash memory cell that has a floating gate that has a gate length that is less than about 0.5 microns;
forming a conductive layer on the substrate that forms the final metal interconnect for the flash memory; then
exposing the flash memory cell's floating gate to ultraviolet light; and then
forming on the conductive layer a passivation layer that comprises a silicon nitride layer and a polyimide layer.Cited by (0)
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