Method and apparatus to reduce EMI leakage through an isolated connector housing using capacitive coupling

Abstract

A capacitive coupling includes a capacitive material and a conductor coupled to the capacitive material. The conductor and the capacitive material have a form factor to fixedly attach to either a connector housing or a chassis of an electronic device. The form factor of the conductor and the capacitive material is also to removably couple the connector housing and the chassis of the electronic device such that at least one signal frequency is passed between the connector housing and the chassis of the electronic device and a direct current is isolated between the connector housing and the chassis of the electronic device.

What is claimed is:  
     
       1. A capacitive coupling comprising: 
       a capacitive material; and  
       a conductor coupled to the capacitive material, said conductor and said capacitive material having a form factor to fixedly attach to a connector housing, and having a compressible design to compressibly mate with a chassis of an electronic device and to removably couple the connector housing and the chassis of the electronic device such that at least one signal frequency is passed between the connector housing and the chassis of the electronic device and a direct current is isolated between the connector housing and the chassis of the electronic device.  
     
     
       2. The apparatus of  claim 1  wherein the at least one signal frequency comprises a frequency of electromagnetic interference (EMI) produced by the electronic device. 
     
     
       3. The apparatus of  claim 1  wherein the at least one signal frequency comprises an operating frequency of the electronic device and harmonic frequencies thereof. 
     
     
       4. The apparatus of  claim 1  wherein the electronic device comprises one of a personal computer, an internet appliance, and a palm-top device. 
     
     
       5. The apparatus of  claim 1  wherein the connector housing is one of a cable-mounted connector housing and a printed circuit board (PCB) mounted connector housing. 
     
     
       6. The apparatus of  claim 1  wherein the connector housing is to couple the electronic device to one of a peripheral device and a network. 
     
     
       7. The apparatus of  claim 1  wherein the capacitive material comprises at least one of an epoxy material, a nylon material, and a phenolic material. 
     
     
       8. The apparatus of  claim 1  wherein the capacitive material comprises a dielectric material that approximates a short circuit at the at least one signal frequency. 
     
     
       9. The apparatus of  claim 1  wherein the capacitive material is to fixedly attach to the connector housing, and the conductor is coupled to the capacitive material and isolated from the connector housing by the capacitive material. 
     
     
       10. The apparatus of  claim 1  wherein the conductor comprises one of a plurality of pins and a conductive fringe. 
     
     
       11. The apparatus of  claim 1  wherein the capacitive material surrounds the connector housing and the conductor comprises a plurality of elements extending from the capacitive material. 
     
     
       12. A method comprising: 
       fixedly attaching a capacitive material to a connector housing, said capacitive material having a conductor coupled there to;  
       compressibly mating the conductor and a chassis of an electronic device, said conductor having a compressible design to compressibly mate with the chassis of the electronic device; and  
       removably coupling the connector housing and the chassis of the electronic device through the capacitive material and the conductor such that at least one signal frequency is passed between the connector housing and the chassis of the electronic device and a direct current is isolated between the connector housing and the chassis of the electronic device.  
     
     
       13. The method of  claim 12  wherein the conductor comprises a compressible design, wherein fixedly attaching the capacitive material comprises applying the capacitive material to the connector housing, and wherein removably coupling the connector housing and the chassis of the electronic device comprises compressing the conductor against the chassis of the electronic device. 
     
     
       14. An apparatus comprising: 
       capacitive means; and  
       means for conducting coupled to the capacitive means, said means for conducting and said capacitive means having a form factor for fixedly attaching to a connector housing, and having a compressible design to compressibly mate with a chassis of an electronic device and for removably coupling the connector housing to the chassis of the electronic device such that at least one signal frequency is passed between the connector housing and the chassis of the electronic device and a direct current is isolated between the connector housing and the chassis of the electronic device.