Circuit board and a method for making the same

Abstract

A method for making a multi-layer electronic circuit board 136 having electroplated apertures 96, 98 which may be selectively and electrically isolated from an electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 128 which are structurally supported by material 134.

What is claimed is:  
     
       1. A circuit board comprising: 
       a first electrically conductive member having a first and a second surface;  
       a first dielectric member which is coupled to said first surface;  
       a second dielectric member which is coupled to said second surface;  
       a first circuit assembly having a second electrically conductive member which is coupled to said first dielectric member, said first circuit assembly further including a third electrically conductive member and a first core member which is contained between said second and said third electrically conductive members and which includes at least one air-bridge; and  
       a second circuit assembly having a fourth electrically conductive member which is coupled to said second dielectric member, said second circuit assembly further including a fifth electrically conductive member and a second core member which is contained between said fourth and said fifth electrically conductive members and which includes at least one air-bridge, said second circuit assembly cooperating with said first circuit assembly and with said first and second dielectric material and with said first electrically conductive member to form a multi-layer circuit board.  
     
     
       2. The circuit board of  claim 1  further comprising material which supports said at least one air-bridge of said first circuit assembly. 
     
     
       3. The circuit board of  claim 1  wherein said first and second core members comprise aluminum and wherein said first electrically conductive member comprises copper. 
     
     
       4. The circuit board of  claim 1  further comprising a first aperture having a first surface which extends through said first, second, third, fourth, and fifth electrically conductive members, said first and second dielectric members, and said first and second core members. 
     
     
       5. The electronic circuit board of  claim 4  further comprising a second aperture which has a second surface which is electrically isolated from said first electrically conductive member. 
     
     
       6. The circuit board of  claim 5  wherein said first electrically conductive member is coupled to an electrical ground potential. 
     
     
       7. The circuit board of  claim 5  wherein said first and second apertures contain electroplated material upon said respective first and second surfaces. 
     
     
       8. A method for making an electrical circuit assembly comprising the steps of: 
       providing a first member having a first core portion which is contained between a top and a bottom layer;  
       providing a second member having a second core portion which is contained between a top and a bottom layer;  
       providing first layer and a second layer of a first material;  
       providing a third member;  
       removing a portion of said top and said bottom layer of said first member, thereby exposing at least two portions of said core portion of said first member;  
       removing a portion of said top and said bottom layer of said second member, thereby exposing at least two portions of said core portion of said second member;  
       creating a first pre-circuit assembly by attaching the first layer of said first material to a first surface of said third member, attaching the second layer of said first material to a second surface of said third member, attaching said first member to said first layer of said first material, and attaching said second member to said second layer of said first material;  
       creating an aperture through said first pre-circuit assembly, thereby causing a portion of said first pre-circuit assembly to be contained within said created aperture;  
       applying an electrically conductive material to said portion of said first pre-circuit assembly which is contained within said aperture; and  
       selectively removing portions of said first and second core portions, thereby creating a circuit assembly having at least one air-bridge and forming an electrical circuit assembly.  
     
     
       9. The method of  claim 8  wherein said third member comprises an electrical ground plane and wherein said method further comprises the step of isolating said portion of said first pre-circuit assembly which is contained within said aperture from said third member. 
     
     
       10. The method of  claim 9  further comprising the steps of creating a second aperture through said first pre-circuit assembly, thereby exposing a second surface of said first pre-circuit assembly within said second aperture, said second surface including a portion of said third member. 
     
     
       11. The method of  claim 9  wherein said step of applying an electrically conductive material to said portion of said first pre-circuit assembly comprises the step of electroplating copper material upon said portion of said first pre-circuit assembly. 
     
     
       12. The method of  claim 8  wherein said first material comprises a dielectric adhesive material. 
     
     
       13. The method of  claim 8  wherein said core portion of said first member comprises aluminum and wherein said top and bottom layers each comprise copper. 
     
     
       14. The method of  claim 8  further comprising the step of creating a first aperture within a certain portion of said third member; and extending said first aperture through said first pre-circuit assembly. 
     
     
       15. The method of  claim 8  further comprising the step of applying said electrically conductive material to certain portions of said top layer of said first member and said bottom layer of said second member. 
     
     
       16. The method of  claim 8  wherein said step of selectively removing portions of said core portion comprises the step of selectively etching said core. 
     
     
       17. A method for making a circuit board comprising the steps of: 
       forming a first pre-circuit assembly having a first core member having a first and a second surface, said first pre-circuit assembly further including a first plurality of electrically conductive members disposed upon said first surface and a second plurality of electrically conductive members disposed upon said second surface;  
       forming a second pre-circuit assembly having first and second circuit boards which are selectively attached to a dielectric adhesive material and which cooperatively form a separation region;  
       coupling said dielectric adhesive material to said second plurality of electrically conductive portions;  
       removing certain portions of said first core member, thereby forming at least one pedestal portion which abuts one of said separation regions; and  
       extending said separation region through said at least one pedestal portion, thereby forming a circuit board.  
     
     
       18. The method of  claim 17  wherein said core member comprises aluminum. 
     
     
       19. The method of  claim 18  wherein said first and second plurality of electrically conductive members each comprise copper. 
     
     
       20. The method of  claim 19  wherein said step of removing said certain portions of said first core member comprises selectively etching said first core member.