Conductive paste and ceramic electronic component

Abstract

A conductive paste capable of forming a terminal electrode in which sintering proceeds while the viscosity of the glass is maintained during the sintering of the conductive component, so that the softened glass is prevented from flowing into the interface between the ceramic element assembly and the terminal electrode or from flowing on the surface of the terminal electrode, and furthermore, sufficient glass remains in the cavity of the terminal electrode film, so that an excellent seal is provided against the penetration of the plating solution, and the so-called "adhesion defect" is prevented from occurring, is provided. In addition, a ceramic electronic component is provided. The conductive paste is composed of a conductive component containing at least one of Cu and Ni, a glass frit and an organic vehicle, in which the glass frit contains a crystallizable glass, and the sintering starting temperature of the conductive component is higher than the crystallization starting temperature of the crystallizable glass and lower than the remelting temperature of the crystallizable glass.

What is claimed is:  
     
       1. A conductive paste, comprising: 
       a conductive component comprising at least one of Cu and Ni; a glass frit; and an organic vehicle,  
       wherein said glass frit comprises at least one crystallizable glass having a crystallization starting temperature higher than the sintering starting temperature of said conductive component and a remelting temperature lower than the sintering starting temperature of said conductive component.  
     
     
       2. A conductive paste according to  claim 1 , wherein said crystallizable glass is B—Si—X—O glass in which X is at least one alkaline-earth metal. 
     
     
       3. A conductive paste according to  claim 2 , wherein said glass frit is present in an amount of about 5 to 50 volume % of the total volume of the glass frit and conductive component. 
     
     
       4. A conductive paste according to  claim 3 , wherein X is at least one of Ba, Sr and Ca, and the conductive component comprises Cu. 
     
     
       5. A conductive paste according to  claim 2 , wherein X is at least one of Ba, Sr and Ca. 
     
     
       6. A conductive paste according to  claim 1 , wherein said crystallizable glass is B—Si—X—Y—O glass in which X is at least one alkaline-earth metal, and Y is at least one member selected from the group consisting of Al, Cu, Ni, Zn, Mn and alkali metals. 
     
     
       7. A conductive paste according to  claim 6 , wherein said glass frit is present in an amount of about 5 to 50 volume % of the total volume of the glass frit and conductive component. 
     
     
       8. A conductive paste according to  claim 7 , wherein X is at least one of Ba, Sr and Ca, and the conductive component comprises Cu. 
     
     
       9. A conductive paste according to  claim 6 , wherein X is at least one of Ba, Sr and Ca. 
     
     
       10. A ceramic electronic component, comprising: 
       a ceramic element assembly having a surface; and  
       a terminal electrode contacting said ceramic element assembly surface,  
       wherein said terminal electrode is a baked conductive paste according to  claim 9 .  
     
     
       11. A ceramic electronic component, comprising: 
       a ceramic element assembly having a surface; and  
       a terminal electrode contacting said ceramic element assembly surface,  
       wherein said terminal electrode is a baked conductive paste according to  claim 8 .  
     
     
       12. A ceramic electronic component, comprising: 
       a ceramic element assembly having a surface; and  
       a terminal electrode contacting said ceramic element assembly surface,  
       wherein said terminal electrode is a baked conductive paste according to  claim 7 .  
     
     
       13. A ceramic electronic component, comprising: 
       a ceramic element assembly having a surface; and  
       a terminal electrode contacting said ceramic element assembly surface,  
       wherein said terminal electrode is a baked conductive paste according to  claim 6 .  
     
     
       14. A ceramic electronic component, comprising: 
       a ceramic element assembly having a surface; and  
       a terminal electrode contacting said ceramic element assembly surface,  
       wherein said terminal electrode is a baked conductive paste according to  claim 5 .  
     
     
       15. A ceramic electronic component, comprising: 
       a ceramic element assembly having a surface; and  
       a terminal electrode contacting said ceramic element assembly surface,  
       wherein said terminal electrode is a baked conductive paste according to  claim 4 .  
     
     
       16. A ceramic electronic component, comprising: 
       a ceramic element assembly having a surface; and  
       a terminal electrode contacting said ceramic element assembly surface,  
       wherein said terminal electrode is a baked conductive paste according to  claim 3 .  
     
     
       17. A ceramic electronic component, comprising: 
       a ceramic element assembly having a surface; and  
       a terminal electrode contacting said ceramic element assembly surface,  
       wherein said terminal electrode is a baked conductive paste according to  claim 2 .  
     
     
       18. A ceramic electronic component, comprising: 
       a ceramic element assembly having a surface; and  
       a terminal electrode contacting said ceramic element assembly surface,  
       wherein said terminal electrode is a baked conductive paste according to  claim 1 .