Exposure system

Abstract

An exposure apparatus has a first exposure part which exposes a wafer directly with an exposure beam and a second exposure part which projects and exposes a pattern of a mask onto the wafer. The exposure system performs multiple exposure including performing exposure a plurality of times by using the first exposure part and the second exposure part.

What is claimed is:  
     
       1. An exposure system comprising: 
       a first exposure part which exposes a wafer with one of proximity field light and a tunneling current;  
       a second exposure part which projects and exposes a pattern formed in a mask onto the wafer; and  
       a controller for causing said first exposure part and said second exposure part to perform exposures onto regions on the wafer, prior to development, such that the exposed regions on the wafer at least partially overlap each other.  
     
     
       2. A system according to  claim 1 , wherein at least one of the exposures made by said first and second exposure parts forms a distribution of multi-valued exposure amounts, having at least three values. 
     
     
       3. A system according to  claim 1 , wherein said first exposure part performs a periodic pattern exposure. 
     
     
       4. A system according to  claim 1 , wherein said first exposure part comprises a plurality of probes and performs exposure with a plurality of exposure beams emitted from said plurality of probes. 
     
     
       5. A system according to  claim 1 , wherein said first exposure part performs exposure with a plurality of exposure beams. 
     
     
       6. A system according to  claim 5 , wherein said first exposure part comprises a plurality of exposure beams arranged in a one-dimensional array and performs a desired pattern exposure by moving the plurality of exposure beams arranged in the one-dimensional array. 
     
     
       7. A system according to  claim 5 , wherein said first exposure part comprises a plurality of exposure beams arranged in a two-dimensional array and performs a desired pattern exposure by moving the plurality of exposure beams arranged in the two-dimensional array. 
     
     
       8. A system according to  claim 1 , wherein an exposure amount made by said first exposure part does not exceed a predetermined threshold value. 
     
     
       9. A system according to  claim 1 , wherein in one area of the wafer, both a first exposure amount by said first exposure part and a second exposure amount by said second exposure part do not exceed a predetermined exposure threshold value. 
     
     
       10. A system according to  claim 9 , wherein the sum of the first exposure amount and the second exposure amount exceeds the threshold value. 
     
     
       11. An exposure apparatus for performing exposure with an exposure system according to  claim 1 . 
     
     
       12. A method of manufacturing devices, comprising the steps of: 
       exposing a subject using an exposure system according to  claim 1 ; and  
       developing the exposed subject.