Micro soldered connection

Abstract

The invention is directed to techniques for forming a soldered connection using a pin having a channel. The channel enables the pin to form a secure connection with a via (e.g., by facilitating gas percolation out of the via hole during soldering to improve solder flow, by holding solder prior to pin insertion and soldering, or by facilitating accurate pin bending to hold solder or a pin insert prior to pin insertion and soldering) to improve connection system reliability and increase manufacturing yields. In one arrangement, the pin has a surface which includes (i) a first surface area, (ii) a second surface area that is substantially parallel to the first surface area, and (iii) a channel surface area which defines a channel that extends from the first surface area toward the second surface area. To form a soldered connection, the pin is inserted into a cavity defined by a via of a connecting member (e.g., a circuit board), in a direction that is parallel to a central axis of the via. The pin is then soldered to the via to establish an electrical pathway between the pin and the via. Depending on the particular arrangement, the channel generally facilitates the introduction of solder into the cavity of the via. Accordingly, the cavity dimension of the via can be smaller than that required for vias of a conventional reflow soldering approach (i.e., less than 100% of the maximum pin cross-section as for a conventional reflow soldering approach). Hence, the invention is suitable for use in high-density, micro-soldered connection arrangements (e.g., in situations with vias closer together than in the conventional reflow soldering approach).

What is claimed is:  
     
       1. A connection system, comprising: 
       a first connecting member having a via that defines a cavity;  
       a second connecting member having a housing, and a pin attached to the housing, the pin extending within the cavity of the via along a direction that is substantially parallel to a central axis of the via, the pin including a surface having:  
       a first surface area,  
       a second surface area that is substantially parallel to the first surface area, and  
       a channel surface area which defines a channel that extends from the first surface area toward the second surface area; and  
       solder attached to the pin and the via to establish an electrical pathway between the pin and the via.  
     
     
       2. The connection system of  claim 1  wherein the first surface area defines a first plane, wherein the second surface area defines a second plane that is parallel to the first plane, and wherein the channel extends from the first plane to the second plane through the pin. 
     
     
       3. The connection system of  claim 2  wherein the via is a plated through-hole configured to carry a single signal. 
     
     
       4. The connection system of  claim 2  wherein the channel extends substantially along a central axis of the pin. 
     
     
       5. The connection system of  claim 4  wherein the channel extends through an end of the pin to form a solder flow path. 
     
     
       6. The connection system of  claim 4  wherein the via is a plated through-hole configured to carry a single signal. 
     
     
       7. The connection system of  claim 2  wherein a portion of the channel extends outside the cavity defined by the via to enable gas to escape from the channel when the pin and the via are soldered together. 
     
     
       8. The connection system of  claim 7  further comprising: 
       a solder-stop member attached around a portion the pin such that a first portion of the channel extends on a first side of the solder-stop member and a second portion of the channel extends on a second side of the solder-stop member that is opposite the first side.  
     
     
       9. The connection system of  claim 7  wherein the via is a plated through-hole configured to carry a single signal. 
     
     
       10. The connection system of  claim 1  herein the pin has a cross-section that is less than or equal to a cross-section of the cavity defined by via. 
     
     
       11. The connection system of  claim 10  wherein the via is a plated through-hole configured to carry a single signal. 
     
     
       12. The connection system of  claim 1  wherein the channel surface area defines a channel that extends completely from the first surface area to the second surface area, and wherein the channel is disposed along the central axis of the via. 
     
     
       13. The connection system of  claim 12  wherein the via is a plated through-hole configured to carry a single signal. 
     
     
       14. The connection system of  claim 1  wherein a cross-section of the pin, which is substantially perpendicular to the central axis of the via, is substantially rectangular in shape. 
     
     
       15. The connection system of  claim 14  wherein the via is a plated through-hole configured to carry a single signal. 
     
     
       16. The connection system of  claim 1  wherein a cross-section of the pin, which is substantially parallel to the central axis of the via, is substantially oval in shape. 
     
     
       17. The connection system of  claim 16  wherein the via is a plated through-hole configured to carry a single signal. 
     
     
       18. The connection system of  claim 1  wherein the via is a plated through-hole configured to carry a single signal. 
     
     
       19. The connection system of  claim 1  wherein the channel extends from the first surface area to the second surface area through the pin, and wherein the surface of the pin further includes; 
       another channel surface area that defines another channel that extends from the first surface area to the second surface area through the pin.  
     
     
       20. The connection system of  claim 1  wherein the pin further includes multiple tab portions, and wherein connecting system further comprises: 
       an insert member that is held, within the cavity defined by the via, by the multiple tab portions of the pin.