Automatic soldering apparatus

Abstract

An automatic soldering apparatus comprises a solder bath, and a plurality of component parts such as a jet flow nozzle, bolts, nuts and washers equipped in the solder bath, wherein a relative density of such component parts equipped in the solder bath of the automatic soldering apparatus is smaller than that of lead-free solder to be used in the automatic soldering apparatus. Preferably each piece of the component parts are made of titanium material or ceramic material having relative density of around 4.5. Further the lead-free solder includes 2.5 weight % of silver, 0.5 weight % of cupper, 1.0 weight % of bismuth, and tin for the rest, and having a relative density of around 7.5. Accordingly, in case of dropping the piece of components parts into the melting solder, the dropped piece can float on the melting solder without breaking the apparatus.

What is claimed is:  
     
       1. An automatic soldering apparatus comprising: 
       a solder bath for storing lead-free solder; and  
       plural pieces of component parts equipped in said solder bath, wherein  
       a relative density of at least a part of said component parts is lighter than that of said lead-free solder, wherein  
       said component parts are fastening parts including bolts, nuts, and washers.  
     
     
       2. The automatic soldering apparatus as claimed in  claim 1 , further comprising: 
       a nozzle plate in said solder bath, wherein  
       said fastening parts are used to fasten said nozzle plate to said solder bath.  
     
     
       3. An automatic soldering apparatus comprising: 
       a solder bath for storing lead-free solder;  
       a nozzle plate; and  
       fastening parts for fastening said nozzle plate to said solder bath, wherein  
       material of said fastening parts are selected from material having a relative density lighter than that of said lead-free solder, wherein  
       said pieces of component parts include a nozzle plate and a plurality of fastening parts including bolts, nuts, and washers.  
     
     
       4. The automatic soldering apparatus as claimed in  claim 3 , wherein 
       each of said component parts are made from ceramic material.  
     
     
       5. The automatic soldering apparatus as claimed in  claim 3 , wherein 
       each of said component parts are made from titanium material.  
     
     
       6. The automatic soldering apparatus as claimed in  claim 1 , wherein 
       said lead-free solder includes 2.5 weight % of silver, 0.5 weight % of cupper, 1.0 weight % of bismuth, and tin for the rest.  
     
     
       7. The automatic soldering apparatus as claimed in  claim 1 , wherein 
       said relative density of said component parts is around 4.5, while said relative density of the lead-free solder is around 7.5.  
     
     
       8. The automatic soldering apparatus as claimed in  claim 7 , wherein 
       said lead-free solder includes 2.5 weight % of silver, 0.5 weight % of cupper, 1.0 weight % of bismuth, and tin for the rest.