Silicone composition curing at room temperature and the use thereof

Abstract

Among other things, a silicone composition curing by condensation at room temperature is prepared from a base dough containing filler and polyorganosiloxane having hydroxy groups, as well as from an activator component containing crosslinker and a catalyst of an organometallic compound, which is characterized in that the activator component additionally contains a polyether having at most one alkoxysilyl group and/or a polyaddition product based on polyether and having at most one alkoxysilyl group.

What is claimed is:  
     
       1. A two-component silicone composition curing by condensation at room temperature, comprising a first component further comprising a base dough containing filler and a polyorganosiloxane having hydroxyl groups, and a second component further comprising an activator component containing crosslinkers, and a catalyst of an organometallic compound, wherein the activator component additionally contains a polyaddition product based on polyether and having at most one alkoxysilyl group and/or a polyether having at most one alkoxysilyl group. 
     
     
       2. Silicone composition according to  claim 1 , wherein the polyaddition product is free of alkoxysilyl groups. 
     
     
       3. Silicone composition according to  claim 2 , characterized in that the polyethers contained in the activator component are homopolymers, block copolymers or statistical copolymers of the structure 
       R—[O—(CH 2 ) p ] m —[O—(C q H 2q )] n —OR with p and q=1-4 (independently of one another) R=H, C x H 2x+1 ; x=1 -100, phenyl, benzyl, benzoyl, m and n as desired, so that M n =200-20,000.  
     
     
       4. Silicone composition according to  claim 1 , wherein the amount of polyaddition product and/or polyether in the activator component amounts to 10-90 wt.-%. 
     
     
       5. Silicone composition according to  claim 4 , characterized in that the amount of polyaddition product in the activator component amounts to 30-60 wt.-%. 
     
     
       6. Silicone composition according to  claim 1  wherein the activator component contains at least one organometallic oxide and/or at least one carboxylate salt having a metal selected from the group consisting of Sn, Zn, Fe, Pb, Ti, Zr and Co. 
     
     
       7. Silicone composition according to  claim 1 , wherein the activator component contains dibutyl or dioctyltin oxide. 
     
     
       8. Silicone composition according to  claim 1  wherein the base dough has a filler content of 5-80 wt.-%. 
     
     
       9. Silicone composition according to  claim 1  wherein the packaging of base dough and activator component are packaged in tubes. 
     
     
       10. Silicone composition according to  claim 1  wherein the base dough and activator component are packaged in tubular bags. 
     
     
       11. Silicone composition according to  claim 1 , wherein the base dough and activator component are packaged in dual cartridges. 
     
     
       12. A dental impression composition comprising the silicone composition of  claim 1 .