Multi-layer conductive device interconnection

Abstract

A conductive network includes a first conductive device having multiple first signal layers. Each first signal layer has a first substrate and a plurality of first conductive traces disposed on one side of the first substrate. The network further includes a second conductive device having multiple second signal layers. Each second signal layer has a second substrate and a plurality of second conductive traces disposed on one side of the second substrate. In addition, the network includes at least one bridge layer for electrically joining together the first and second conductive devices. The at least one bridge layer has a bridge substrate and a plurality of bridge traces supported by the bridge substrate.

What is claimed is:  
     
       1. A conductive network comprising: 
       a first conductive device having multiple first signal layers, each first signal layer having a first substrate and a plurality of first conductive traces disposed on one side of the first substrate;  
       a second conductive device having multiple second signal layers, each second signal layer having a second substrate and a plurality of second conductive traces disposed on one side of the second substrate; and  
       multiple bridge layers for electrically joining together the first and second conductive devices, each bridge layer having a bridge substrate and a plurality of bridge traces supported by the bridge substrate, each bridge layer being configured to electrically join together a respective first signal layer and a respective second signal layer such that a portion of each first signal layer is sandwiched between two bridge layers and a portion of each second signal layer is sandwiched between two bridge layers.  
     
     
       2. The conductive network of  claim 1  wherein each bridge layer is configured to overlap a respective first signal layer and a respective second signal layer so as to electrically join together the respective first and second signal layers. 
     
     
       3. The conductive network of  claim 1  wherein one bridge trace is configured to overlap a respective first conductive trace and a respective second conductive trace so as to electrically join together the respective first and second conductive traces. 
     
     
       4. The conductive network of  claim 1  wherein each bridge layer is configured to overlap a respective first signal layer and a respective second signal layer so as to electrically join together the respective first and second signal layers. 
     
     
       5. The conductive network of  claim 1  wherein the first conductive device is a first printed circuit board, and the second conductive device is a second printed circuit board. 
     
     
       6. The conductive network of  claim 1  wherein for each bridge layer, the bridge traces are disposed on one side of the bridge substrate. 
     
     
       7. The conductive network of  claim 1  further comprising first and second spacer assemblies connected to the first and second conductive devices, respectively, the first spacer assembly spacing adjacent first signal layers away from each other, the second spacer assembly spacing adjacent second signal layers away from each other. 
     
     
       8. The conductive network of  claim 1  wherein the bridge layers include first bridge layers and second bridge layers, the first conductive device includes the first bridge layers, and the second conductive device includes the second bridge layers. 
     
     
       9. The conductive network of  claim 1  wherein each first signal layer has a first ground plane disposed on a side of the first substrate opposite from the first conductive traces, and each second signal layer has a second ground plane disposed on a side of the second substrate opposite from the second conductive traces. 
     
     
       10. The conductive network of  claim 9  wherein the bridge layers include a first bridge layer and a second bridge layer, each bridge trace of the first bridge layer being configured to overlap a respective first conductive trace and a respective second conductive trace so as to electrically join together the respective first and second conductive traces, each bridge trace of the second bridge layer being configured to overlap a respective first ground plane and a respective second ground plane so as to electrically join together the respective first and second ground planes. 
     
     
       11. The conductive network of  claim 1  further comprising a housing for receiving the bridge layers and for spacing select bridge layers away from each other so as to receive select first and second signal layers therebetween. 
     
     
       12. The conductive network of  claim 11  wherein the bridge layers are contained within the housing. 
     
     
       13. The conductive network of  claim 7  further comprising a housing for receiving the bridge layers and for spacing select bridge layers away from each other, the spacer assemblies being engageable with the housing so as to position select first and second signal layers between select bridge layers. 
     
     
       14. The conductive network of  claim 13  wherein the bridge layers are contained within the housing. 
     
     
       15. The conductive network of  claim 8  wherein the first signal layers cooperate with the first bridge layers to form a first staggered step configuration, and the second signal layers cooperate with the second bridge layers to from a second staggered step configuration, wherein the first and second staggered step configurations are alignable with each other such that each bridge layer overlaps a respective first signal layer and a respective second signal layer so as to electrically join together the respective first and second signal layers. 
     
     
       16. The conductive network of  claim 15  wherein when the first and second staggered step configurations are aligned with each other such that each bridge layer overlaps a respective first signal layer and a respective second signal layer, none of the first signal layers extend between the second signal layers. 
     
     
       17. A conductive network comprising: 
       a first conductive device having multiple first signal layers, each first signal layer having a first substrate, a plurality of first conductive traces disposed on one side of the first substrate, and a first ground plane disposed on an opposite side of the first substrate;  
       a first spacer assembly connected to the first conductive device and including a first housing that receives the first signal layers, the first spacer assembly further including a plurality of first spacers, each first spacer being disposed between adjacent first signal layers for spacing the adjacent first signal layers apart;  
       a second conductive device having multiple second signal layers, each second signal layer having a second substrate, a plurality of second conductive traces disposed on one side of the second substrate, and a second ground plane disposed on an opposite side of the second substrate;  
       a second spacer assembly connected to the second conductive device and including a second housing that receives the second signal layers, the second spacer assembly further including a plurality of second spacers, each second spacer being disposed between adjacent second signal layers for spacing the adjacent second signal layers apart; and  
       a bridging assembly engageable with the first and second spacer assemblies, the bridging assembly including a third housing, a plurality of bridge layers disposed in the third housing, and a plurality of separators that cooperate with the bridge layers to separate select bridge layers from each other so as to receive select first and second signal layers therebetween, wherein the bridge layers are configured to electrically join together the first and second signal layers when the bridging assembly is engaged with the spacer assemblies.  
     
     
       18. The conductive network of  claim 17  further comprising a clamping device that cooperates with the bridging assembly so as to force together the bridge layers and the signal layers. 
     
     
       19. The conductive network of  claim 18  wherein the clamping device includes first and second clamp portions that are engageable with each other. 
     
     
       20. The conductive network of  claim 19  wherein the first spacer assembly includes the first clamp portion, the first clamp portion being slidably associated with the first housing, and wherein the second spacer assembly includes the second clamp portion, the second clamp portion being slidably associated with the second housing. 
     
     
       21. A conductive network comprising: 
       a first printed circuit board having multiple first signal layers, each first signal layer having a first substrate, a plurality of first conductive traces disposed on one side of the first substrate, and a first ground plane disposed on an opposite side of the first substrate;  
       a first plug assembly connected to the first printed circuit board and including a first housing that receives the first signal layers, the first plug assembly further including a plurality of first spacers, each first spacer being disposed between adjacent first signal layers for spacing the adjacent first signal layers apart;  
       a second printed circuit board having multiple second signal layers, each second signal layer having a second substrate, a plurality of second conductive traces disposed on one side of the second substrate, and a second ground plane disposed on an opposite side of the second substrate;  
       a second plug assembly connected to the second printed circuit board and including a second housing that receives the second signal layers, the second plug assembly further including a plurality of second spacers, each second spacer being disposed between adjacent second signal layers for spacing the adjacent second signal layers apart;  
       a socket assembly for receiving the first and second plug assemblies, the socket assembly including a third housing, a plurality of bridge layers disposed in the third housing, and a plurality of separators that cooperate with the bridge layers to separate select bridge layers from each other so as to receive select first and second signal layers therebetween; and  
       a clamping device that cooperates with the socket assembly to force together the bridge layers and the signal layers such that a first group of bridge layers electrically joins the first and second conductive traces, and a second group of bridge layers electrically joins the first and second ground planes.  
     
     
       22. A conductive device that is electrically joinable to an additional conductive device, the conductive device comprising: 
       a plurality of bridge layers;  
       a plurality of signal layers that alternate with the bridge layers, each signal layer having a substrate, a plurality of conductive traces disposed on one side of the substrate, and a ground plane disposed on an opposite side of the substrate;  
       wherein the bridge layers and the signal layers cooperate to define a staggered step configuration that is alignable with the additional conductive device, and wherein the bridge layers are adapted to electrically join the signal layers to the additional conductive device when the staggered step configuration is aligned with the additional conductive device.  
     
     
       23. The conductive device of  claim 22  wherein each conductive trace has a contact portion, each bridge layer includes at least one fill pad, and the fill pads are adapted to transmit a clamping force through the bridge layers and signal layers and to concentrate the clamping force at the contact portions. 
     
     
       24. The conductive device of  claim 22  wherein each substrate is flexible. 
     
     
       25. The conductive device of  claim 22  wherein each consecutive layer of the alternating bridge layers and signal layers extends beyond an immediately preceding layer. 
     
     
       26. The conductive device of  claim 22  wherein each signal layer includes a signal layer hole, and each bridge layer has a bridge layer hole, the bridge layer holes being alignable with the signal layer holes so as to define the staggered step configuration. 
     
     
       27. The conductive device of  claim 22  further comprising a fixture having an alignment member, wherein each signal layer and each bridge layer has a hole, and the alignment member extends through the holes so as to align the signal layers and bridge layers in the staggered step configuration. 
     
     
       28. The conductive device of  claim 22  further comprising a fixture having first and second alignment members, wherein each signal layer and each bridge layer has first and second holes, the first alignment member extends through the first holes and the second alignment member extends through the second holes so as to align the signal layers and bridge layers in the staggered step configuration. 
     
     
       29. The conductive device of  claim 22  wherein the conductive device is a printed circuit board. 
     
     
       30. The conductive device of  claim 22  wherein each conductive trace has a contact portion, each bridge layer includes a bridge substrate, a plurality of spaced first fill pads disposed on one side of the bridge substrate, and a plurality of spaced second fill pads disposed on an opposite side of the bridge substrate, wherein the first and second fill pads are adapted to transmit a clamping force through the bridge layers and signal layers and to concentrate the clamping force at the contact portions. 
     
     
       31. The conductive device of  claim 30  wherein the first fill pads of a particular bridge layer are aligned with the second fill pads of the particular bridge layer. 
     
     
       32. The conductive device of  claim 22  wherein each bridge layer includes a bridge substrate and a plurality of bridge traces supported by the bridge substrate. 
     
     
       33. The conductive device of  claim 32  wherein each bridge trace overlaps a particular conductive trace. 
     
     
       34. The conductive device of  claim 32  wherein each bridge trace overlaps a particular ground plane. 
     
     
       35. The conductive device of  claim 22  wherein each conductive trace has a contact portion, each bridge layer includes a bridge substrate, a plurality of bridge traces disposed on one side of the bridge substrate, and at least one fill pad disposed on an opposite side of the bridge substrate, each bridge trace including a contact portion that is engageable with a contact portion of a respective conductive trace, the fill pads being adapted to transmit a clamping force through the bridge layers and signal layers and to concentrate the clamping force at the contact portions. 
     
     
       36. The conductive device of  claim 35  wherein each bridge layer includes at least one additional fill pad disposed on the same side of the bridge substrate as the corresponding bridge traces and spaced away from the corresponding bridge traces, the additional fill pads being adapted to cooperate with the fill pads to concentrate the clamping force at the contact portions. 
     
     
       37. A conductive network comprising: 
       a first conductive device having alternating first bridge layers and first signal layers that cooperate to define a first staggered step configuration, each first signal layer having a first substrate, a plurality of first conductive traces disposed on one side of the first substrate, and a first ground plane disposed on an opposite side of the first substrate; and  
       a second conductive device having alternating second bridge layers and second signal layers that cooperate to define a second staggered step configuration, each second signal layer having a second substrate, a plurality of second conductive traces disposed on one side of the second substrate, and a second ground plane disposed on an opposite side of the second substrate;  
       wherein the first and second staggered step configurations are alignable with each other such that each first bridge layer electrically joins first and second conductive traces, and each second bridge layer electrically joins first and second ground planes.  
     
     
       38. The conductive network of  claim 37  further comprising a clamping device that secures together the first and second conductive devices. 
     
     
       39. The conductive network of  claim 37  wherein each first bridge layer includes a first bridge substrate, a plurality of spaced first fill pads disposed on one side of the first bridge substrate, and a plurality of spaced second fill pads disposed on an opposite side of the first bridge substrate and aligned with the first fill pads, and wherein each second bridge layer includes a second bridge substrate, a plurality of spaced third fill pads disposed on one side of the second bridge substrate, and a plurality of spaced fourth fill pads disposed on an opposite side of the second bridge substrate and aligned with the third fill pads. 
     
     
       40. The conductive network of  claim 37  wherein the first conductive device is a first printed circuit board, and the second conductive device is a second printed circuit board. 
     
     
       41. A conductive network comprising: 
       a first conductive device having multiple first signal layers and at least one first bridge layer that cooperates with the first signal layers to form a first staggered step configuration, each first signal layer having a first substrate and a plurality of first conductive traces disposed on one side of the first substrate, each of the at least one first bridge layer having a first bridge substrate and a plurality of first bridge traces supported by the first bridge substrate;  
       a second conductive device having multiple second signal layers and at least one second bridge layer that cooperates with the second signal layers to form a second staggered step configuration, each second signal layer having a second substrate and a plurality of second conductive traces disposed on one side of the second substrate, each of the at least one second bridge layer having a second bridge substrate and a plurality of second bridge traces supported by the second bridge substrate;  
       wherein the first and second staggered step configurations are alignable with each other such that each bridge layer overlaps a respective first signal layer and a respective second signal layer so as to electrically join together the respective first and second signal layers.  
     
     
       42. The conductive network of  claim 41  wherein the first conductive device includes multiple first bridge layers that cooperate with the first signal layers to form the first staggered step configuration, and the second conductive device includes multiple second bridge layers that cooperate with the second signal layers to form the second staggered step configuration. 
     
     
       43. The conductive network of  claim 41  wherein the first conductive device is a first printed circuit board, and the second conductive device is a second printed circuit board. 
     
     
       44. The conductive network of  claim 41  wherein when the first and second staggered step configurations are aligned with each other such that each bridge layer overlaps a respective first signal layer and a respective second signal layer, none of the first signal layers extend between the second signal layers. 
     
     
       45. A conductive network comprising: 
       a first conductive device having multiple first signal layers, each first signal layer having a first substrate and a plurality of first conductive traces disposed on one side of the first substrate;  
       a second conductive device having multiple second signal layers, each second signal layer having a second substrate and a plurality of second conductive traces disposed on one side of the second substrate;  
       multiple bridge layers for electrically joining together the first and second conductive devices, each bridge layer having a bridge substrate and a plurality of bridge traces supported by the bridge substrate; and  
       first and second spacer assemblies connected to the first and second conductive devices, respectively, the first spacer assembly spacing adjacent first signal layers away from each other, the second spacer assembly spacing adjacent second signal layers away from each other.  
     
     
       46. The conductive network of  claim 45  further comprising a housing for receiving the bridge layers and for spacing select bridge layers away from each other, the spacer assemblies being engageable with the housing so as to position select first and second signal layers between select bridge layers. 
     
     
       47. The conductive network of  claim 46  wherein the bridge layers are contained within the housing.