US6508878B2ExpiredUtilityPatentIndex 91
GaN system compound semiconductor and method for growing crystal thereof
Est. expiryOct 15, 2018(expired)· nominal 20-yr term from priority
H10P 14/3416H10P 14/3252H10P 14/3216H10P 14/2921H10P 14/24H10H 20/01335H10H 20/80C30B 29/406C30B 25/02C30B 29/403
91
PatentIndex Score
44
Cited by
13
References
5
Claims
Abstract
GaN system compound semiconductor and method for growing a crystal thereof, which can significantly reduce a concentration of crystalline defects caused by lattice mismatch by growing a GaN system compound semiconductor of GaN or In x Ga 1-x N by using In x Al 1-x N crystal on a substrate as an intermediate buffer layer, the method including the steps of (1) providing a sapphire substrate, (2) growing an intermediate buffer layer of In x Al 1-x N on the sapphire substrate, and (3) growing GaN or In x Ga 1-x N system compound semiconductor on the intermediate buffer layer.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A method for growing, a crystal of a GaN system compound semiconductor, comprising the steps of:
(1) providing a sapphire substrate;
(2) growing a superlattice structure of In x Al 1-x N/AlN or In x Al 1-x N/GaN on the sapphire substrate as an intermediate buffer layer; and,
(3) growing a GaN system compound semiconductor of GaN or In x Ga 1-x N on the intermediate buffer layer.
2. A method as claimed in claim 1 , wherein the intermediate buffer layer has a thickness of 10˜10,000 Å.
3. A method as claimed in claim 1 , further comprising the step of forming a protection layer of GaN on the intermediate buffer layer for preventing vaporization of In contained in the intermediate buffer layer before elevating a temperature after the step (2).
4. A method as claimed in claim 1 , wherein the superlattice structure has 1˜300 layered wherein an In x Al 1-x N layer in the superlattice structure has a thickness of 1˜200 Å and the GaN or AlN layer has a thickness of 1˜200 Å.
5. A method as claimed in claim 1 , further comprising a protection layer of GaN grown on the intermediate buffer layer for preventing vaporization of In contained in the intermediate buffer layer before elevating a temperature after the intermediate buffer layer is formed.Cited by (0)
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