US6515048B1ExpiredUtility

Adhesive powder

46
Assignee: FREUDENBERG CARL FAPriority: Dec 7, 1998Filed: Nov 25, 1999Granted: Feb 4, 2003
Est. expiryDec 7, 2018(expired)· nominal 20-yr term from priority
Inventors:Michael KalbeSilke WagenerPeter Grynaeus
C08L 63/00C09J 11/08C09J 5/06C09J 2463/00C09J 9/00C09J 11/04C09J 201/00
46
PatentIndex Score
10
Cited by
8
References
27
Claims

Abstract

An adhesive powder for bonding flat, closed, or porous substrates, the adhesive powder being applied in the first step to a first substrate, an intermediate product that is non-adhesive at room temperature and stable in storage being produced, and the first substrate being bonded to a second substrate in a second step by applying an increased temperature and pressure, as a combination of the following components: i) a thermoplastic polymer having a proportion of 25 to 95% by weight; and ii) at least one epoxy resin that is solid at room temperature and has a proportion of 5 to 75% by weight; and, if desired, iii) at least one pre-adduct of epoxy resins and polyamines that is solid at room temperature and has a proportion of at most 25% by weight, a physical bonding taking place when the adhesive powder is applied to the first substrate in the first step, and the two substrates being bonded in the second step by the powder components being chemically cross-linked or post-cross-linked among one another, and being subsequently cooled.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
       1. An adhesive powder for bonding flat, closed, or porous substrates, comprising: 
       i) a thermoplastic polymer component in a proportion of 25 to 95% by weight; and  
       ii) at least one epoxy resin component that is solid at room temperature in a proportion of 5 to 75% by weight; wherein the adhesive powder is capable of being applied in a first step to a first substrate so as to be physically bonded to the first substrate and thereby produce an intermediate product that is non-adhesive at room temperature and stable in storage, and wherein the first substrate is capable of being bonded to a second substrate in a second step by applying an increased temperature and pressure, the two substrates being bonded in the second step by the powder components being chemically cross-linked or post-cross-linked among one another, and being subsequently cooled.  
     
     
       2. The adhesive powder according to  claim 1 , further comprising: 
       iii) at least one pre-adduct of an epoxy resin and a polyamine that is solid at room temperature in a proportion of up to 25% by weight.  
     
     
       3. The adhesive powder according to  claim 1 , wherein the proportion of the thermoplastic polymer is 50 to 90% by weight, and the proportion of epoxy resin is 10 to 50% by weight. 
     
     
       4. The adhesive powder according to  claim 1 , wherein the thermoplastic polymer is a low-melting polyamide, polyester, polyurethane, or vinyl copolymer having carboxyl-, amino-, amido-, or anhydro-functional side groups. 
     
     
       5. The adhesive powder according to  claim 1 , wherein the thermoplastic polymer is a polymer blend of at least one of low-melting polyamides, polyesters, polyurethanes, or vinyl copolymers having carboxyl-, amino-, amido-, or anhydro-functional side groups. 
     
     
       6. The adhesive powder according to  claim 1 , wherein the polymer component of the powder is made up of linear or branched monomers. 
     
     
       7. The adhesive powder according to  claim 1 , wherein the polymer component includes a polyamide which is formed from at least one of the following monomers: 
       at least one at least difunctional carboxylic acid;  
       at least one at least difunctional amine;  
       at least one ω-amino carboxylic acid;  
       at least one lactam.  
     
     
       8. The adhesive powder according to  claim 1 , wherein the polymer component includes a polyester which is formed from at least one of the following monomers: 
       at least one at least difunctional carboxylic acid;  
       at least one at least difunctional alcohol;  
       at least one ω-hydroxycarboxylic acid;  
       at least one lactone.  
     
     
       9. The adhesive powder according to  claim 1 , wherein the polymer component includes a polyurethane which is made up of diisocyanates, polyols, and diols. 
     
     
       10. The adhesive powder according to  claim 1 , wherein the epoxy resin that is solid at room temperature has a reaction product of epichlorohydrine with bisphenol A, or a reaction product of epichlorohydrine with bisphenol F, or a reaction product of epichlorohydrine with novolak. 
     
     
       11. The adhesive powder according to  claim 1 , wherein the epoxy resin that is solid at room temperature has polyfunctional epoxides. 
     
     
       12. The adhesive powder according to  claim 2 , wherein the pre-adduct of epoxy resins and polyamines that is solid at room temperature has a reaction product of an epoxy resin based on bisphenol A and a polyamine, or a reaction product of an epoxide resin based on bisphenol F and a polyamine. 
     
     
       13. The adhesive powder according to  claim 2 , wherein the pre-adduct that is solid at room temperature is made of epoxy resins and polyaminoamides including polyamines and dimerous fatty acids. 
     
     
       14. The adhesive powder according to  claim 1 , wherein the adhesive powder is mixed with at least one additional additive. 
     
     
       15. The adhesive powder according to  claim 14 , wherein the additional additive is a low-melting resin or wax having a melting point under 100° C., a dye, a mineral filler, or an organic filler. 
     
     
       16. The adhesive powder according to  claim 15 , wherein the additional additives are present in a proportion up to 10% by weight. 
     
     
       17. The adhesive powder according to  claim 14 , wherein the at least one additional additive is a metallic filler. 
     
     
       18. The adhesive powder according to  claim 1 , wherein the thermoplastic polymer or the epoxy resin has a first melting point that is different from that of the other components of the powder and is under 130° C., and has a softening point between 50 and 90° C. 
     
     
       19. The adhesive powder according to  claim 1 , wherein the thermoplastic polymer or the epoxy resin has a first melting point that is different from that of the other components of the powder and is under 100° C., and has a softening point between 50 and 90° C. 
     
     
       20. The adhesive powder according to  claim 18 , wherein said other components of the powder has a higher, second melting point under 130° C. 
     
     
       21. The adhesive powder according to  claim 18 , wherein said other components of the powder has a higher, second melting point under 100° C. 
     
     
       22. The adhesive powder according to  claim 14 , wherein the adhesive powder is fixed to the first substrate at the first increased temperature by melting the additives. 
     
     
       23. The adhesive powder according to  claim 1 , wherein chemical cross-linking is initiated at a second temperature during bonding to the second substrate by hot-pressing. 
     
     
       24. The adhesive powder according to  claim 1 , wherein the particle size of the adhesive powder is less than 200 μm. 
     
     
       25. The adhesive powder according to  claim 1 , wherein the particle size of the adhesive powder is less than 100 μm. 
     
     
       26. The adhesive powder according to  claim 1 , wherein the second substrate is also provided with the adhesive powder in a first step. 
     
     
       27. The adhesive powder according to  claim 1 , wherein the powder is capable of being heated in a high-frequency field.

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