High availability energy

Abstract

A rack system for mounting electronic devices such as computers or telecommunication devices is disclosed. The rack includes an integrated liquid heat exchange cooling system for dissipating the heat generated by the electronic devices. The rack also includes integrated alternating current and direct current power supplies for supplying power to the electronic devices. The entire system is of modular construction, providing both scalability and redundancy.

What is claimed is:  
     
       1. An apparatus for providing support, cooling and power to electronic devices comprising: 
       a rack;  
       a fluid cooling system integral with said rack connected to an external cooling system and comprising fluid paths delivering cooling fluid to the electronic devices; and  
       a power supply system integral with said rack, the power supply system connected to an external power supply and comprising electrical circuits delivering power to the electronic devices.  
     
     
       2. The apparatus of  claim 1  wherein said fluid cooling system comprises a plurality of redundant fluid paths. 
     
     
       3. The apparatus of  claim 1  wherein said power supply system comprises a plurality of redundant electrical circuits. 
     
     
       4. The apparatus of  claim 2  wherein said power supply system comprises a plurality of redundant power supply circuits. 
     
     
       5. The apparatus of  claim 3  wherein said power supply system comprises both AC and DC circuits. 
     
     
       6. The apparatus of  claim 4  wherein said power supply system comprises both AC and DC circuits. 
     
     
       7. The apparatus of  claim 1  wherein the external cooling system comprises a plurality of redundant chiller circuits. 
     
     
       8. The apparatus of  claim 1  wherein the external power supply system comprises a plurality of redundant power supplies. 
     
     
       9. The apparatus of  claim 8  wherein the plurality of redundant power supplies includes AC and DC power supplies. 
     
     
       10. The apparatus of  claim 7  wherein the external power supply system comprises a plurality of redundant power supplies. 
     
     
       11. The apparatus of  claim 10  wherein the plurality of redundant power supplies includes AC and DC power supplies. 
     
     
       12. The apparatus of  claim 1  further comprising a quick connect mechanism for connecting the electronic device to the fluid cooling system and the power supply system, the quick connect device comprising first and second fluid source connectors, first and second fluid return connectors, first and second AC power connectors, and first and second DC power connectors. 
     
     
       13. An apparatus for providing power and cooling to electronic devices comprising: 
       means for mounting the electronic devices;  
       means for providing heat removal from the electronic devices integral with the means for mounting;  
       means for providing power to the electronic devices integral with the means for mounting.  
     
     
       14. The apparatus of  claim 13  wherein the means for providing heat removal comprises a plurality of redundant heat removal means. 
     
     
       15. The apparatus of  claim 13  wherein the means for providing power comprises a plurality of redundant power supply means. 
     
     
       16. A method of providing support, cooling and power to electronic devices comprising the steps of: 
       providing a support structure for the electronic devices;  
       delivering cooling fluid through a plurality of redundant cooling fluid paths integral with the support structure, the cooling fluid paths connecting the electronic devices to an external source of cooling fluid; and  
       delivering power through a plurality of redundant power supply circuits integral with the support structure, the power supply circuits connecting the electronic devices to an external source of power.  
     
     
       17. An apparatus for providing support, cooling and power to electronic devices comprising: 
       an energy platform, the energy platform providing connection to redundant cooling and power sources and providing physical support for a plurality of rack structures;  
       a plurality of racks;  
       a fluid cooling system integral with each rack connected to an external cooling system and comprising fluid paths delivering cooling fluid to the electronic devices; and  
       a power supply system integral with rack, the power supply system connected to an external power supply and comprising electrical circuits delivering power to the electronic devices.  
     
     
       18. The apparatus of  claim 17  wherein the energy platform further comprises piping for a plurality of redundant cooling circuits. 
     
     
       19. The apparatus of  claim 17  wherein the energy platform further comprises a plurality of busses for redundant AC and DC power sources. 
     
     
       20. The apparatus of  claim 18  wherein the energy platform further comprises a plurality of bussses for redundant AC and DC power sources.