Semiconductor device and manufacturing method of semiconductor device

Abstract

A substrate of a semiconductor device has a first surface on which a semiconductor element is fixed and a second surface opposite to the first surface. An adhesive is provided between the semiconductor element and the first surface of the substrate. At least one though hole is formed which extends between the first surface and the second surface of the substrate. A pattern member is formed on the first surface of the substrate so as to cover a part of an opening of the through hole.

What is claimed is:  
     
       1. A semiconductor device comprising: 
       a semiconductor element;  
       a substrate having a first surface on which the semiconductor element is fixed and a second surface opposite to the first surface;  
       an adhesive provided between said semiconductor element and said first surface of said substrate;  
       at least one though hole extending between said first surface and said second surface of said substrate; and  
       a pattern member formed on said first surface of said substrate so as to cover a part but not the whole of an opening of said through hole.  
     
     
       2. The semiconductor device as claimed in  claim 1 , wherein said pattern member is formed of the same material as electrode pads formed on said first surface of said substrate. 
     
     
       3. The semiconductor device as claimed in  claim 1 , wherein said pattern member is a circuit pattern formed on said first surface of said substrate. 
     
     
       4. The semiconductor device as claimed in  claim 1 , wherein said substrate is an organic substrate formed of an organic material.