Open top IC socket

Abstract

An open top IC socket according to the present invention includes a plurality of IC package mounting units each including a socket body that includes a plurality of pairs of contact sections into which terminals of an IC package are inserted and each of which is able to open and close, and each further including a slide block slidably overlapped on the socket body for opening and closing the contact sections, a socket base for containing and holding the IC package mounting units in an aligned state, a coupling member for mutually coupling the individual slide blocks of the IC package mounting units, and a block operation element mounted on the socket base for sliding the individual slide blocks in the direction of sliding of the slide blocks. According to the present invention, the mounting and detaching of the plurality of the IC packages can be achieved simultaneously.

What is claimed is:  
     
       1. An open top IC socket comprising: 
       a plurality of IC package mounting units each including a socket body that includes a plurality of pairs of contact sections into which terminals of an IC package are inserted and each of which is able to open and close, and each further including a slide block slidably overlapped on the socket body for opening and closing the plurality of pairs of the contact sections;  
       a socket base for containing and holding said IC package mounting units in an aligned state;  
       a coupling member for mutually coupling the individual slide blocks of said IC package mounting units; and  
       block operation means mounted on said socket base for sliding the individual slide blocks in the direction of sliding of the slide blocks.  
     
     
       2. An open top IC socket as claimed in  claim 1 , wherein said socket base includes a plurality of engaging means engaged with the individual socket bodies of said IC package mounting units for locking the socket bodies to said socket base. 
     
     
       3. An open top IC socket as claimed in  claim 2 , wherein said plurality of engaging means include a resiliently deformable locking pawl. 
     
     
       4. An open top IC socket as claimed in  claim 1 , wherein said coupling member is slidably mounted on said socket base in parallel to the direction of the sliding of the slide block. 
     
     
       5. An open top IC socket as claimed in  claim 2 , wherein said coupling member is slidably mounted on said socket base in parallel to the direction of the sliding of the slide block. 
     
     
       6. An open top IC socket as claimed in  claim 3 , wherein said coupling member is slidably mounted on said socket base in parallel to the direction of the sliding of the slide block. 
     
     
       7. An open top IC socket as claimed in  claim 1 , wherein said block operation member includes an operation lever which is mounted on said socket base and to which said coupling member is coupled. 
     
     
       8. An open top IC socket as claimed in  claim 2 , wherein said block operation member includes an operation lever which is mounted on said socket base and to which said coupling member is coupled. 
     
     
       9. An open top IC socket as claimed in  claim 3 , wherein said block operation member includes an operation lever which is mounted on said socket base and to which said coupling member is coupled. 
     
     
       10. An open top IC socket as claimed in  claim 1 , wherein the each socket body of said IC package mounting units further includes a plurality of terminals each of which is protruded from the socket body and is conductive with the plurality of pairs of the contacts. 
     
     
       11. An open top IC socket as claimed in  claim 2 , wherein the each socket body of said IC package mounting units further includes a plurality of terminals each of which is protruded from the socket body and is conductive with the plurality of pairs of the contacts. 
     
     
       12. An open top IC socket as claimed in  claim 3 , wherein the each socket body of said IC package mounting units further includes a plurality of terminals each of which is protruded from the socket body and is conductive with the plurality of pairs of the contacts. 
     
     
       13. An open top IC socket as claimed in  claim 10 , wherein the plurality of the terminals are inserted into the plurality of pairs of contacts formed on an inspection board for inspecting an IC package. 
     
     
       14. An open top IC socket as claimed in  claim 11 , wherein the plurality of the terminals are inserted into the plurality of pairs of contacts formed on an inspection board for inspecting an IC package. 
     
     
       15. An open top IC socket as claimed in  claim 12 , wherein the plurality of the terminals are inserted into the plurality of pairs of contacts formed on an inspection board for inspecting an IC package.