Method and apparatus for shielding a device from a semiconductor wafer process chamber

Abstract

A method and apparatus for shielding a device, such as a pump, from a process chamber of a semiconductor wafer processing system. The apparatus comprises a shield connected to a mounting portion. The mounting portion has a fluid passage wherein the temperature of the apparatus is regulated by flowing fluid through the passage.

What is claimed is:  
     
       1. Apparatus for shielding a device from a process chamber environment of a semiconductor wafer processing system, comprising: 
       a shield;  
       a thermally conductive support member attached to said shield, extending perpendicularly away from said shield; and  
       an annular mounting portion attached at its center to said support member, said annular mounting portion further comprising a circumferential fluid passage disposed therein.  
     
     
       2. The apparatus of  claim 1  further comprising: 
       a cross member extending radially inward from the annular mounting portion and coupled to said support member.  
     
     
       3. The apparatus of  claim 2  wherein said cross member and said support member are copper. 
     
     
       4. The apparatus of  claim 1  wherein said shield is copper. 
     
     
       5. The apparatus of  claim 1  wherein said shield has a thermally reflective finish. 
     
     
       6. The apparatus of  claim 1  wherein said shield is metal plated. 
     
     
       7. The apparatus of  claim 1  wherein said shield is plated with a material selected from the group consisting of nickel, gold and silver. 
     
     
       8. The apparatus of  claim 1  wherein said mounting portion further comprises: 
       a first sealing surface disposed on a first face of said mounting portion; and,  
       a second sealing surface disposed on a second face of said mounting portion, wherein said first and said second sealing surfaces are disposed radially inwards of said fluid passages.  
     
     
       9. The apparatus of  claim 8  wherein said mounting portion is copper. 
     
     
       10. The apparatus of  claim 8  wherein said first and said second sealing surfaces are stainless steel, each sealing surface further comprising a knife edge. 
     
     
       11. The apparatus of  claim 1  wherein said circumferential fluid passage further comprises: 
       a channel disposed in a face of said mounting portion; and,  
       a plug disposed in said channel flush with said face.  
     
     
       12. The apparatus of  claim 1 , wherein said process chamber further comprises: 
       a port, where is mounting portion is affixed to said port and said shield is positioned proximate said port.  
     
     
       13. The apparatus of  claim 12  further comprising: 
       a cryo pump in communication with said chamber through said port.  
     
     
       14. Apparatus for shielding a device from a process chamber of a semiconductor wafer processing system, comprising: 
       a shield disposed within said process chamber;  
       a thermally conductive support member attached to sad shield, extending perpendicularly away from said shield; and  
       a mounting portion disposed outside said process chamber, connected to said shield, said mounting portion having sealing surfaces and a circumferential, internal fluid passage, said sealing surfaces disposed radially inwards of said fluid passage.  
     
     
       15. The apparatus of  claim 14  further comprising: 
       a cross member coupled to said mounting portion; and,  
       a support rod coupled to said shield.  
     
     
       16. The apparatus of  claim 14  wherein said shield is copper. 
     
     
       17. The apparatus of  claim 14  wherein said shield has a thermally reflective finish. 
     
     
       18. The apparatus of  claim 14  wherein said shield is metal plated. 
     
     
       19. The apparatus of  claim 14  wherein said shield is plated with a material selected from the group consisting of nickel, gold and silver. 
     
     
       20. The apparatus of  claim 14 , wherein said process chamber further comprises: 
       a port, where is mounting portion is affixed to said port and said shield is positioned proximate said port.  
     
     
       21. The apparatus of  claim 14  further comprising: 
       a cryo pump in communication with said chamber through said port.  
     
     
       22. Apparatus for shielding a device from a process chamber within a semiconductor wafer processing system, comprising: 
       a chamber having a port;  
       a cryo pump coupled to said port;  
       a pedestal disposed within said chamber;  
       a thermally reflective shield disposed within said chamber between said pedestal and said port; and  
       a mounting portion, disposed between said port and said cryo pump, said mounting portion connected to said shield and having a fluid passage external to the process chamber positioned radially outwards of a sealing surface of said mounting portion.