Electronic component mounting method and mounting apparatus

Abstract

The substrate recognition time is shortened, and the productivity is enhanced. This is an electronic component mounting method for mounting a plurality of electronic components on a substrate by using a plurality of moving tables. Each moving table of the plurality of moving tables has a mounting head for picking up and transferring each electronic component, and a camera for recognizing the substrate. The mounting method includes the steps of (a) taking a calibration substrate having a reference mark for position calibration by the camera, and obtaining a position calibration data intrinsic to each moving table having the camera, (b) taking the substrate by only one of the cameras prior to mounting of each electronic component, and recognizing the position of the substrate, and (c) picking up each electronic component by each mounting head, and mounting the electronic component on the substrate. The step of mounting each electronic component on the substrate includes a step of controlling the position of the moving table on the basis of the substrate position recognition result and the position calibration data.

What is claimed is:  
     
       1. An electronic component mounting method comprising the steps of: 
       (a) preparing a base, and a first moving table and a second moving table installed on said base,  
       wherein said first moving table and said second moving table are movable on said base,  
       said first moving table has a first mounting head and a first camera,  
       said second moving table has a second mounting head and a second camera, and  
       said first mounting head and said second mounting head pick up and transfer a plurality of electronic components,  
       (b) acquiring position calibration data intrinsic to each moving table of said first moving table and said second moving table based on reference marks on a calibration substrate and based on reference position recognition mark on said base,  
       (c) conveying a substrate onto said base,  
       (d) recognizing a position of said substrate by at least one camera or said first camera and said second camera, and acquiring position recognition data,  
       (e) controlling a position of said first moving table and said second moving table on the basis of said position calibration data and said position recognition data, and  
       (f) picking up said plurality of electronic components by said first mounting head and said second mounting head, and mounting on said substrate.  
     
     
       2. The electronic component mounting method of  claim 1 , wherein said step of acquiring said position recognition data is a step of recognizing the position of said substrate by only one camera of said first camera and second camera. 
     
     
       3. The electronic component mounting method of  claim 1 , wherein said step of acquiring said position calibration data includes the steps of: 
       (1) mounting said calibration substrate having reference marks onto said base, and  
       (2) taking said reference marks by at least one camera of said first camera and said second camera, and acquiring said position calibration data for calibrating a position deviation.  
     
     
       4. The electronic component mounting method of  claim 3 , 
       wherein said reference mark has a plurality of reference marks, and  
       said step of acquiring said position calibration data includes a step of taking all of said plurality of reference marks by said first camera, and recognizing the position deviation of each reference mark of the plurality of reference marks.  
     
     
       5. The electronic component mounting method of  claim 1 , 
       wherein said step of acquiring said position recognition data includes a step of moving said first moving table, and recognizing a position of the recognition mark set on said substrate by said first camera.  
     
     
       6. The electronic component mounting method of  claim 5 , 
       wherein said recognition mark has a plurality of recognition marks, and  
       said first camera recognizes each recognition mark of said plurality of recognition marks sequentially.  
     
     
       7. The electronic component mounting method of  claim 1 , 
       wherein said step of acquiring said position recognition data includes a step of acquiring said position recognition data by moving said first moving table, and recognizing the position of the recognition mark set on said substrate by said first camera, and  
       said step of mounting said plurality of electronic components on the substrate includes a step of mounting the electronic component on the substrate by said first mounting head, on the basis of said position calibration data and said position recognition data of the first moving table, and a step of mounting the electronic component on the substrate by said second mounting head, on the basis of the same position recognition data as the position calibration data and said position recognition data of said second moving table.  
     
     
       8. The electronic component mounting method of  claim 1 , wherein said step of acquiring said position calibration data includes the steps of: 
       (1) acquiring said position calibration data for calibrating the position deviation, by mounting a calibration substrate having a reference mark on said base, and taking said reference mark by at least one camera of said first camera and said second camera, and  
       (2) acquiring a further position calibration data for correcting position deviation due to temperature changes of said first moving table and second moving table, by taking a reference position recognition mark set on said base by at least one camera of said first camera and second camera.  
     
     
       9. The electronic component mounting method of  claim 1 , 
       wherein said first moving table is movable in the X-axis and Y-axis direction, and  
       said second table is movable in said X-axis and Y-axis direction.  
     
     
       10. An electronic component mounting method for mounting a plurality of electronic components on a substrate by using a plurality of moving tables, said plurality of moving tables installed on a base, each moving table of said plurality of moving tables including a mounting head for picking up and transferring each electronic component; and a camera for recognizing said substrate, 
       said mounting method comprising the steps of:  
       (a) taking an image of a calibration substrate having a reference mark for position calibration by said camera, and obtaining position calibration data intrinsic to said each one of moving tables having the camera,  
       (b) taking an image of a said substrate by only one of said cameras prior to mounting of said each one of electronic components, and recognizing a position of said substrate, and  
       (c) picking up said each one of electronic components by said each one of mounting heads, and mounting the electronic component on said substrate,  
       wherein said step of mounting each electronic component on the substrate induces a step of controlling the position of said moving table on the basis of said substrate position recognition result and said position calibration data, said position calibration data based on said calibration substrate having said reference mark and based on reference position recognition mark on said base.  
     
     
       11. An electronic component mounting apparatus comprising: 
       (a) a base,  
       (b) a first moving table and a second moving table installed on said base,  
       wherein said first moving table and second moving table are movable on said base,  
       said first moving table has a first mounting head and a first camera,  
       said second moving table has a second mounting head and a second camera, and  
       said first mounting head and said second mounting head have a function of picking up and transferring a plurality of electronic components,  
       (c) a position calibration data acquisition unit for recognizing a position of said first moving table and said second moving table, and calibrating a position of said first moving table and said second moving table based on reference marks on a calibration substrate and based on reference position recognition mark on said base,  
       (d) a position recognition unit for recognizing the position of a substrate mounted on said base,  
       wherein said position recognition unit is recognized when taken by said first camera only,  
       (e) a control unit for controlling the position of said first moving table and said second moving table on the basis of said position recognition unit and said position calibration data acquisition unit, and  
       (f) a drive control unit for driving said first moving table, said second moving table, said first mounting head and said second mounting head.  
     
     
       12. The electronic component mounting apparatus of  claim 11 , 
       wherein said position calibration data acquisition unit has a calibration substrate to be mounted on said base,  
       said calibration substrate has a reference mark, and  
       said first camera and said second camera recognize said reference mark.  
     
     
       13. The electronic component mounting apparatus of  claim 11 , 
       wherein said position calibration data acquisition unit has a reference position recognition mark set on said base, and a calibration substrate to be mounted on the base,  
       said calibration substrate has a reference mark,  
       said first camera and said second camera recognize said reference mark, and  
       at least one camera of said first camera and second camera takes said reference position recognition mark, thereby obtaining a further position calibration data for correcting the position deviation due to temperature changes of said first moving table and said second moving table.