Magnetic head apparatus with IC chip mounted on suspension for increased heat diffusion and magnetic disk apparatus having magnetic head apparatus

Abstract

A magnetic head apparatus including a magnetic head slider having at least one thin film magnetic head element, a suspension mounting the magnetic head slider on one face thereof, an IC chip mounted with a circuit for the thin film magnetic head element and a support arm fixedly supporting the suspension in which the IC chip is mounted on the one face of the suspension and is thermally coupled to the support arm.

What is claimed is:  
     
       1. A magnetic head apparatus comprising: 
       a magnetic head slider having at least one thin film magnetic head element;  
       a suspension mounting the magnetic head slider on one face of the suspension;  
       an IC chip mounted with a circuit to drive the thin film magnetic head element; and  
       a support arm configured to rigidly support a first section of the suspension such that a second section of the suspension extends beyond the support arm,  
       wherein the IC chip is mounted on the one face of the suspension in a substantially co-planar orientation with the support arm and is thermally coupled to the support arm.  
     
     
       2. The magnetic head apparatus according to  claim 1 , 
       wherein the IC chip is mounted to the first section of the suspension supported by the support arm,  
       wherein the support arm is brought into contact with another face of the suspension at a section of the suspension mounted with the IC chip.  
     
     
       3. The magnetic head apparatus according to  claim 1 , 
       wherein the IC chip is mounted to the first section of the suspension supported by the support arm,  
       wherein the support arm and the IC chip are thermally coupled directly via a member having a high heat conductivity.  
     
     
       4. The magnetic head apparatus according to  claim 3 , 
       wherein the member having the high heat conductivity is brought into contact with a face of the suspension on a side opposed to another face of the suspension for mounting the IC chip.  
     
     
       5. The magnetic head apparatus according to  claim 1   
       wherein the suspension comprises a metal material including a material having a high heat conductivity.  
     
     
       6. The magnetic head apparatus according to  claim 1 , 
       wherein the suspension includes a laminated material layer having a high heat conductivity on a metal member.  
     
     
       7. The magnetic head apparatus according to  claim 1 , 
       wherein the IC chip is mounted to the first section of the suspension supported by the support arms,  
       wherein the support arm and the IC chip are thermally coupled via a through port included at a spring member of the suspension.  
     
     
       8. The magnetic head apparatus according to  claim 7 , 
       wherein the support arm and the IC chip are thermally coupled via only an insulation layer of the suspension.  
     
     
       9. A magnetic disk apparatus comprising a magnetic head apparatus, the magnetic head apparatus including: 
       a magnetic head slider having at least one thin film magnetic head element;  
       a suspension mounting the magnetic head slider on one face of the suspension;  
       an IC chip mounted with a circuit to drive the thin film magnetic head element; and  
       a support arm configured to rigidly support a first section of the suspension such that a second section of the suspension extends beyond the support arm,  
       wherein the IC chip is mounted on the one face of the suspension in a substantially co-planar orientation with the support arm and is thermally coupled to the support arm.