Heat-resistant engineering plastic resin composition and molded article obtained therefrom

Abstract

A heat-resistant engineering-plastic composition that satisfies a soldering-heat resistance of 260° C. for 10 to 60 secs., that is less costly, that is free of problems in injection molding process, and that is excellent in heat-aging resistance. A heat-resistant molded product made with the heat-resistant engineering-plastic composition, such as a connector mounted on printed circuit board. The heat-resistant molded product is produced by (a) melt-kneading (a1) an engineering plastic either having or introduced an active site for reacting with a specific functional group and (a2) either an organic compound that has both the said specific functional group and a polymerizing functional group in the same molecule or polyolefin that has the said specific functional group described in (a1) to obtain a resin composition, (b) melt-molding the resin composition comprising of (a), and (c) irradiating the melt-molded resin composition with ionizing radiation.

What is claimed is:  
     
       1. A heat-resistant molded product capable of withstanding a soldering operation at 260° C. for 60 seconds, the heat-resistant molded product being produced by the following steps: 
       (a) melt-kneading:  
       (a1) an engineering plastic (P) either having or introduced an active site for reacting with a specific functional group; and  
       (a2) polyolefin (Q) having the said specific functional group; to obtain a resin composition (R)  
       (b) melt-molding resin composition (R); and  
       (c) irradiating the melt-molded resin composition with ionizing radiation.  
     
     
       2. A heat-resistant molded product capable of withstanding a soldering operation at 260° C. for 60 seconds, the heat-resistant molded product being produced by the following steps: 
       (a) melt-kneading:  
       (a1) an engineering plastic (P) either having or introduced an active site for reacting with a specific functional group; and  
       (a2) an organic compound (S) that has both the said specific functional group and a polymerizing functional group in the same molecule; to obtain a resin composition (T)  
       (b) melt-molding a resin composition (T); and  
       (c) irradiating the melt-molded resin composition with ionizing radiation.  
     
     
       3. A heat-resistant molded product capable of withstanding a soldering operation at 260° C. for 60 seconds, the heat-resistant molded product being produced by the following steps: 
       (a) melt-kneading:  
       (a1) a maleic anhydride group introduced styrene based polymer; and  
       (a2) an organic compound that has in the same molecule:  
       (a2a) a polymerizing functional group selected from the groups consisting of vinyl group, allyl group, acrylic group, and methacrylic group; and  
       (a2b) a functional group selected from the groups consisting of amino group and epoxy group;  
       (b) melt-molding a resin composition produced by step (a); and  
       (c) irradiating the melt-molded resin composition with ionizing radiation.  
     
     
       4. A heat-resistant molded product capable of withstanding a soldering operation at 260° C. for 60 seconds, the heat-resistant molded product being produced by the following steps: 
       (a) melt-kneading:  
       (a1) an oxazoline group introduced styrene based polymer; and  
       (a2) an organic compound that has in the same molecule:  
       (a2a) a polymerizing functional group selected from the groups consisting of vinyl group, allyl group, acrylic group, and methacrylic group; and  
       (a2b) a functional group selected from the groups consisting of amino group, carboxylic acid group, hydroxyl group, epoxy group, and thiol group;  
       (b) melt-molding a resin composition produced by step (a); and  
       (c) irradiating the melt-molded resin composition with ionizing radiation.  
     
     
       5. A heat-resistant molded product capable of withstanding a soldering operation at 260° C. for 60 seconds, the heat-resistant molded product being produced by the following steps: 
       (a) melt-kneading:  
       (a1) a carboxyl acid group introduced styrene based polymer; and  
       (a2) an organic compound that has in the same molecule:  
       (a2a) a polymerizing functional group selected from the groups consisting of vinyl group, allyl group, acrylic group, and methacrylic group; and  
       (a2b) a functional group selected from the groups consisting of amino group, epoxy group, hydroxyl group, and thiol group;  
       (b) melt-molding a resin composition produced by step (a); and;  
       (c) irradiating the melt-molded resin composition with ionizing radiation.  
     
     
       6. A heat-resistant molded product capable of withstanding a soldering operation at 260° C. for 60 seconds, the heat-resistant molded product being produced by the following steps: 
       (a) melt-kneading:  
       (a1) polyphenylene ether having a maleic anhydride group; and  
       (a2) an organic compound that has in the same molecule:  
       (a2a) a polymerizing functional group selected from the groups consisting of vinyl group, allyl group, acrylic group, and methacrylic group; and  
       (a2b) a functional group selected from the groups consisting of amino group and epoxy group;  
       (b) melt-molding a resin composition produced by step (a); and;  
       (c) irradiating the melt-molded resin composition with ionizing radiation.  
     
     
       7. A heat-resistant molded product capable of withstanding a soldering operation at 260° C. for 60 seconds, the heat-resistant molded product being produced by the following steps: 
       (a) melt-kneading:  
       (a1) polybutyleneterephthalate; and  
       (a2) an organic compound that has in the same molecule:  
       (a2a) a polymerizing functional group selected from the groups consisting of vinyl group, allyl group, acrylic group, and methacrylic group; and  
       (a2b) a functional group selected from the groups consisting of amino group, hydroxyl group, epoxy group, and carboxylic acid group;  
       (b) melt-molding a resin composition produced by step (a); and;  
       (c) irradiating the melt-molded resin composition with ionizing radiation.  
     
     
       8. A heat-resistant molded product capable of withstanding a soldering operation at 260° C. for 60 seconds, the heat-resistant molded product being produced by the following steps: 
       (a) melt-kneading:  
       (a1) polyamide resin; and  
       (a2) au organic compound that has in the same molecule:  
       (a2a) a polymerizing functional group selected from the groups consisting of vinyl group, allyl group, acrylic group, and methacrylic group; and  
       (a2b) an atomic group having a functional group selected from the groups consisting of epoxy group and carboxylic acid group;  
       (b) melt-molding a resize composition produced by step (a); and;  
       (c) irradiating he melt-molded resin composition with ionizing radiation.  
     
     
       9. A heat-resistant molded product capable of withstanding a soldering operation at 260° C. for 60 seconds, the heat-resistant molded product being produced by the following steps: 
       (a) melt-kneading:  
       (a1) polyphenylene ether having a maleic anhydride group; and  
       (a2) an organic compound that has in the same molecule:  
       (a2a) a polymerizing functional group selected from the groups consisting of vinyl group, allyl group, acrylic group, and methacrylic group; and  
       (a2b) a functional group selected from the groups consisting of amino group and epoxy group; to obtain a resin composition (A);  
       (b) melt-kneading:  
       (b1) polybutyleneterephthalate; and  
       (b2) an organic compound that has in the same molecule:  
       (b2a) a polymerizing fictional group selected from the groups consisting of vinyl group, allyl group, acrylic group, and methacrylic group; and  
       (b2b) a functional group selected from the groups consisting of amino group, hydroxyl group, epoxy group, and carboxylic acid group; to obtain resin composition (B); and  
       (c) melt-kneading a resin composition (A) and a resin composition (B) to produce a polymer alloy resin composition; and  
       (d) melt-molding a polymer alloy of the resin composition (A) and the resin composition (B); and  
       (e) irradiating the melt-molded resin composition with ionizing radiation.  
     
     
       10. A heat-resistant molded product capable of withstanding a soldering operation at 260° C. for 60 seconds, the heat-resistant molded product being produced by the following steps: 
       (a) melt-kneading:  
       (a1) polyamide resin; and  
       (a2) an organic compound that has in the same molecule:  
       (a2a) a polymerizing functional group selected from the groups consisting of vinyl group, allyl group, acrylic group, methacrylic group; and  
       (a2b) an atomic group having a functional group selected from the groups consisting of epoxy group and carboxylic acid group; to obtain a resin composition (C);  
       (b) melt-kneading a resin composition (C) and a resin composition (A) as defined in  claim 9  to produce a polymer alloy resin composition; and  
       (c) melt-molding a polymer alloy of the resin composition (C) and the resin composition (A); and  
       (d) irradiating the melt-molded resin composition with ionizing radiation.  
     
     
       11. The heat-resistant molded product as defined in  claim 1 , wherein the engineering plastic (P) is polybutyleneterephthalate. 
     
     
       12. The heat-resistant molded product as defined in  claim 1 , wherein the engineering plastic (P) is polyamide resin. 
     
     
       13. At The heat-resistant molded product as defined in  claim 1 , wherein the polyolefin (Q) is polyolefin having graft-polymerized or copolymerized maleic anhydride, glycidylmethacrylate, acrylic acid, or methacrylic acid. 
     
     
       14. A heat-resistant molded product capable of withstanding a soldering operation at 260° C. for 60 seconds, the heat-resistant molded product being produced by the following steps: 
       (a) melt-kneading:  
       (a1) polyphenylene ether having maleic anhydride group; and  
       (a2) polyolefin having graft-polymerized or copolymerized maleic anhydride, glycidylmethacrylate, acrylic acid, or methacrylic acid; to obtain a resin composition (D); and  
       (b) melt-kneading:  
       (b1) polybutyleneterephthalate; and  
       (b2) polyolefin having graft-polymerized or copolymerized maleic anhydride, glycidylmethacrylate, acrylic acid, or methacrylic acid; to obtain a resin composition (E); and  
       (c) melt-kneading a resin composition (D) and a resin composition (E); and  
       (d) melt-molding a polymer alloy of the resin composition (D) and the resin composition (E); and  
       (e) irradiating the melt-molded resin composition with ionizing radiation.  
     
     
       15. A heat-resistant molded product capable of withstanding a soldering operation at 260° C. for 60 seconds, the heat-resistant molded product being produced by the following steps: 
       (a) melt-kneading:  
       (a1) polyamide resin; and  
       (a2) polyolefin having graft-polymerized or copolymerized maleic anhydride, glycidylmethacrylate, acrylic acid, or methacrylic acid; to obtain a resin composition (F); and  
       (b) melt-kneading a resin composition (F) and a resin composition (D) as defined in  claim 14  to produce a polymer alloy comprising a resin composition (F) and a resin composition (D); and,  
       (c) melt-molding a polymer alloy comprising a resin composition (F) and a resin composition (D); and,  
       (d) irradiating the melt-molded resin composition with ionizing radiation.