Plural semiconductor devices bonded onto one face of a single circuit board for subsequent batch resin encapsulation of the plural semiconductor devices in a single cavity formed by molding dies

Abstract

The present invention provides a resin-molding method comprising the steps of: placing a circuit base member onto a mounting face of first one of paired dies, wherein a back face of the circuit base member is in contact with the mounting face; placing the paired dies in a closing state for clamping a peripheral region of the circuit base member with the paired dies; and injecting a molten resin into a cavity of the paired dies for filling the cavity with the injected resin, wherein, in the closing state, a first pressure effected to a front face of the circuit base member is set higher in pressure level than a second pressure effected to the back face of the circuit base member, so as to secure the circuit base member to the mounting face.

What is claimed is:  
     
       1. A resin-molding method comprising the steps of: 
       placing a circuit base member onto a mounting face of first one of paired dies, wherein a back face of said circuit base member is in contact with said mounting face;  
       placing said paired dies in a closing state for clamping a peripheral region of said circuit base member with said paired dies;  
       injecting a molten resin into a cavity of said paired dies for filling said cavity with said injected resin,  
       wherein, in said closing state, a first pressure effected to a front face of said circuit base member is set higher in pressure level than a second pressure effected to said back face of said circuit base member, so as to secure said circuit base member to said mounting face.  
     
     
       2. The resin-molding method as claimed in  claim 1 , wherein at least a first adsorption hole is formed in said first one of said paired dies for adsorbing said circuit base member onto said mounting face, and at least a second kind of adsorption hole is formed in second one of said paired dies for adsorbing a release film onto said second one of said paired dies. 
     
     
       3. A resin-molding method comprising the steps of: 
       placing a circuit base member onto a mounting face of first one of paired dies, wherein a back face of said circuit base member is in contact with said mounting face;  
       placing said paired dies in a closing state for clamping a peripheral region of said circuit base member with said paired dies;  
       injecting a molten resin into a cavity of said paired dies for filling said cavity with said injected resin,  
       wherein, in said closing state, a first pressure effected to a front face of said circuit base member is set higher in pressure level than a second pressure effected to said back face of said circuit base member, so as to secure said circuit base member to said mounting face,  
       wherein at least a first adsorption hole is formed in said first one of said paired dies for adsorbing said circuit base member onto said mounting face, and at least a second kind of adsorption hole is formed in second one of said paired dies for adsorbing a release film onto said second one of said paired dies, and  
       wherein a pressure level of said first kind of adsorption hole for adsorbing said circuit base member onto said mounting face is lower than a pressure level of said second kind of adsorption hole for adsorbing said release film onto said second one of said paired dies.  
     
     
       4. The resin-molding method as claimed in  claim 2 , wherein a plurality of said first type adsorption hole are formed at least in a peripheral region of said mounting face for absorbing a peripheral region of said circuit base member onto said peripheral region of said mounting face. 
     
     
       5. The resin-molding method as claimed in  claim 4 , wherein said plural first kind of adsorption holes are further formed in a center region of said mounting face surrounded by said peripheral region of said mounting face for absorbing not only said peripheral region but also a center region of said circuit base member onto said mounting face. 
     
     
       6. The resin-molding method as claimed in  claim 5 , wherein said mounting face has a rectangle shape, and said plural first kind of adsorption holes are distributed uniformly and symmetrically with reference to both a longitudinal center axis and a horizontal center axis perpendicular to said longitudinal center axis. 
     
     
       7. The resin-molding method as claimed in  claim 1 , wherein said mounting face is formed on a mounting block which is movable in up and down directions. 
     
     
       8. The resin-molding method as claimed in  claim 1 , wherein said circuit base member comprises a circuit board. 
     
     
       9. The resin-molding method as claimed in  claim 1 , wherein said circuit base member comprises a circuit tape. 
     
     
       10. The resin-molding method as claimed in  claim 1 , wherein said circuit base member is bonded with a plurality of semiconductor devices and said resin-molding method forms a resin-molding package panel including a plurality of resin-molded semiconductor packages. 
     
     
       11. A resin-molding method comprising the steps of: 
       placing a circuit base member onto a mounting face of first one of paired dies, wherein a back face of said circuit base member is in contact with said mounting face;  
       placing said paired dies in a closing state for clamping a peripheral region of said circuit base member with said paired dies:  
       injecting a molten resin into a cavity of said paired dies for filling said cavity with said injected resin,  
       wherein, in said closing state, a first pressure effected to a front face of said circuit base member is set higher in pressure level than a second pressure effected to said back face of said circuit base member, so as to secure said circuit base member to said mounting face, and  
       wherein a high pressure gas is injected into said cavity for securing said circuit base member onto said mounding face.  
     
     
       12. The resin-molding method as claimed in  claim 2 , wherein said back face of said circuit base member has at least an adsorption groove. 
     
     
       13. The resin-molding method as claimed in  claim 12 , wherein said adsorption grooves extend over inter-regions between plural circuit base member units in array. 
     
     
       14. The resin-molding method as claimed in  claim 13 , wherein said adsorption grooves further extend continuously to a peripheral region surrounding said plural circuit base member units in array. 
     
     
       15. The resin-molding method as claimed in  claim 14 , wherein said first kind of adsorption holes are formed in corresponding positions to said adsorption grooves. 
     
     
       16. A resin-molding method comprising the steps of: 
       placing a circuit base member onto a mounting face of first one of paired dies, wherein a back face of said circuit base member is in contact with said mounting face;  
       placing said paired dies in a closing state for clamping a peripheral region of said circuit base member with said paired dies;  
       injecting a molten resin into a cavity of said paired dies for filling said cavity with said injected resin,  
       wherein, in said closing state, a first pressure effected to a front face of said circuit base member is set higher in pressure level than a second pressure effected to said back face of said circuit base member, so as to secure said circuit base member to said mounting face, and  
       wherein said cavity, into which said molten resin is injected, is positioned in a side of said front face of said circuit base member.  
     
     
       17. A resin-molding method, comprising the steps of: 
       placing a circuit base member onto a mounting face of first one of paired dies, wherein a back face of said circuit base member is in contact with said mounting face;  
       placing said paired dies in a closing state for clamping a peripheral region of said circuit base member with said paired dies;  
       injecting a molten resin into a cavity of said paired dies for filling said cavity with said injected resin,  
       wherein, in said closing state, a first pressure effected to a front face of said circuit base member is set higher in pressure level than a second pressure effected to said back face of said circuit base member, so as to secure said circuit base member to said mounting face, and  
       wherein said cavity, into which said molten resin is injected, is positioned in a side of said front face of said circuit base member, and  
       wherein a high pressure gas is injected into said cavity for securing said circuit base member onto said mounding face.