Organic electroluminescence display device and fabricating method of the same

Abstract

An organic electroluminescence display device includes a substrate including an emission region and a non-emission region, a first electrode on the substrate, a buffer layer on the first electrode, the buffer layer corresponding to the non-emission region, a partition wall on the buffer layer, the partition wall including a polymer, a first carrier transporting layer on the substrate including the partition wall, the first carrier transporting layer having a hydrophilic portion corresponding to the emission region and a hydrophobic portion corresponding to the non-emission region, an emissive layer on the first carrier transporting layer, the emissive layer corresponding to the hydrophilic portion, a second carrier transporting layer on the emissive layer, and a second electrode on the second carrier transporting layer.

What is claimed is:  
     
       1. A method of fabricating an organic electroluminescence display device, comprising: 
       forming a first electrode on a substrate including an emission region and a non-emission region;  
       forming a buffer layer on the first electrode, the buffer layer corresponding to the non-emission region;  
       forming a partition wall on the buffer layer, the partition wall including a polymer;  
       forming a first carrier transporting layer on the partition wall, the first carrier transporting layer covering the entire substrate including the partition wall;  
       treating the first carrier transporting layer with an oxygen plasma, thereby the first carrier transporting layer having hydrophilicity;  
       attaching a mold to the first carrier treated with the oxygen plasma, thereby the first carrier transporting layer corresponding to the non-emission region having hydrophobicity;  
       removing the mold from the first carrier transporting layer;  
       forming an emissive layer on the first carrier transporting layer using a coating method, the emissive layer corresponding to the emission region;  
       forming a second carrier transporting layer on the emissive layer; and  
       forming a second electrode on the second carrier transporting layer.  
     
     
       2. The method according to  claim 1 , wherein attaching the mold to the first transporting layer treated with the oxygen plasma is accomplished for about 1 minute to 10 minutes at a temperature within a range of room temperature to about 100 degrees centigrade. 
     
     
       3. The method according to  claim 1 , wherein the mold includes one of polydimethylsiloxane, polyurethane rubber, and elastomer. 
     
     
       4. The method according to  claim 3 , wherein the mold includes polydimethylsiloxane and a hardening agent of about 10 wt. %. 
     
     
       5. The method according to  claim 1 , wherein the first and second electrodes function as an anode and a cathode, respectively. 
     
     
       6. The method according to  claim 5 , wherein the first electrode includes a transparent conductive material. 
     
     
       7. The method according to  claim 5 , wherein the second electrode includes a metallic material having a lower work function than the first electrode. 
     
     
       8. The method according to  claim 1 , wherein the mold has a flat surface contacting the first carrier transporting layer. 
     
     
       9. The method according to  claim 1 , wherein the emissive layer is formed by a coating method using one of a nozzle apparatus and a roller. 
     
     
       10. The method according to  claim 9 , wherein the emissive layer is formed by using a solution including a water-soluble polymer emissive material. 
     
     
       11. The method according to  claim 1 , wherein the first carrier transporting layer includes a hole injection layer and a hole transporting layer. 
     
     
       12. The method according to  claim 11 , wherein the hole transporting layer includes poly(3,4-ethylenedioxythiophene)-poly(styrene sulfonic acid). 
     
     
       13. The method according to  claim 1 , wherein the second carrier transporting layer includes an electron transporting layer and an electron injection layer. 
     
     
       14. The method according to  claim 13 , wherein the second carrier transporting layer covers the entire substrate including the emissive layer. 
     
     
       15. The method according to  claim 1 , wherein the second electrode is formed by a deposition method. 
     
     
       16. The method according to  claim 15 , wherein forming the second electrode includes forming a metal layer on the second carrier transporting layer corresponding to the non-emissive layer, the metal layer disconnected from the second electrode.